New-Tech Europe Magazine | Q2 2021

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connected, data-driven, and self-optimizing right from the start.” Bosch is investing roughly one billion euros in this high-tech location. This is the biggest single investment in the company’s more than 130-year history. Production in Dresden will start as early as July – six months earlier than planned. From that time on, semiconductors made in the new plant will be installed in Bosch power tools. For automotive customers, chip production will start in September, and thus three months earlier than planned. The new factory will be an important part of the semiconductor manufacturing network. With it, Bosch is strengthening Germany’s position as a technology and business location. “The new wafer fab is good for Europe, for Germany, and for Saxony. Directly and indirectly, it means many new jobs in a huge growth industry. This billion-euro investment strengthens Silicon Saxony and the entire European semiconductor industry,” said Michael Kretschmer, the minister-president of Saxony. On 72,000

Hailo-8 AI module to produce a solution capable of optimizing demanding edge workloads and accelerating time-to-market for AI deployments. Lanner’s low- footprint LEC-7242 industrial wireless gateway integrates the Hailo-8 into a fanless, efficient appliance for real-time applications powered by AI at the edge. Both solutions process multiple video streams in real-time on a single device, while securely transmitting curated metadata and insights with robust onboard network connectivity. Lanner’s modular approach to network appliances provides a clear path for engineers looking to optimize neural processing workloads. Integrated with Hailo’s AI module, Lanner’s fanless Edge AI computers enable mission-critical applications such as video analytics, traffic management, access control, and beyond. “Our expertise in creating effective purpose-built hardware platforms, combined with Hailo’s unparalleled AI module performance, will provide industries with a reliable vision-based solution that is low power, low latency and cost-effective,” said Geoffrey Egger, VP and GM of Lanner Intelligent Edge BU. No other automotive supplier has been working intensively on microelectronics since the 1950s. Since 1958, Bosch has been making semiconductor components itself. And since 1970, the company’s Reutlingen plant has been making special components that are not commercially available. In its wafer fabs in Reutlingen and Dresden alone, Bosch has invested more than 2.5 billion euros since 200-millimeter technology was introduced in 2010. On top of this, billions of euros have been invested in developing microelectronics. In this way, the company is continuing to pursue its growth strategy in semiconductor development and manufacturing. “This expertise is the key to many high-caliber systems solutions made by Bosch,” Denner said. square meters of floor space, 250 people are already working in the wafer fab in Saxony’s state capital. The workforce is set to grow to roughly 700 once construction work has been completed.

AI Chipmaker Hailo Partners with Lanner Electronics to Launch Next-generation AI Inference Solutions at the Edge

Lanner’s Edge Computing Appliances, Combined with the Hailo-8™ AI Acceleration Module, Offer the Highest Performance, Lowest Power, and Most Cost-Effective Edge AI Hardware Solutions for Smart Cities, Smart Retail and Industry 4.0

Leading AI (Artificial Intelligence) chipmaker Hailo announced its partnership with Lanner Electronics, a global leader in the design and manufacturing of intelligent edge computing appliances, to launch groundbreaking AI inference solutions for real-time computer vision at the edge. Hailo has combined its Hailo-8™ AI acceleration module with Lanner’s edge computing boxes to create high-performance, compact devices to support the demands of emerging AI applications at the edge. Smart cities, retail, and industrial operations require hundreds of cameras generating video streams that need to be processed locally, quickly, and efficiently with minimal latency. Scaling AI to meet this challenge requires ultra-high performance and easy to deploy solutions, which this joint offering provides. Lanner’s LEC-2290 edge box pairs an x86 CPU with the

credit: www.hailo.ai

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