New-Tech Europe Magazine | April 2019

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C Components Electro Optic & Camera Packaging & Producti

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Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products

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connection and suitable Windows software, including a free simulator and a great deal of C and microcontroller codes for an easy system start and prototyping.

Teledyne e2v releases CIS120 CMOS imaging sensor for space and harsh environments Teledyne e2v, a Teledyne Technologies company, has released a new image sensor package, the CIS120. Samples are now available (from February 2019) along with a full test and demonstration system. This new and anticipated industry-leading image detector is an easy-to-use general- purpose imager designed for harsh environments such as space applications. Key specifications of the CIS120 include a resolution of 2048 x 2048 and back-illuminated 10µm square pixels with a quantum efficiency of 90% at 550 nm (typical) for outstanding low light sensitivity. The sensor offers both a rolling shutter mode with a frame rate of 30 fps (8 bit) and a global shutter mode with a frame rate of 20 fps (12 bit). A combination of low readout noise and on-chip analogue-to-digital conversion provides excellent image quality. Key features include: Good latch-up immunity and high SEU threshold by design and is resistant to ionising radiation by process choice Pixel read timing is set by an on-chip sequencer to simplify use and to reduce pin count A column parallel ADC is used to quantize each row of pixels in turn and is controlled by its own sequencer Resolution can be set anywhere from 8 to 14 bits Four LVDS channels output the image data and are controlled by the readout sequencer to scan along each row in turn. Two LVDS synchronisation channels allow accurate data sampling All configuration settings are programmed over an SPI. This includes shutter mode, ADC resolution and bias current values Package options include ceramic PGA and metal and ceramic three-side butting designs for use in mosaic focal planes CIS120 is stitched, so other sizes are possible from 2048

Maxim Unveils Smallest, Most Power- Efficient Dual IO-Link Transceiver with DC-DC Regulator and Surge Protection Designers can now enable smarter digital factories with the MAX22513 surge-protected, dual-driver IO-Link ® device transceiver with integrated DC-DC buck regulator from Maxim Integrated Products, Inc. As the industry’s smallest, most power-efficient and robust IO-Link device transceiver, it is ideal for industrial IO-Link sensors and actuator devices. As Industry 4.0 systems become smarter, sensor and actuator devices must continue to become smaller and more robust while dissipating less power to easily adapt to their manufacturing environments. In addition, integrating multiple discrete solutions into a design makes it difficult for designers to create robust working solutions while meeting time-to-market demands. The MAX22513 continues Maxim’s leadership in enabling adaptive manufacturing for Industry 4.0 applications. By integrating the DC-DC regulator and surge protection while providing 4x lower power dissipation and 3x smaller size versus the closest competitor, Maxim continues to enable the trend towards shrinking IO-Link designs that need robust communications with faster time to market. In addition, integrated surge protection and reverse polarity ensure robust communications in harsh industrial environments to speed up the design process. The IC operates over the -40-degree Celsius to +125-degree Celsius temperature range and is available in both a 28-pin QFN package (3.5mm x 5.5mm) and a WLP (4.1mm x 2.1mm).

New-Tech Magazine Europe l 37

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