New-Tech Europe | March 2016 | Digital edition

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including RAID 0, 1, 5, 10 support. All major Linux and Microsoft Windows operating systems are supported, including Windows 10. A comprehensive set of add-ons for easier design-in – such as cooling solutions, carrier boards and starter kits – rounds out the offering. STMicroelectronics Releases Your Creativity in Showcase of Solutions around STM32, Secure Microcontrollers, and Near Field Communication Free hands-on workshops and technical seminars at Embedded World in Nuremberg, Germany (Hall 4A-138, Feb 23-25 2016) and on YouTube At Embedded World 2016 in Nuremberg, Germany, STMicroelectronics will present a broad range of solutions for embedded designs across the full range of applications, including industrial, medical, consumer, and automotive. The comprehensive showcase will include demos, technical seminars, and hands-on workshops, hosted by experts who can help attendees release their creativity with ST’s latest embedded technologies, products, and tools. Videos, produced during the event, will be available from February 24, 2016 at www.youtube.com/ stonlinemedia/EW2016 ST invites Embedded World 2016 attendees to participate in on-booth technical conferences or go into more depth on products and tools during practical workshops running throughout the exhibition. ST will give away hundreds of valuable and easy-to-use development boards

and other prizes, including BB-8™ by Sphero, an app-enabled Droid™ powered by the STM32F3 ARM® Cortex®-M4 microcontroller, during various activities. Among the demonstrations planned for Embedded World attendees are: The newest members of the STM32 ARM Cortex-M MCU family, including new 14-pin STM32L0 devices, smaller derivatives of the STM32L4, and extensions of the STM32F4 and STM32F7 series; A member of the LoRa® Alliance, ST will demonstrate the LoRa technology1 on STM32 MCUs and distribute LoRa combo packs (STM32L0 Nucleo + SX1276MB1LAS shield from Semtech) to interested attendees; Application solutions around the STM32 including connectivity, graphics, motor control, ARM mbed™ OS, Apple HomeKit™, and more; The STM32 Open Development Environment, which provides a flexible, easy, and affordable way to develop innovative devices and applications; The full NFC portfolio, including tags, dynamic tags, readers, and transceivers; A new security module for securing connected devices; Solutions that include wireless charging, new innovative sensors, wireless connectivity, MEMS microphones, and micro-power analog, to complement embedded designs; Flightsense™ sensor family for ranging, user detection, and gesture control; Embedded solutions for automotive applications that include the first Power Architecture™ MCU with ISO CAN FD (Flexible Data Rate)

that do not necessarily require complex out-of-band management or virtualization, modules based on the Intel® Core™ i3 processor and the Mobile Intel® HM170 chipset are also available. The feature set in detail The new conga-TS170 modules are equipped with the latest 6th generation 14nm Xeon® v5 and Intel® Core™ processors. They feature a TDP of 25-45W, up to 8MB smart cache and super-fast 2133 DDR4 memory up to 32 GB, implemented as ECC memory for safety-critical applications in the Intel® Xeon variants. For energy- efficient 24/7 operation, the new modules support disconnected standby in place of the legacy S3 mode. With disconnected standby, switching from energy-saving sleep mode to full performance takes less than half a second; as a result, systems can go into sleep mode more frequently without affecting usability and responsiveness. The integrated 9th generation Intel® HD Graphics 530 supports DirectX 12 for faster Windows 10 based 3D graphics on up to 3 independent 4K (3840 x 1260) displays via HDMI 1.4, DVI or DisplayPort 1.2. For legacy applications, a dual-channel LVDS output and optional VGA are available. Thanks to hardware support for the decoding as well as the encoding of HEVC, VP8, VP9 and VDENC, it is now possible to stream HD video energy-efficiently in both directions. In addition to PCI Express Gen 3.0 Graphics (PEG), the choice of available I/O interfaces includes 8x PCI Express Gen 3.0 lanes, 4x USB 3.0, 8x USB 2.0, LPC and I²C. SSD, HDD and BluRay mass storage can be connected via 4x SATA 3.0,

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