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Through Optimum Use and Innovation of Welding and Joining Technologies
Improving Global Quality of Life
The opportunities for welding in this field are growing due to the increasing number of devices being
manufactured, the growing complexity of the systems, their application in harsher environments and
environmental legislation. Benefits of welding include:
Low thermal impact.
High temperature capability joints and high welding speeds.
Very small weld profile/footprint capabilities.
Relatively lower energy consumption and lower electrical resistance joints.
Replacement of lead based solders on lead-frames and electrical terminations (e.g. motors).
Replacement of adhesives and mechanical fasteners on polymer and metal enclosures – easier to
recycle and reuse polymer at product end-of-life.
The challenges are primarily concerned with the miniaturisation of the welding
processes (including jigging and fixturing) adapting processes to suit very thin
and film materials and persuading “customers” to change from “tried-and-trusted
processes” and design products for welding.
Furthermore, the following are some of the trends that affect materials joining for
the electronics market.
The disposable electronics market is expected to grow to $26.2 billion by
2015 [
Dunn]. Applications such as smart cards, security, packaging, displays, and toys are expected to lead
the printed electronics arena. In 2015, RFID tags are expected to partly replace barcodes and generate
$12.4 billion in revenue. E-paper technology is predicted to grow to $1.6 billion in 2015 as point-of-purchase
displays become popular. In general, future electronics will involve:
Increased integration with mechanical, optical and biological type systems (e.g. more complex
materials joining and packaging technology).
Reduction in the use of mineral resources and assembly processes with high environmental impact.
The further development of lower energy consumption devices and systems that can reduce energy
use in external equipment/plant.
9.14.1
Hot topics
Environmentally friendly materials
:
One of the most significant trends in the electronic device
market is the transition to lead-free components. The European Union’s Restriction of Hazardous
Materials (RoHS) went into effect July 1, 2006, and the electronics industry is now moving to
products that are free of hazardous materials. Manufacturers are struggling with the risk of being
out of compliance with lead-free laws and creating products that are more likely to fail due to the
absence of the hazardous materials that help stabilise the parts. This trend has spurred interest in
developing advanced solder alloys to assist manufacturers during this transition phase worldwide.
Miniaturisation and cost control
:
The trends of miniaturisation and outsourcing manufacturing
are relevant for the electronics device market. Miniaturisation of electronic devices is being driven
by the portability needs of consumers in today’s global environments and marketplaces. Contract
manufacturing of electronic devices is also being driven by cost-control and core competence issues
similar to those in the medical devices market.
Microfriction stir
welding 0.5 mm thick
Al sheet
9
Needs and challenges of major industry sectors for future applications
