New-Tech Europe | December 2016 | Didital Edition

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they also reduced the trench depth by 1/k. Although this

Y. Numasawa6, I. Omura7, H. Ohashi1, and H. Iwai1, Experimental verification of a 3D scaling principle for low Vce(sat) IGBT, Technical Digest of IEDM2016, Session 10.6, (2016), http://ieee-iedm.org/ 1. Tokyo Inst. of Technology, Yokohama, Japan 2. Nat. Inst. Advanced Industrial Science and Technology, Tsukuba, Japan 3. Mitusbishi Electric, Fukuoka, Japan 4. Toshiba Corp., Tokyo, Japan 5. The University of Tokyo, Tokyo, Japan 6. Meiji University, Kawasaki, Japan

has a slightly negative effect on the IE effect, it has considerable benefits for fabrication ease and cost and the dependence of (Vce(sat)) on the trench depth was deemed to be small. The gate voltage was also decreased by a factor of 1/k, while the cell pitch was maintained at 16 μm. Reference

K. Kakushima1, T. Hoshii1, K. Tsutsui1, A. Nakajima2, S. Nishizawa2, H. Wakabayashi1, I. Muneta1, K. Sato3, T. Matsudai4, W. Saito4, T. Saraya5, K. Itou5, M. Fukui5, S. Suzuki5, M. Kobayashi5, T. Takakura5, T. Hiramoto5, A. Ogura6,

7. Kyushu Inst. of Technology, Kitakyushu, Japan

Advantest Unveils New Pick-and-Place IC Handler to Improve Efficiency in High-Volume Semiconductor Manufacturing and Device Characterization Leading semiconductor test

can accommodate an optional active thermal control system. The vision alignment-equipped M4872 incorporates a common change kit, which saves time and money as well as helps to safeguard devices under test from potentially damaging package. Using a common change kit also significantly shortens time to market. In total, the time it takes to change device types is reduced by more than 45 percent, enabling nearly twice the throughput of handlers that rely on standard change kits.

equipment supplier Advantest Corporation (TSE: 6857) has introduced its M4872 pick-and-place handler to improve productivity in testing system-on-chip (SoC) devices in high-volume manufacturing (HVM) and device characterization pre-production environments. This helps users to keep pace with the rapidly changing SoC market and quickly adapt to changes in device technology. The new handler matches all of the leading-edge performance specifications of its predecessor, the M4871 handler, including throughput of up to 15,000 units per hour, in a

By using Advantest’s on-the-fly vision- alignment technology, devices under test can be precisely positioned, making the new handler ideally suited for testing fine-pitch ICs and devices with both top- and bottom- side contacts. The resulting improvements in test yields

footprint that is approximately 10 percent smaller. The portable M4872 handler has advanced vision-alignment capabilities and

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