New-Tech Europe Magazine | H2 2023

final ratification of the new specification by the PICMG, are equipped with the new 13th generation Intel Core processors (codenamed Raptor Lake), which set the latest benchmark for the high-end of embedded and edge computing at client level. Together with the recently introduced high-performance Computer-on Modules with 13th generation Intel Core processors on COM-HPC Client Size A and Size C, congatec now offers developers the full module bandwidth on COM-HPC for this new processor generation. Thanks to state-of-the-art connectivity, the COM-HPC standard opens new horizons for developers of innovative designs with demands that go beyond what is achievable with COM Express in terms of data throughput, I/O bandwidth, and power density. congatec’s COM Express 3.1 compliant modules with 13th generation Intel Core processors, on the other hand, primarily help to secure investments in existing OEM designs, for instance by providing a path to upgrade data throughput thanks to PCIe Gen 4 support. But how can OEMs accomplish a COM HPC implementation quickly? This is where manufacturers like congatec come to the aid of customers with a dedicated training academy, which offers carrier board design courses to provide developers with best-practice knowledge for the design-in. The goal is to give system architects a quick, easy and efficient introduction to the design rules of the new PICMG standard. For that purpose, the training courses guide developers through all mandatory and recommended design basics and best practice schematics for Computer-on-Modules to then be able to start their own carrier board design projects. The focus of the knowledge Add-on services and training to simplify design-in

transfer is on standard-compliant carrier board designs that are essential for building interoperable, scalable and durable custom embedded computing platforms. Operating globally, the academy is offering online and on site courses and targets developers at OEMs, VARs and system integrators. Customers who want to use COM HPC but do not have the resources to integrate the modules themselves, can avail of congatec’s design-in services to handle this for them. Carrier board design, optimized cooling solution design, and even complete system integration services are also available. With this full range of products and services, congatec continues to build on its customer promise: “we simplify the use of embedded technology”. By providing such an all-round offering – from modules, cooling solutions, application-ready evaluation and application carrier boards, to design in training and complete design-in services – congatec is creating an extensive COM-HPC ecosystem in which new designs and design sprints for migration from COM Express to COM-HPC Mini are no longer a major challenge.

Figure 3: “Our COM-HPC Mini carrier board design course also teaches developers how to migrate COM Express Basic designs to COM-HPC Mini.” Daniel Stadler, Manager Support & Design-In at congatec. Credit: congatec

Christof Wilde, Content Manager at congatec Credit: congatec

Figure 4: congatec’s Server-on-Modules with Intel Xeon D 2700 processors in the compact COM-HPC Server Size D form factor. Credit: congatec

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