New-TechEurope Magazine | November 2017 | Digital Edition

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out mid production modifications, engineers are able to add increased levels of mechanical robustness, as well as providing the necessary EMI/RFI protection. As a result, prolonged operational lifespans can be benefitted from even in the most uncompromising of application conditions. Incorporated into the female cable versions is a highly convenient attachment feature viawhichbraid screening can be achieved with maximum effectiveness. There is a large elliptical entry hole for braid placement, along with a choice of slotted or hexagonal jackscrews on either side for securing the connection (as well as providing strain relief). The male backshell is designed for panel mount applications, and is compatible with both cable or vertical PCB connector styles. Full 360 degree EMI/RFI shielding is delivered once the male/ female mating process has been completed. A working temperature range spanning from -55°C to +125°C is supported. The new Harwin backshells can be used in conjunction with both the company’s J-Tek and its Mix-Tek Datamate connector product lines – with signal, power and coax cabling all being accommodated. The combined Datamate/backshell assemblies are significantly lower in overall cost than equivalent Micro-D/backshell arrangements. Made to order, only low minimum volumes are required and there are very short turnaround times involved. Among the key areas where these items will be employed are aerospace, motorsport, industrial drives/controls, military communication, satellite systems, robotics and renewable energy infrastructure.

sensors, announced the Mini-IO connector has been adopted as an international standard (IEC 61076-3-122) by the International Electrotechnical Commission (IEC). IEC 61076-3-122 provides the minimum requirements for a miniaturized connector for industrial applications and thus ensures safety through consistent performance and interoperability. Connector requirements for industrial applications are high as they typically run in harsh environments with high mechanical demands from vibrations and rapid movements, environmental stress through dust and humidity, and possible exposure to radiated electromagnetic fields. “TE is pleased that with the completion and publication of IEC 61076-3-122, the Mini-IO is the first standardized miniaturized industrial communication connector for an IP20 environment. Beyond its advantages for industrial applications in harsh environments, the small dimensions of the connector enable smaller devices and therefore higher packing densities inside cabinets,” said Guenter Feldmeier, global standardization & consortia leader of TE’s Industrial business unit. “TE Connectivity is pleased that the mini- i/O Standard was based on our technology.” Referring to its current use in industrial automation systems such as MECHATROLINK and VARAN, Feldmeier adds: “The reliability of the Mini-IO in harsh environments is already demonstrated by industry users. The standard now offers an exciting opportunity to accelerate the adoption by further eco-systems.”

Metal Backshells with Built-In Shielding Ensure Ongoing Electrical & Mechanical Integrity To complement its widely-used Datamate wire-to- board connector offering, Harwin now supplies a comprehensive range of backshells with a rugged aluminium alloy construction and electroless nickel plating. Through these accessories, which can be applied to new installations or alternatively for carrying

OMC launches new small-footprint SMA Tx/Rx housings OMC, the pioneer in optoelectronics manufacturing,

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