New-Tech Europe Magazine | Q1 2020

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IoT Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products supercomputers, AI-driven data analytics and state-of-the- art graphics systems in a timely manner. “With the introduction of the highest performing DRAM available today, we are taking a critical step to enhance our role as the leading innovator in the fast-growing premium memory market,” said Cheol Choi, executive vice president of Memory Sales & Marketing at Samsung Electronics. “Samsung will continue to deliver on its commitment to bring truly differentiated solutions as we reinforce our edge in the global memory marketplace.” Ready to deliver twice the capacity of the previous- generation 8GB HBM2 ‘Aquabolt’, the new Flashbolt also sharply increases performance and power efficiency to significantly improve next-generation computing systems. The 16GB capacity is achieved by vertically stacking eight layers of 10nm-class (1y) 16-gigabit (Gb) DRAM dies on top of a buffer chip. This HBM2E package is then interconnected in a precise arrangement of more than 40,000 ‘through silicon via’ (TSV) microbumps, with each 16Gb die containing over 5,600 of these microscopic holes. Samsung’s Flashbolt provides a highly reliable data transfer speed of 3.2 gigabits per second (Gbps) by leveraging a proprietary optimized circuit design for signal transmission, while offering a memory bandwidth of 410GB/s per stack. Samsung’s HBM2E can also attain a transfer speed of 4.2Gbps, the maximum tested data rate to date, enabling up to a 538GB/s bandwidth per stack in certain future applications. This would represent a 1.75x enhancement over Aquabolt’s 307GB/s. Samsung expects to begin volume production during the first half of this year. The company will continue providing its second-generation Aquabolt lineup while expanding its third-generation Flashbolt offering, and will further strengthen collaborations with ecosystem partners in next- generation systems as it accelerates the transition to HBM solutions throughout the premium memory market.

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system performance by automating waveform control, timing and measurement operations and logic functions.” Development Tools The PIC18-Q43 family is supported by Microchip’s MPLAB® X IDE and MPLAB Xpress IDE development environments, and MPLAB Code Configurator (MCC) — a free software plug-in that provides a graphical interface to configure peripherals and functions specific to an application. It’s also supported by the PIC18F57Q43 Curiosity Nano board — a compact, cost-effective development board with programming and debugging capabilities. Pricing and Availability The PIC18-Q43 product family offers a range of memory sizes, packages and price points to match a wide range of application needs. All products are available for volume production and sampling in a variety of packages. Volume pricing begins at $0.64 each. For additional information, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website. To purchase products mentioned here, click to order now or contact a Microchip authorized distributor.

Samsung to Advance High Performance Computing Systems with Launch of Industry’s First 3rd-generation (16GB) HBM2E Samsung Electronics, the world leader in advanced memory technology, today announced the market launch of ‘Flashbolt’, its third-generation High Bandwidth Memory 2E (HBM2E). The new 16-gigabyte (GB) HBM2E is uniquely suited to maximize high performance computing (HPC) systems and help system manufacturers to advance their

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