New-Tech Europe Magazine | April 2019

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Toshiba’s new small surface mount LDO regulators lower power consumption Toshiba Electronics Europe GmbH has launched two new series of small surface mount LDO regulators for application in the power supply of mobile devices, imaging and audio- visual products. The 40 regulators in the TCR5BM series support a dropout voltage (VDO) as low as 100mV and a maximum output current of 500mA, while 40 additional devices in the TCR8BM series extend options with a 170mV VDO and 800mA output current. The TCR5BM and TCR8BM series are both available with VOUT options in the range 0.8V to 3.6V.a Both series are suited to applications that include power supplies for microcontrollers (MCU), RF devices, and camera CMOS sensors in mobile devices or imaging and audio- visual equipment, which increasingly require lower voltage supplies in the region of 1.0V. By using a low on-resistance N-channel MOSFET fabricated with the latest generation process and external bias voltage, both series have significantly reduced the dropout voltage that causes power loss, to approximately 33% less than Toshiba’s current products[1]. These levels represent the lowest dropout voltages in the industry[2]. In addition, with a 98 dB ripple rejection ratio, the new products deliver stable operation resistant to high frequency noise from the external environment and DC-DC converters, both of which are potential causes of improper operation. They also deliver a fast load transient response that prevents malfunctioning due to swift switching of IC operation modes. Quiescent current (TCR5BM=19μA, TCR8BM=20μA) is about 50% lower than other high current LDO regulators in the market, enabling lower power consumption in applications and thereby delivering longer operating times for battery- driven devices. Both series are housed in the small surface mount DFN5B package with a footprint of just 1.2 x 1.2mm.

RF antenna module uses optimised antenna beamforming for next generation high speed wireless networks Murata has released a high gain antenna module that facilitates communication up to 4.62 Gbps. The new millimeter-wave RF antenna module will contribute to the creation of next generation wireless networks that utilise the 60 GHz frequency by supporting the IEEE802.11ad millimeter-wave wireless LAN standard. The need is growing for faster internet communications in line with the increase in bandwidth required by internet contents such as ultraa-high definition (HD, 4K) video, augmented reality (AR), and virtual reality (VR). In addition, constructing wired networks that cover wide areas requires enormous amounts of cables and labour, and the costs of constructing and maintaining this infrastructure are also considerable. Dubbed LBKA0ZZ1NH-317, the new module is anticipated to be utilised in a wide range of applications such as for communication between mobile phone base stations including next-generation 5G wireless communication, for communication between Wi- Fi hotspots, and for use in wireless communication networks in smart cities. Murata’s RF module realises optimised antenna beamforming using a proprietary low temperature co-fired ceramics (LTCC) circuit board capable of facilitating high-precision 60 GHz band communication. In addition to communication via a standalone module, by combining multiple modules it is possible to extend the communication range and link outdoor base stations several hundred meters apart for multi- gigabit communication. The LTCC circuit board’s high heat resistance and low moisture absorption ensure excellent operational reliability and enable use even in outdoor base station environments. The highly efficient antenna module operation realises low transmission line loss between the IC and the antenna thanks to the low-loss material characteristics of the LTCC. The modularised RFIC and antenna package eliminates the need to design new millimeter- wave RF circuitry, which reduces the amount of labour

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