New-Tech Europe Magazine | June 2018

June 2018

16 Device Protection, Management and Secured OTA 20 Cadence Debuts Industry’s First Analog IC Design-for- Reliability Solution 22 How Motion Control Defines System Design – The Engineering View 28 Researchers devise new way to make light interact with matter

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June 2018

About New-Tech Magazines Group Read To Lead ‘New-Tech Magazines’ A world leader in publishing high-tech and electronics, producing top quality publications read by tens of thousands professionals from all over the world especially from Europe, innovative electronics, IoT, microwave, homeland security, aerospace, automotive and technological industries. Our specialized target audiences prefer New-Tech Europe because they know that our publications are a reliable source of the latest information in their respective fields. Our multidimensional editorials, news items, interviews and feature articles provide them with a full, well-rounded picture of the markets in which they operate - an essential asset for every technological leader striving to stay ahead, make the right decisions, and generate the next global innovation. Moreover, as an attractive platform for advertisers from around the world, New-Tech Europe has become a hub for bustling international commercial activity. Here, through ads and other promotional materials, Israeli readers obtain crucial information about developers and manufacturers worldwide, finding the tools, instruments, systems and components they need to facilitate their innovative endeavors. Targeting the needs of both the global and european industries and global advertisers, New-Tech Magazines Group constantly expands and upgrades its services. Over the years, the company has been able to formulate a remarkably effective, multi-medium mix of offerings, combining magazine publications with useful online activities, newsletters and special events and exhibitions.

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Contents

10 LATEST NEWS 16 Device Protection, Management and Secured OTA 20 Cadence Debuts Industry’s First Analog IC Design-for- Reliability Solution 22 How Motion Control Defines System Design – The Engineering View 26 Look at 3D chip technology as a way of getting your system to perform better, not as an additional expense 28 Researchers devise new way to make light interact with matter 32 High Power Monolithic Silent Switcher 2 Regulators Meet CISPR 25 Class 5 EMI, Fit Tight Spaces

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36 OUT OF THE BOX 38 NEW PRODUCTS 46 INDEX

22

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New-Tech Magazine Europe l 9

Latest News

Digital all-round: the European research project iDev40 focuses on networking – from the idea and concept to the consumer

The European research project iDev40 (Integrated Development 4.0) is launched under the leadership of Infineon Austria. In this project, 38 partners from six countries will be involved in research on the smart networking of development and production processes for electronic

amounts of data at high speeds. Development and production teams will be networked with each other, independent of their locations, and communicate in real time along the value chain. Processes can be virtually mapped by digital factory and product twins and can thus be simulated comprehensively. Artificial intelligence and machine

components and systems. With a project volume of 47 million euros, iDev40 is among the biggest European research projects with a focus on digitization along the entire value chain and Industry 4.0. Companies are facing the challenge of integrating all their processes in a globally networked, digital value chain. “Those who use the digitization in the right manner will make development, production and logistics faster, more flexible and more cost efficient,” said Jochen Hanebeck, Chief Operations Officer of Infineon Technologies AG. “iDev40 aims at automating highly complex processes through methods of artificial intelligence and to train our employees for the new tasks of the future. Thus, we boost the innovative strength and global competitiveness of the European electronics industry”. “Only by joining our forces, Europe will be a leading innovation and business region with micro- and nano-electronics as key enabling technology for many other innovative industries”, said Sabine Herlitschka, CEO of Infineon Technologies Austria AG. Herlitschka opts for cross-border cooperation in research: “Infineon Austria contributes its know-how to the project as one of the strongest companies in terms of research and pioneer in Industry 4.0 in Austria. Infineon also contributes its experience as the coordinator of large-scale European research projects”. Digital all-round: knowledge, development andproduction The European three-year research project focuses on three areas: secure data and knowledge management along the product life cycle, digital information flow and innovations in the supply chain. Intelligent data management provides secure access to information for people and systems. This makes it possible to deduce information and knowledge from huge

learning play a central role in all of this. An important research aspect of iDev40 is the continued development of jobs of the future, in terms of both new job profiles and the skills that are needed to interact with highly automated, complex systems. Through this project over 15,000 jobs will be secured in the companies involved over the medium to long term. Together with partners along the entire value chain of electronic components and systems this extends to securing work for 50,000 employees globally. Project launch with top-level participants from the whole of Europe Top-level project partners attended the kick-off event of Infineon Austria in Villach. Funding agencies and politics were represented by Max Lemke (Head of Unit “Technologies and Systems for Digitising Industry”, European Commission, Directorate General CONNECT), Bert De Colvenaer (Executive Director ECSEL Joint Undertaking), Michael Wiesmüller (Head of Department of Information, Industrial Technologies and Space Travel of the Austrian Ministry for Transport, Innovation and Technology – BMVIT), and Peter Kaiser (Governor of Carinthia) represented. iDev40 is organized as a private-public partnership and as such set to drive the global competitiveness of the European microelectronics industry. It combines investments from industry, individual countries and ECSEL (Electronic Components and Systems for European Leadership) Joint Undertaking. In addition to investments from industry, iDev40 is co-financed by funding from Austria (BMVIT), Belgium, Germany, Italy, Romania, Spain and the ECSEL Joint Undertaking.

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Latest News

NXP, Mastercard and Visa TransformMobile Payments for Billions of IoT Devices

and MDES (Mastercard Digital Enablement Service) and VTS (Visa Token Service) tokenization platforms, to offer OEMs a pre- certified and validated turnkey solution. “We are very pleased to have NXP as our latest partner in the space of connected consumer devices, which will result in simpler, more secure and convenient ways to

NXP Semiconductors N.V. in collaboration with Mastercard, and Visa announced the launch of its new mWallet 2GO, a white label wallet service developed on the NXP Secure Service 2GO Platform. With the new service, NXP is first in the industry to offer the full scope of mobile wallet development in one solution including leading hardware

technology, surrounding software and ecosystem integration. The payment solution is designed to ease development, reduce cost, and accelerate time-to-market for OEMs (Original Equipment Manufacturers) to add mobile payment capability to any wearable, mobile or IoT (Internet-of-Things) device. Montblanc, the German manufacturer of luxury writing instruments, watches, jewelry and leather goods, is the first company to launch its own mobile wallet solution based on mWallet 2GO for its new TWIN smart strap. “Montblanc’s heritage of sophistication and craftsmanship remains true with the introduction of the TWIN smart strap,” said Dr. Felix Obschonka, Director for New Technologies at Montblanc. “In this new stylish, smart strap, we’ve combined high-end materials with the most advanced technologies on the market to bring our customers easy, secure payment capabilities for their beloved watches – so they can delight in fashion and convenience while at the same time don’t miss out on digital use cases.” “mWallet 2GO extends our market-leading silicon offering to a truly full service and system solution for mobile payment. Following the announcement of MIFARE 2GO, this once again proves how NXP is at the forefront of transforming whole ecosystems,” said Rafael Sotomayor, senior vice president of secure transactions and identification solutions at NXP. “The company’s success in mobile payment implementations around the world validates NXP’s position to pave the way for new exciting secure payment devices to market.” This first true end-to-end solution integrates NXP’s advanced technologies including Near Field Communications (NFC), Secure Element (SE), NFC middleware, SE JavaCard operating system, SE applets, SEMS (Secure Element Management Service), wallet application and software developer kit (SDK), wallet server

pay for every shopper, while enabling issuing banks to further differentiate their product offerings,” said Paolo Battiston, Executive Vice President, Digital Payments and Labs for Europe at Mastercard. “Mastercard teamed up with NXP to provide a simple and better way to ensure security with the NXP Loader Service, and we anticipate a similar traction with mWallet 2GO.” “As commerce expands from PC’s, smartphones and tablets to connected endpoints of all shapes and sizes, having both the partner network and the right technology in place are fundamental to delivering great experiences,” said Matt Dill, senior vice president, global products and solutions, Visa Inc. “Through the work NXP is doing, consumers will ultimately have even more ways to pay that are fast, secure and convenient to their daily lives.” NXP’s Secure Service 2GO Platform is the breeding ground for multiple secure services to grow. Launched in February 2018, MIFARE 2GO manages digitized MIFARE-based transit credentials onto IoT devices. Being available for commutes with Las Vegas Monorail and fully integrated in Google Pay, the secure service is exposed to over two billion active Android users. These first service releases, mWallet 2GO and MIFARE 2GO, demonstrate the company’s commitment to think beyond silicon solutions, moving to fully integrated services and platforms as a business model. The end-to-end solutions connect service providers with IoT OEMs, allowing them to quickly innovative products that deliver the best in cloud-to-node security and scalability. Montblanc, the German manufacturer of luxury writing instruments, watches, jewelry and leather goods, is the first company to launch its own mobile wallet solution based on mWallet 2GO for its new TWIN smart strap.

New-Tech Magazine Europe l 11

Latest News

Hungarian Prime Minister, Viktor Orbán, and Ericsson CEO, Börje Ekholm, open new Ericsson Hungary headquarters

Ericson’s President and CEO Börje Ekholm, and Hungarian Prime Minister, Viktor Orbán, officially inaugurated Ericsson Hungary’s new headquarters in Budapest, incorporating state of-the-art R&D and innovation facilities. Ericsson also signed a strategic partnership with Budapest University of Technology and Economics.

and innovation. The MoU goal is to serve as a platform for strategic competence provisioning and research, providing added value to mutually strengthen BME and Ericsson. Börje Ekholm, President and CEO, Ericsson, says: “Ericsson has a strong commitment to

More than 1,700 of Ericsson Hungary’s 2,000 employees work at the site, located in the heart of Budapest’s university area on the banks of the River Danube. Within Ericsson House itself more than 1,400 employees are R&D-focused. Their other site colleagues work in service delivery, sales and business area roles. Ericsson House R&D center is part of Ericsson’s global R&D ecosystem. The new facility comprises state-of-the-art facilities, including a hypermodern test laboratory, Ericsson’s innovation space, and Ericsson Garage. Ericsson also signed a strategic partnership – a Memorandum of Understanding (MoU) – with Budapest University of TechnologyandEconomics(BME)todaytoextendcollaboration aimed at long-term close cooperation in education, research,

Hungary. The continuous growth of the local R&Dorganization builds on excellent results achieved by Hungarian researchers and engineers, such as the development of Ericsson Expert Analytics, our real-time analytics solution. “This talent, strong local presence, and our track record enables us to be the main and reliable partner in the development of 5G in Hungary. “The MoU with Budapest University of Technology and Economics is also great news for local innovation and cooperation. In addition to research results, it will enhance our reputation among students and strengthen BME’s attractiveness as a place of study.”

Vishay Honors Digi-Key with 2017 European Catalog Distributor of the Year Award

Vishay has recognized Digi- Key Electronics Europe with their 2017 European Catalog Distributor of the Year award during a recent visit to the company. The award is based on various KPI including growth, design fulfillment, and inventory management. “We are delighted to present Digi-Key with our 2017

Catalog Distributor of the Year award and congratulate the whole team for their great performance in Europe,” said Philippe Masson, Senior Director, Sales Distribution Europe for Vishay. “This award mirrors Digi-Key’s outstanding quality of service and support making Vishay’s broad portfolio and new technologies

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Latest News

always more available to our mutual customers.” The two companies share similar business goals and objectives for the electronic components industry. “We are appreciative to receive this special award and echo Vishay’s sentiment. We thank the Vishay team for their ongoing support in both areas of passive and active components,” said Hermann Reiter, Director, Global

Strategic Business Development & Supplier Management at Digi-Key. “The market share development of Digi-Key over the last few years proves the redefining of the distribution channel in Europe.” For more information, or to order from Digi-Key’s full line of Vishay products, please visit any of Digi-Key’s global websites.

First real-time test of Li-Fi utilization for the industrial Internet of Things

The BMBF-funded OWICELLS project was successfully completed with a final presentation at the BMW plant in Munich. The presentation demonstrated a Li-Fi communication with a mobile robot, while the robot carried out usual production processes (welding, moving and testing parts) in a 5x5m² production

communication in production processes, with especially low latency,” comments Dr. Volker Jungnickel, project coordinator at Fraunhofer HHI, on the developments. “Li-Fi can unburden the densely occupied Wi-Fi spectrum and

realize an uninterrupted mobile transmission for industrial IoT. Li-Fi works reliably when typical industrial work such as spot welding with high currents and flashes of light takes place,” emphasizes Gerhard Kleinpeter, project manager at BMW. The three-year project was funded by the Federal Ministry of Education and Research (BMBF) with 1.6 million euros. Project partners were BMW AG, evopro and Fraunhofer HHI (coordinator). OSRAM and the Munich University of Applied Sciences were associated partners and subcontractors, respectively. The project work on the industrial Li-Fi system was presented through demonstrations and scientific publications at international trade fairs and conferences, such as the Hanover Fair, ECOC, OFC and WCNC, and contributed significantly to standardization (IEEE P802.15.13 and P802.11bb, ITU-T G.vlc).

cell. The robust, optical wireless transmission is based on spatial diversity; in other words, data is sent and received simultaneously by several LEDs and several photodiodes. The system can transmit data at more than 100 Mbit/s and five milliseconds latency. Modern production technologies in the automobile industry must become more flexible in order to fulfil individual customer requirements. Researchers are therefore investigating applications for mobile robots and robotic tools that are networked with artificial intelligence in the cloud for the so-called Internet of Things (IoT). Wireless data transmission is essential for this, but must be just as reliable and at low-latency as a wired data connection. Li-Fi is based on low-cost LEDs and uses the license- free spectrum of visible and infrared light. Optical data transmission does depend on a line-of-sight connection, however, it cannot be jammed by radio transmitters. “The Li-Fi solution based on a Multiple-Input Multiple- Output (MIMO) architecture enables reliable mobile

New-Tech Magazine Europe l 13

Latest News Intel Starts Testing Smallest ‘Spin Qubit’ Chip for Quantum Computing

Intel researchers are taking new steps toward quantum computers by testing a tiny new “spin qubit” chip. The new chip was created in Intel’s D1D Fab in Oregon using the same silicon manufacturing techniques that the company has perfected for creating billions of traditional computer chips. Smaller than a pencil’s eraser, it is the tiniest quantum computing chip Intel has made.

One feature of Intel’s tiny new spin qubit chip is especially promising. Its qubits are extraordinarily small – about 50 nanometers across and visible only under an electron microscope. About 1,500 qubits could fit across the diameter of a single human hair. This means the design for new

Intel spin qubit chip could be dramatically scaled up. Future quantum computers will contain thousands or even millions of qubits — and will be vastly more powerful than today’s fastest supercomputers. A 2018 photo shows Intel’s new quantum computing chip balanced on a pencil eraser. Researchers started testing this “spin qubit chip” at the extremely low temperatures necessary for quantum computing: about 460 degrees below zero Fahrenheit. Intel projects that qubit-based quantum computers, which operate based on the behaviors of single electrons, could someday be more powerful than today’s supercomputers. (Credit: Walden Kirsch/Intel Corporation)

The new spin qubit chip runs at the extremely low temperatures required for quantum computing: roughly 460 degrees below zero Fahrenheit – 250 times colder than space. The spin qubit chip does not contain transistors – the on/off switches that form the basis of today’s computing devices – but qubits (short for “quantum bits”) that can hold a single electron. The behavior of that single electron, which can be in multiple spin states simultaneously, offers vastly greater computing power than today’s transistors, and is the basis of quantum computing. The zigzag lines in the photo are printed wires connecting the chip’s qubits to the outside world.

Imec demonstrates compact low-power 140GHz CMOS radar with on-chip antennas Imec, the world-leading research and innovation hub in nanoelectronics and digital technologies, announced at the International Microwave Symposium (IMS, Philadelphia, USA), the world’s first CMOS 140GHz radar-on-chip system with integrated antennas in standard 28nm technology. The achievement is an important step in the development of radar-based sensors for a myriad of smart intuitive applications, such as building security, remote health monitoring of car drivers, breathing and heart rate of patients, and gesture recognition for man-machine interaction. Radars are extremely promising as sensors for contactless, non-intrusive interaction in internet-of-things applications such as people detection & classification, vital signs monitoring and gesture interfacing. A wide adoption will only be possible if radars achieve a higher resolution, become much smaller, more power- efficient to run, and cheaper to produce and to buy. This is what imec’s research on 140GHz radar technology targets. This low-power 140GHz radar solution comprises an imec proprietary two antenna SISO (Single Input Single Output) radar transceiver chip and a frequency modulated continuous wave phase-locked loop (FMCW PLL), off-the shelf ADCs and FPGA and a Matlab chain. The transceiver features on-chip antennas achieving a gain close to 3dBi. The excellent radar link budgets are supported thanks to the transmitter Effective Isotropic Radiated Power (EIRP) that exceeds 9dBm and a receiver noise

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Latest News figure below 6.4dB. The total power consumption

Wim Van Thillo from imec. “We are well advanced in incorporating multiple antenna paths in our most recent generation solution, which will enable a fine angular resolution of 1.5cm in a complete MIMO radar form factor of only a few square centimeters. We expect this prototype in the lab by the end of 2018, at which point our partners can start building

for transmitter and receiver remains below 500mW, which can be further reduced by duty cycling. The FMCW PLL enables fast slopes up to 500MHz/ms over a 10GHz bandwidth around 140GHz with a slope linearity error below 0.5% and has a power consumption below 50mW. The

FPGA contains real-time implementation of basic radar processing functions such as FFTs (Fast Fourier Transforms) and filters, and is complemented by a Matlab chain for detections, CFAR (Constant False Alarm Rate), direction-of-arrival estimation and other advanced radar processing. “With our prototype radar, we have demonstrated all critical specs for radar technology in 28nm standard CMOS technology,” said their application demonstrators. First applications are expected to be person detection and classification for smart buildings, remote car driver vital signs monitoring (as cars evolve towards self-driving vehicles), and gesture recognition for intuitive man- machine interactions. Plenty more innovations will be enabled by this technology, once app developers start working with it.” TT Electronics acquires Precision Inc. Precision Inc. to expand TT’s electromagnetic capabilities and global presence

TT Electronics, a global provider of engineered electronics for performance critical applications, has announced the acquisition of Precision, an industry leading designer and manufacturer of precision electromagnetic product solutions for critical applications. Based in Minneapolis, US, Precision has around 160 employees that support customers in medical, industrial, and aerospace and defence markets.

into the Power Electronics division. TT will provide Precision with customer and market access in Europe and Asia, supported by a global Field Application Engineering team and distribution network. TT’s operating footprint will provide significant manufacturing and supply chain capabilities in Asia to support customers in region. Together with Precision, TT now has

a global electromagnetic product solution offering with engineering capabilities in the US, UK and Asia supported by manufacturing capabilities in each region. Commenting on the acquisition, Richard Tyson, CEO said: “The acquisition of Precision is an excellent fit with both our business and our strategy for growth and higher margins. It has a strong position in markets where the proliferation of electronics is increasingly important and will extend our capability for power electronic solutions in the important medical, industrial and aerospace and defence markets in the US. I am delighted to welcome Precision’s employees to TT as we continue to build differentiated capabilities and engineer smarter solutions together with our customers.”

Precision brings new design, simulation and manufacturing capabilities to TT in electromagnetics, one of our focus areas for growth. Precision’s products are primarily sold into medical applications including pace makers, neurological implants and other in-body equipment as well as external diagnostic equipment such as dialysis machines and MRI scanners. Precision also serves industrial and aerospace and defence customers in applications including satellite power supplies and aerospace guidance systems. Precision’s capabilities include high-reliability, ultra- fine wire winding, particularly suited to components that require exceptionally high levels of precision. Precision will be integrated

New-Tech Magazine Europe l 15

Device Protection, Management and Secured OTA

New-Tech Europe Magazine

NanoLock's platform is the world's leading solution for protecting¸ securing and managing IoT and connected devices’ during their entire lifecycle. From embedded to cloud¸ NanoLock Security provides the industry's only lightweight¸ unbreakable¸ low-cost security and management solution for connected edge devices. Using virtually zero computing and power resources¸ NanoLock Security protects firmware and sensitive information stored on connected IoT devices¸ preventing attacks ranging from ransomware to malicious manipulation of stored code. NanoLock prevents overwriting¸ modification¸ manipulation erasure and attacks on firmware¸ boot image applications executables¸

and configuration in all connected and IoT devices. NanoLock protects the device's entire lifecycle¸ from provisioning¸ through operations and firmware updates¸ and even after the device’s end of life. NanoLock’s MoT (Management of Things) platform updates¸ controls and monitors connected devices and includes robust features for monitoring device security¸ device to cloud integrity¸ self-provisioning¸ version management¸ attack detection and alerts. We met Eran Fine¸ CEO and co- founder of NanoLock¸ to learn more about the company solutions: Why did you found NanoLock and who are your main cofounders? We founded NanoLock to solve

a fundamental problem in the connected IoT device market. My fellow co-founder Erez Kreiner served as Director of Israel’s National Cyber Security Authority for more than five years and was responsible for preventing cyber- attacks on critical infrastructure. We realized, as billions of IoT devices emerge, this was an underserved market and the need to secure them from embedded to cloud and production to end-of-life and beyond is crucial. What is the fundamental problemNanoLock’stechnology is solving? NanoLock’s technology addresses the market’s most pressing need to provision, protect, manage and securely update connected and IoT

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devices from the production line until its end-of-life and from the embedded layer out to the cloud. Is there any change in attack vectors of IoT products?Or, with more connected devices, are there new threats emerging? There’s been a lot of buzz about the Meltdown and Spectre bugs that exposed vulnerabilities in billions of IoT devices. There’s been DDoS attacks that have come from unsecured IoT devices like security cameras. Right now, IoT devices are an easy gateway for hackers to infiltrate organizations’ security. What do you see as the major trends in IoT and connected devices? There’s a need to not only protect and secure devices, but also manage these connected devices. There will be a convergence of security and management for IoT devices and only then will these devices be truly secure. How do you see the cloud and IoT influencing each other? There is a need for the device side to trust commands and data coming from the cloud and for the cloud to trust information from the device side. It’s critical for the cloud to trust the device to avoid both vulnerabilities explotation as well as feeding the cloud with the wrong data. What are the challenges in securing IoT devices in today’s market? There’s no one solution and many vendors are sacrificing the device’s performance for security.

As vendors introduce embedded IoT security, they add latency and power consumption. What’s needed is a lightweight, unbreakable solution and that’s what NanoLock is providing to the market. Howis your approach to securing IoT devices different from other solutions on the market? NanoLock provides a holistic approach to securing IoT devices. Our security solution provides comprehensive lightweight, unbreakable security and management purpose-built for the Internet of Things (IoT) and Connected Devices ecosystem. Our company’s low-cost layered offering delivers a combination of cyber and cyber-physical protection, securing devices from the embedded layer out to the cloud. Why is your technology platform different? Explain the tenets of your solution. NanoLock’s Security platform protects the device’s entire

lifecycle from provisioning through operations and firmware updates, and even after the device’s end- of-life. Specially, NanoLock’s three-pronged approach prevents overwriting, modification, manipulation erasure and attacks on firmware, boot image, applications, executable and configuration in all connected and IoT devices and has a software platform to manage security and updates. What industries will benefit most from deploying NanoLock’s security platform? NanoLock’s technology was developed specifically for cloud providers, operators and OEMs. The platform is currently being piloted by several large customers in the U.S., Japan, Korea and Europe in a range of applications, such as automotive and connected cars, smart meters, and ICs and routers. Why will your company succeed? We have an experienced executive

picture: The NanoLock Security Team, in the middle Erez Kreiner Former Head of Israel’s’ Cyber Security Authority.

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Eran Fine¸ CEO and co-founder of NanoLock¸is an entrepreneur and senior manager with more than 18 years of international experience in founding¸ managing and leading high-tech companies. Previously¸ Eran was the Founder and CEO of OREE¸ which was subsequently sold to Juganu. Eran also served as CEO of MOBILSPEAR¸ and was a consultant for the nanotechnology centers of Tel Aviv University and the University of Tsinghua (Beijing). Eran is the author of 22 patents

team with deep experience in not only security, but firmware, connected devices and expertise and relationships in key vertical markets, including telecommunications, automotive and others. Why is Israel becoming a hot bed for security companies? Israel takes all security seriously and the Israel’s National Cyber Security Authority is one of best incubators of talent. Our co-founder Erez Kreiner led the department for more than 5 years and has seen many innovations in security have come from that organization. There’s a number of start-ups in Israel that received their start from the Israeli government – from homeland security to cyber security.

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Cadence Debuts Industry’s First Analog IC Design-for-Reliability Solution

New-Tech Europe Magazine

Addresses reliability challenges across the product lifecycle for automotive, medical, industrial, aerospace and defense applications Cadence has introduced the Cadence ® Legato™ Reliability Solution, the industry’s first software product that meets the challenges of designing high-reliability analog and mixed-signal integrated circuits (ICs) for automotive, medical, industrial, and aerospace and defense applications. The Legato Reliability Solution provides analog designers with the tools they need to manage their design’s reliability throughout the product lifecycle, from initial test through active life through aging. Based on the golden, trusted Cadence Spectre ® Accelerated

Parallel Simulator and the Cadence Virtuoso ® custom IC design platform, the Legato Reliability Solution integrates capabilities into an intuitive cockpit to address the reliability concerns of the three phases of the product lifecycle: Analog defect analysis accelerates analog defect simulation by up to 100X, reducing test cost and eliminating test escapes, the main source of early failure in IC designs Electro-thermal analysis avoids premature failures due to thermal overstress during the product’s useful life Advanced aging analysis enables accurate prediction of product wear-out by analyzing aging acceleration due to temperature and process variation.

“Since electronics are the key elements in many mission-critical applications, designing the chips to meet requirements across the entire product lifecycle has become a huge challenge,” said Tom Beckley, Cadence senior vice president and general manager, custom IC and PCB Group. “Designers are faced with the challenge of designing across the entire lifecycle, including eliminating the test escapes that become field failures early in the life cycle, preventing thermal overstress from operating in extreme conditions like under the hood of a car, and designing for 15 years or more of operating lifetime. Our new Legato Reliability solution enables designers to answer these critical questions much earlier in the design process.”

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Analog Defect Analysis Reduces Test Cost and Reduces Test Escapes In this release, Cadence introduces a simulation engine to enable a new test methodology for analog ICs—defect-oriented testing—that expands the capabilities of test far beyond what is traditionally achieved by just performing functional and parametric tests. Defect-oriented testing allows designers to evaluate the ability to eliminate die with manufacturing defects and resulting test escapes that cause field failures. It can also be used to optimize wafer test, reducing the number of tests required to achieve the target defect coverage by eliminating over- testing and potentially reducing the number of tests up to 30 percent. Customer experience with the tool indicates that it accelerates defect simulation by more than 100X. “Analog defect simulation is becoming very important for us to meet our customers’ expectations,” statedDieter Härle, projectmanager, Infineon Austria. “We tested the Legato Reliability Solution and were able to accelerate the simulation time by a factor of more than 100. We verified the solution and plan to adopt it for use in our production flow.” Electro-Thermal Analysis Prevents Thermal Overstress In this release, Cadence is introducing a dynamic electro- thermal simulation engine. For automotive designers, for example, actual usage results in significant temperature rise during normal operation due to on-chip losses and power dissipated in the switches. In

addition, these components need to operate in hostile environments under the hood of an automobile. The combination of high-power dissipation in a high-temperature environment can result in thermal overstress that can result in failure during normal operation. Dynamic electro-thermal simulation allows designers to simulate the on-chip temperature rise and validate the operation of over temperature protection circuits. Advanced Aging Analysis Predicts Product Wear-out Cadence is the recognized leader in aging analysis, providing technologies like RelXpert and AgeMOS to analyze the device degradation due to electrical stress. In this release, Cadence is enhancing aging analysis to include the effects that accelerate device wear-out including temperature and process variation. Cadence also provides a new aging model

for device degradation in advanced nodes with FinFET transistors. This holistic approach to aging analysis allows designers to achieve their design lifetime targets with less over-design. About Cadence Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. Thecompany’sSystem Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at cadence.com.

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How Motion Control Defines System Design The Engineering View

TRINAMIC

Even though it can seem sometimes as if everything is going digital, physical control of the real world isn't going away anytime soon. The trend toward automating all aspects of the human environment has resulted in an explosion in the deployment of motion controlled systems. Motion control plays a major role in connecting the physical and digital worlds, by translating digital data into physical motion. As automation and robotics spread into consumer as well as industrial applications, motion control and motor drives are moving into areas where they've never been needed before, and small electric motors have become ubiquitous. Product developers must deal with increasingly complex systems, and can no longer be experts in all of the specialized engineering fields required for building its subsystems.

Motion control is one of those key specialist areas of knowledge. Yet knowing the right questions to ask before selecting a device for implementing motion control in a design is not always intuitive. We use 3D printing/digital desktop manufacturing as a real-world example of how motion control impacts an application. What is Motion Control? Motion control is the part of automation that handles the kinematics and the electromechanical portion of machines in a deliberate and controlled manner. The primary components of a motion control system are the controller and the power amplifier, or driver stage. Typical motion control tasks include velocity ramp/motion profile- generation, micro-stepping, and

closed-loop operation. But today, motion control means more than merely motor control: it also means motion planning for more than one axis, or deciding all of the discrete movements that determine how objects will move in multiple dimensions over time. For several reasons, motion control is no longer just a checklist item in a design. One is because the algorithms used for implementing it have changed, and are also becoming more complex. As the level of automation continues to rise, another change is the dramatic increase in the number of electric motors used in more and more applications and different operating environments, and increases in requirements regarding dynamics, low noise emissions, and energy efficiency. At the same time, these motors are becoming smaller, more powerful, and more efficient,

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while expectations about the quality of motion control functions are rising. Today, overall processing tasks have become heavier and more complex than before, for several reasons. Complex algorithms already existed for motor and motion control, but they could only be used in high-end expensive applications due to the lack of small, powerful microcontrollers. Now these algorithms are going mainstream, and it's become feasible to use them in small embedded systems. At the same time, due to increasing integration motion control is becoming a secondary processing task. Today, engineers must be focused primarily on their application, so their primary processing tasks are on the application level, for example image recognition, visual computing, encryption/decryption, and artificial intelligence. More processing complexity also comes from the fact that communication now includes control and feedback channels, as well as low-latency, high-bandwidth, bus- level communications interfaces. Also, the realization of synchronicity,

real-time behavior, and fast response times is already mandatory for synchronizing multiple axes. Another result of these changes is that in many designs motion control has become a building block. The engineer must now consider not just a motor and how fast it spins, but also how it connects to and interacts with all the other building blocks in a real hardware design, as well as from the software point of view: for example sensors, another motorized axis in the same machine or on the same board, or other automated machines connected via different kinds of networks. Implementation Decisions Today, design engineers developing motion control systems must not only deal with technology-related questions, but also with a long list of commercial challenges and project- related questions that affect their implementation decisions. To find out if some ranked higher than others, we asked our field application engineers what are the top five

motion control design questions, problems, or issues they hear again and again from customers. These are: Time-to-market - Requirements are getting tighter every day for the whole development cycle, including prototyping and the other development stages, all the way through testing and production. So, products used for the motion control part of a mechatronic system must be easy to use, easy to understand, and easy to parameterize. Engineers want building block products that can be used right out of the box and provide the necessary tooling, without having to read a 200-page data sheet first. Fast design-in means they can start focusing on their own application faster. Miniaturization/Highest Integration - Especially in embedded motion control motors are getting smaller, and so is the available space for some kind of driver stage or embedded electronics. At the same time, what could be done before only in a large microcontroller (MCU) can now be done in small and smart pieces of

Fig. 1 Motion control embedded in a typical servo controller architecture

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As modern desktop manufacturing applications like 3D printing, computer numerical control (CNC) milling, and laser cutting have become more mature and accessible, real-world end-products can now be manufactured directly from design software. CNC milling already enables high quality in small-batch production. Motion control is an increasingly important contributor to the success of CNC and 3D printing, if these industrial technologies are to successfully cross over from technical enthusiasts to mainstream users. Producing high-quality multi- dimensional shapes requires precise coordination on two, three, or more axes combined with greater speed and precision of manufactured parts It also requires lower noise and vibration. At the same time, these machines must deliver all this for much lower cost. Motion Control Quality The concept of motion control quality covers multiple dimensions: noise, precision, accuracy,

silicon. Engineers are looking for the most amount of integration, both functionally and physically, and in the smallest possible space. This is true of both silicon and product packaging, as more engineers make use of systems-on-chip (SoCs), and system-in-package (SiP) configurations paired with a small- outline printed-circuit board (PCB). Cost Reduction - The pressure on OEMs and their engineers to cut costs is ongoing. This includes part cost in volume manufacturing and total cost of ownership for software, module hardware, and silicon. Motion Control Quality - The performance requirements of motor control and motion control applications are increasing, so the overall quality of these designs needs to increase, too. The concept of motion control quality encompasses multiple dimensions that all affect end-product quality, including but not limited to: noise, accuracy, efficiency, dynamic behavior, and precision. Interfaces, Not Motors - More and more engineers are unfamiliar

with the physics of motion control and motors, or an understanding of mechanical and materials challenges. In startups and small companies, as well as larger ones, there is a whole new generation of software-centric engineers unfamiliar with motors, mechanics, or materials. They want to work with interfaces, not motors. This trend is driving up the required abstraction level in products used for development, which in turn necessitates the building block approach to motion control. Application Example: Digital Manufacturing (3D Printing & CNC Machines) Increasing numbers of industrial machines are being miniaturized into desktop devices. Examples range from equipment for making dental inlays and implants that dentists operate in their own practices, to 3D printers on many engineers' desktops that are now printing end-use parts that can be replicated exactly, as well as prototypes.

Fig. 2 Differences in typical stepper motor control architectures

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