New-Tech Magazine | Feb 2017 | Digital Edition

KNOWLEDGE IS POWER Massive power density in the smallest packages

Microchip Technology now offers an integrated switching power module designed specifically for height-constrained telecom, industrial and solid-state drive (SSD) applications. These products come in an impressive thermally-enhanced package that incorporates inductors and passive components into a single, molded power converter. The slim packages simplifies board design, saves space and eliminates concern over passive components that may introduce unexpected electromagnetic interference (EMI). Highlights

Variety of module package offerings (small to large, fit to application) High power density with integrated magnetic and passive components Performance (efficiency, thermal, transient response) Reliable (power and thermal stress tested) Low EMI (CISPR 22 Class B ratings on modules)

www.microchip.com/powerpromo

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