WCA January 2011

In the drawing process, the pressure between the wire and the die may rise to 450kg/mm 2 , and temperatures to 400ºC are not extraordinary. In these conditions the selection, mounting and orientation of the die are critical to achieving the precise profiling, accurate hole-sizing and wearability essential to a flawless production run of wire.

These statements were true before the computer era, and they are true today.

For as long as wire is drawn through dies, providers of the products reviewed in these pages will be held to the highest standards of quality, consistency, and trouble-free performance.