New-Tech Europe Magazine | Q1 2021

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New Products Automotive

IoT

IoT Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products tests. RDS(on) of the devices measures 4.2 mOhm (BUK7V4R2) and 13 mOhm (BUK9V13). The AEC-Q101-qualified Nexperia LFPAK56D half-bridge package suits a broad range of 3-phase automotive powertrain applications such as fuel and water pumps, motor control and DC/DC power conversion, occupying 30% lower PCB area and 60% lower parasitic inductance for high performance switching applications. The new technology has already seen success with design-in and commitment from major automotive customers. For more information, including product datasheets and quick learning videos, visit www.nexperia.com/ lfpak56d-half-bridge

Automotive

New Products

Electro Optic & Camera Packaging & Productio

Motion

Computers Communication

Motion

Communication

Motion Automotive

Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half- bridge package Space-saving LFPAK56D half-bridge offers 60 % lower parasitic inductance and improved thermal performance for power train, motor control and DC/DC applications Nexperia, the expert in essential semiconductors, announced a series of half-bridge (high side & low side) automotive MOSFETs constructed in the space- saving LFPAK56D package format. The half-bridge configuration of two MOSFETS is a standard building block for many automotive applications including motor drives and DC/DC converters. The new package provides a half-bridge solution in one device, occupying 30% lower PCB area compared to dual MOSFETs for 3-phase motor control topologies due to the removal of PCB tracks, whilst permitting simple automated optical inspection (AOI) during production. The LFPAK56D half-bridge utilises existing high volume LFPAK56D assembly processes with proven automotive reliability. The package format uses flexible leads to improve overall reliability, and an internal copper clip connection between the MOSFETs simplifies PCB designs and brings a plug and play style solution with exceptional current handling capability of 98 A. Typically, in a half-bridge arrangement, the PCB connection between the source of the high side MOSFET and the drain of the low side MOSFET can create a significant amount of parasitic inductance. However, with its internal clip connection, the LFPAK56D half- bridge package achieves 60 % less inductance. The new LFPAK56D half-bridge MOSFETs launched are the BUK7V4R2-40H and the BUK9V13-40H. Both utilise the highly robust Trench 9 automotive silicon process technology, are rated at 40 V and are verified at twice the automotive AEC-Q101 specification in key

Anritsu and Tektronix Introduce PCI Express® 5.0 Test System All-in-one Solution Combines Anritsu MP1900A BERT, Tektronix DPO70000SX to Ensure High-speed ICs, Devices, and Networks are in Compliance with PCIe®0 Standard — Anritsu Corporation President Hirokazu Hamada and Tektronix, Inc. announce to provide an automated PCI Express® 5.0 (PCIe Gen5) test solution combining Anritsu’s Signal Quality Analyzer-R MP1900A BERT series with Tektronix’s DPO70000SX series 70 GHz Real-time Oscilloscope and automation software. The all-in-one solution supports tests of PCIe 5.0 electrical characteristics, physical-layer protocol analysis, and transmitter/receiver and Link Equalization Training (LEQ) tests to facilitate efficient development of high- speed ICs, devices, and networks used in emerging environments, including 5G. Anritsu and Tektronix end-to-end solution can be quickly configured to support required PCIe 5.0 specifications and supports automated transmitter test, receiver jitter tolerance test, and Tx/Rx LEQ compliance test

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