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issues, materials and process problem solving, turbine engine component testing, and electronic device testing. Tools and Techniques: SEM/EDX, vacuumOES, ICP, clas- sical wet chemical analysis, metallography, microhard- ness testing, digital imaging, microstructural testing and analysis, plating/coating thickness and quality, grain size, case depth, inclusion rating, porosity, corrosion, salt spray corrosion (ASTM B117, B368), taber abrasion, shelf life recertification (non-metallics), coefficient of friction, paint adhesion, stress corrosion, hydrogenembrittlement, solderability, susceptibility to intergranular attack, coating adhesion, shore hardness polymers, density/specific gravity (polymers), electrical conductivity, and thermal barrier coating strength. ROOD MICROTEC TECHNOLOGY AND FAILURE ANALYSIS +44 (0)711 86709 42; +49 (0)711 86709 44; +49(0)162 2596515 roodmicrotec.com/en/contact/contact-sales Services Offered: Extended supply chain management, test engineering, test operations, qualification and reli- ability tests, failure and technology analysis, device programming, Competence Centre for Reliability and Consultation, technological analysis, failure analysis, nondestructive and destructive physical analysis, mate- rial analysis, authenticity verification tests, and ESD certification. Tools and Techniques: IC design modifications and FIB cross-sections, x-raymicroscopy, x-ray computed tomog- raphy, SAM, visual control andwhisker inspection, metal- lography, measurement of ionic contamination, SEM and EDX spectroscopy, spectroscopic and chromatographic methods, dye penetration inspection, PIND, leak tests, plastics testing, life tests, burn-in and run-in, HAST and autoclave, THB, environmental simulations and artificial agingbymeans of environmental tests from − 70° to+300°C and 10 to 98 percent humidity (constant, cyclical, or shock), andmechanical tests (shock, bump, or vibration). WINTECH NANO-TECHNOLOGY SERVICES 10 Science Park Rd. 03-26 The Alpha, Science Park II Singapore 117684 +65 67777354 sales@wintech-nano.com wintech-nano.com Services Offered: Failure analysis, IC circuit edit, and materials characterization. Tools and Techniques: Encapsulation, FIB, EMMI, TIVA, SEM, TEM, EDX, AFM, TOF-SIMS, D-SIMS, TXRF spectros- copy, AES, XPS, FTIR spectroscopy, EDX spectroscopy, and AFM.

differential phase contrast imaging, tomography (STEM& TEM), electrostatic biprism for electron holography, x-ray based imaging technology (nano- andmicro-X-CT: 2D, 3D, 4D), XPCI, SAXS, x-ray tomography (macro, micro, nano- CT), SC-XRD, HRXRD, and SAXS. INNOVATIVE CIRCUITS ENGINEERING (ICE) 2310 Lundy Ave. San Jose, CA 95131 408.955.9505 serena@icengin.com icenginc.com/failure-analysis-testing-services Services Offered: Reliability testing, PCB design and as- sembly, burn-in services, ESD testing, and failure analysis. Tools and Techniques: Preconditioning, temperature cycling testing, thermal shock, autoclave or pressure pot, high-temp and low-temp storage, cycled temp humidity bias, HAST test, power temp cycles, temperature humid- ity bias test, BLRT, ELFR, LOL, HTOL, lumen maintenance test, RF HOTL (CW, GSM and others), external visual in- spections, curve tracing, x-ray, CSAM acoustic analysis, probing, liquid crystal analysis, emissionmicroscopy, and thermal emissions. METALLURGICAL ENGINEERING SERVICES (MES) 845 E. Arapaho Rd. Richardson, Texas 75081 972.480.0033 sales@metengr.com metengr.com Services Offered: Mechanical testing, failure analysis, chemical analysis, nondestructive testing, environmental testing, surface analysis, welding analysis, and accident investigation. Tools and Techniques: SEM, WDS, EDX/EDS, real-time x-ray, corrosion testing, soldering analysis, fracturemode and mechanism, coating characterization, profilometer, replication metallographic analysis, strain gauge, tensile pull testing, Rockwell, Brinell, andmicrohardness testing, durometer hardness testing, yield strength and elonga- tion, fracture toughness testing, friction andwear testing, adhesion and peel testing. METALS ENGINEERING AND TESTING LABORATORY (METL)

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4

2040 W. Quail Ave. Phoenix, AZ 85027 800.658.5836; 602.272.4571 mgiboney@metl.com metl.com

Services Offered: Failure analysis, chemical analysis, mechanical testing, metallurgical analysis, expert witness testimony and consulting, reverse engineering, fastener testing, aviation services, welder qualification, warranty

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