New-Tech Europe Magazine | December 2018

December 2018

16 A smart shoe for athletes and diabetics 20 How innovation can shape the payment card market of the future 22 The electronics of the future are smart, safe and secure 24 Laser-pointing system could help tiny satellites transmit data to Earth

Checkmate. SMT Spacer wins!

© eiCan

# SMT SPACERWINS

 Fast and precise process  Instant removable kapton foil  Strong holding forces and torques  Highest process reliability

SMT Spacers from Würth Elektronik significantly optimize the assembly process of electromechanical units. Mounting conventional spacers takes a lot of time, SMT Spacers are tailor-made for full automation. Available on reel, they can be positioned very precisely on the PCB. Different designs cover a wide range of applications for fast, strong and safe soldering connections.

www.we-online.com/smt-spacer

External Thread WA-SMSE

Internal Thread WA-SMSI

Through-hole WA-SMST

Reverse Type WA-SMSR

Fixed with Snap Rivet WA-SMSSR

Right Angled WP-SMRA

Distance Cap WA-SCAP

Mounting Button WA-EXRV

AnalogMAX with Smoke Detector AnalogMAX with Smoke Detector

AnalogMAX Full featured Smoke Detector sensor board AnalogMAX Full featured Smoke Detector sensor board The AnalogMAX is a full featured sensor board with the brand-new Smoke Detector ADPD188BI from Analog Devices, based on the MAX1000 with Intel FPGA. The ADPD188BI is a complete photometric system for smoke detection utilizing optical dual- wavelength technology. The module integrates a highly efficient photometric front end, two LEDs, and a photodiode. For wider detection areas, integrated drivers of the ADPD188BI can supply external LEDs and additional sensor inputs are available. The data output and functional configuration occur over a 1.8 V I2C or SPI interface. The AnalogMAX is a full featured sensor board with the brand-new Smoke Detector ADPD188BI from Analog Devices, based on the MAX1000 with Intel FPGA. The ADPD188BI is a complete photometric system for smoke detection utilizing optical dual- wavelength technology. The module integrates a highly efficient photometric front end, two LEDs, and a photodiode. For wider detection areas, integrated drivers of the ADPD188BI can supply external LEDs and additional sensor inputs are available. The data output and functional configuration occur over a 1.8 V I2C or SPI interface.

Features AnalogMAX:

Features AnalogMAX:

For more information please visit www.arrow.com

- Smoke Detector sensor IC, ADPD188BI - Based on MAX1000 with Intel FPGA - Configurable 8-Channel ADC/DAC/GPIO extender, AD5592R - Temperature sensor, ADT7320 - 3-Axis Acceleration sensor, ADXL362 - Silicon Oscillator for clocking, LTC1799 - Power Supply by ADI, DCDC LT8607, LDO ADP160 - PMOD for optional ADI expansion boards - Preprogrammed Demo Application - Customized board available for real end products! - Smoke Detector sensor IC, ADPD188BI - Based on MAX1000 with Intel FPGA - Configurable 8-Channel ADC/DAC/GPIO extender, AD5592R - Temperature sensor, ADT7320 - 3-Axis Acceleration sensor, ADXL362 - Silicon Oscillator for clocking, LTC1799 - Power Supply by ADI, DCDC LT8607, LDO ADP160 - PMOD for optional ADI expansion boards - Preprogrammed Demo Application - Customized board available for real end products!

For more information please visit www.arrow.com

Part number: AnalogMAX-01

Part number: AnalogMAX-01

HANI (HMI Arrow NXP IoT) board

The board is based on NXP ’s LPC54618 high performance MCU running at 180 MHz with 512K Flash and 200K RAM. It focuses on HMI (Human Machine Interface) – supporting multiple display sizes and connectivity . HANI wireless features • R41Z, a wireless module from Rigado, based on KW41Z from NXP which supports BLE 4.2, ZigBee and Thread protocols • SX-ULPGN, a Silex Wi-Fi module based on Qualcomm’s QCA4010 SoC

CLRC663, a NXP NFC reader

•

HANI wired interfaces

2x CAN interfaces 10/100 Ethernet

•

•

• USB host/device It would not be an IoT board without sensors from NXP • FXLS8471Q, an industrial 3-axis accelerometer

FXAS21002CQ, a 3-axis gyroscope

•

• FXPQ3115BV, a bio compatible medical pressure sensor

PCT2075GV, temperature sensor

•

+ TSL25711FN, light sensor

•

arrow.com

MAX IMUM ROUT I NG & GROUNDING FLEXIBILITY THE MOST VERSATILE HIGH-SPEED HIGH-DENSITY PRODUCT LINE IN THE INDUSTRY

With products designed for maximum routing and grounding flexibility, ultra-high-density signaling, and PCB space-savings, Samtec’s family of High-Density Arrays are ideal for a variety of high-performance applications. SEARAY ™ Open-Pin-Field Arrays | SEARAY ™ Ultra-High-Density Arrays | FMC / FMC+ (VITA 57) Solutions LP Array ™ High-Speed Low Profile Arrays | Z-RAY ® High-Speed Ultra Low Profile Arrays

Samtec Israel | 21 Bar-Kochva St. | Concord Tower | B’nei Brak, Israel 51260 Tel: +972 3 7526600 | Fax: +972 3 7526690 | Email: israel@samtec.com | Visit samtec.com/arrays to learn more

Read To Lead

Keep Up To Date With Our Weekly Newsletter! Sign Up Today!

www. new- t echeurope . com

December 2018

About New-Tech Magazines Group Read To Lead ‘New-Tech Magazines’ A world leader in publishing high-tech and electronics, producing top quality publications read by tens of thousands professionals from all over the world especially from Europe, innovative electronics, IoT, microwave, homeland security, aerospace, automotive and technological industries. Our specialized target audiences prefer New-Tech Europe because they know that our publications are a reliable source of the latest information in their respective fields. Our multidimensional editorials, news items, interviews and feature articles provide them with a full, well-rounded picture of the markets in which they operate - an essential asset for every technological leader striving to stay ahead, make the right decisions, and generate the next global innovation. Moreover, as an attractive platform for advertisers from around the world, New-Tech Europe has become a hub for bustling international commercial activity. Here, through ads and other promotional materials, Israeli readers obtain crucial information about developers and manufacturers worldwide, finding the tools, instruments, systems and components they need to facilitate their innovative endeavors. Targeting the needs of both the global and european industries and global advertisers, New-Tech Magazines Group constantly expands and upgrades its services. Over the years, the company has been able to formulate a remarkably effective, multi-medium mix of offerings, combining magazine publications with useful online activities, newsletters and special events and exhibitions.

Editor: Tomer Gur-Arie COO & CFO: Liat Gur-Arie Journalist: Amir Bar-Shalom Technical journalist: Arik Weinstein U.S journalist: Sigal Shahar Graphic Design: Hadas Vidmayer Concept design: Maya Cohen

mayaco@gmail.com Technical counselor: Arik Weinstein Sales and advertising:

sales@new-techmagazine.com Account Manager: Tatiana Yamin Account Manager: Ricky Shlezinger Account Manager: Tal Shechter Account Manager: Noa Oslander Project Manager/Events: Ayelet Arran Project Manager/Events: Yaara shahaf

Data system: Liat Tsarfati Administration: Lihi Levi

Administration: Shir Ben David Editorial coordinator: Lihi Levi Mail: Office: info@new-techmagazine.com Publisher : NEW-TECH MAGAZINE GROUP LTD

www. new- t echeurope . com

8 l New-Tech Magazine Europe

Contents

10 LATEST NEWS 16 A smart shoe for athletes and diabetics 20 How innovation can shape the payment card market of the future 22 The electronics of the future are smart, safe and secure 24 Laser-pointing system could help tiny satellites transmit data to Earth 26 Greater Contrast and Improved Vision for Imaging Systems 30 Optimizing Device Lifecycle Management Of Remote, IoT Connected, LPWA Devices

16

20

36 OUT OF THE BOX 38 NEW PRODUCTS 46 INDEX

22

24

www. new- t echeurope . com

New-Tech Magazine Europe l 9

Latest News

CPI Supporting BodySense Project to Develop Smart Devices

Working with a number of partners on the BodySense project, CPI is supporting the development of next generation multi-functional sensing devices. Non-invasive sensing platforms are already prevalent in the marketplace to monitor and log personal data on health and well-being.

“Developing and advancing the route to commercialisation for the latest electronic and wireless technology within our healthcare systems will dramatically reduce the strain on GP practices and hospital service levels. It will also enhance the level of care and treatment that patients can expect.”

However, these existing wearable models carry drawbacks, with their connection to the body via straps or similar fastenings failing to maintain a good connection over a long period. Existing skin conformal sensor nodes are also very limited in their sensing ability, with their principal focus on just temperature and strain and their performance relying upon high power consumption, resulting in regular battery recharging and electronic waste. However, CPI, alongside its partners, the University of Kent, University of Manchester and Northwestern University, aims to create a new manufacturing platform for novel smart sensing devices. By using passively powered Radio Frequency Identification (RFID) tags mounted on conformal tattoo-like substrates, devices can remain attached to the body for days at a time before naturally bio-degrading, therefore minimising electrode waste. CPI’s role in the project involves consideration of production processes, from roll-to-roll and sheet fed printing, including pick and place capabilities, to evaluation of materials in end- use applications. CPI will also explore processes for printing conductive inks and adhesives into roll-to-roll and sheet-fed modes, and methods of integrating devices into printed webs. The successful outcomes from the project will help create a new model for supporting and delivering such work at the research stage could be rolled out to other universities and R&D organisations in the UK. Andrea Kelly, Project Manager at CPI, said: “When I first heard of the opportunity for CPI to support the University of Kent and the University of Manchester in developing advanced biosensors with the capability of monitoring the condition of their patients remotely via printed electronics, I was excited.

CPI's expertise and cutting-edge printable electronics facilities will be integral to BodySense, wherein the organisation will consider production processes, from roll-to-roll and sheet fed printing, including pick and place capabilities, to evaluation of materials in end-use applications CPI’s expertise and cutting-edge printable electronics facilities will be integral to BodySense, wherein the organisation will consider production processes, from roll-to-roll and sheet fed printing, including pick and place capabilities, to evaluation of materials in end-use applications Professor John Batchelor, from the School of Engineering and Digital Arts at the University of Kent, said: “There is huge potential for this technology and working with CPI will help us ensure we have the scope to take the product to market in the future. “We are hoping to be able to demonstrate it in action in the near future and demonstrate different ways in which it could have real benefits in areas such as healthcare,” added Professor Batchelor, who is lead researcher on the project. Dr Alex Casson, from the School of Electrical and Electronic Engineering and lead for the Manchester parts of the project, said: “This is a massively existing project. ‘Smart skin’ and similar sensors for the long-term monitoring have been proposed by a number of groups around the world. “Our collaboration with CPI is helping us to scale up this technology and deliver sensors at a pace and scale which isn’t possible elsewhere.” The project is funded by the Engineering and Physical Sciences Research Council.

10 l New-Tech Magazine Europe

Latest News

Teledyne e2v’s delivery of 125 science-grade sensors completes contract for world’s most powerful survey telescope

Teledyne e2v, a Teledyne Technologies company, has completed a multi-million dollar project by delivering hundreds of CCD250 sensors for one of the world’s most powerful survey telescopes: the Large Synoptic Survey Telescope (LSST).

wavelength range. Spectral response ranges from UV to NIR at an enhanced infrared sensitivity of 80% QE at 900 nm. The sensors have 16 output channels that enable 2-second readout with low read-noise, allowing for a high rate of high-resolution image collection. CCD250 Image Sensor for Large Synoptic Survey Telescope (LSST)

Identified as a US national scientific priority by the 2010 USA National Research Council decadal survey, LSST will carry out a 10-year survey of 37 billion stars and galaxies to produce a giant database of the sky. Equipped with the greatest data capture capability, the LSST incorporates the largest digital camera ever built for ground- based astronomy. When commissioned in 2021, it will be one of the world’s most powerful astronomical survey telescopes. The camera, using 4096 by 4004 pixel format CCD sensors, has the ability to capture 3.2 gigapixels of image data and produce 1000 images every night. Teledyne e2v’s CCD sensors have been uniquely designed and manufactured to achieve the performance and delivery time required for this project. The 16 megapixel sensors have been manufactured in a custom 4-side butting precision package that enables a closely packed mosaic assembly providing a high fill factor. As the camera requires an extremely flat focal surface, Teledyne e2v has designed each of the individual sensors to achieve a surface flatness precision that is one-twentieth of the width of a human hair. The sensors deliver high sensitivity over a wide

Dr. Paul Jorden, Astronomy product specialist at Teledyne e2v , said, “We are thrilled to have partnered with SLAC National Accelerator Laboratory in the USA to deliver what are among the world’s most powerful image sensors, tuned to a level of performance and exacting standards we are so pleased to have achieved. We anticipate superb results of this very important ground-based astronomy system.” According to Steve Kahn, LSST Director , “During its ten- year survey, LSST will capture images of billions of never-before- seen astronomical objects, generating unprecedented amounts of data and helping to answer some of the universe’s biggest questions. The benefits produced by LSST will extend far beyond the astronomy community.” Employing the most sensitive and highest precision collection of sensors in its camera, LSST seeks to answer fundamental astronomy questions about dark matter, dark energy, near-Earth asteroids, transient optical objects (such as supernovae), and the formation of our Milky Way galaxy.

Fast Jet and Formula One technology sharing partnership signed between BAE Systems andWilliams

A new partnership agreement between ourselves, Williams Grand Prix Engineering Ltd andWilliams Advanced Engineering Ltd will see technology, expertise and skills shared between the world leading, technology-led engineering businesses across a range of areas including cockpit designs, augmented reality and advanced materials. Innovators here at BAE Systems play a key role in the development, manufacture and support of fast jets such

as the Eurofighter Typhoon, F-35 and Future Combat Air Systems and will now work in close collaboration with their peers at Williams, an organisation that has achieved decades of success in the ultra-competitive environment of Formula One. Drawing on each organisation’s skills, experience and knowledge, it is expected that the new partnership will devise and deliver projects to create game-changing

New-Tech Magazine Europe l 11

Latest News

innovations, ultimately influencing the design, performance and production of both fast jets and fast cars. Initial collaborations are likely to include: work on intuitive cockpit designs for fighter pilots and racing drivers, taking advantage of each organisation’s work in virtual and augmented reality; aerodynamics; lightweight

future combat aircraft initiative. Ian Muldowney, Engineering Director, BAE Systems Air said: “The Government’s Combat Air Strategy, published this summer, highlights the criticality of cutting-edge UK technology and Intellectual Property, including how this is generated, sustained and exploited. “As we begin to explore what

materials; and battery technology that could power solar powered unmanned air vehicles and the cars of the future. The companies will work together on product and technology development, co-ordinating funding where there is a mutual benefit in doing so. Opportunities to exploit existing intellectual property will also be explored to harness some of the latest developments in specialist low volume manufacture and expertise in vehicle dynamics in each organisation’s specialist sector. There will also be secondment opportunities for engineers across both companies. The partnership agreement follows on from previous valuable collaborations between the companies, which have included engineers from Williams Advanced Engineering using their expertise to help design and deliver a revolutionary cockpit simulator that gives BAE Systems a fully flexible and interactive cockpit to experiment with designs for work on its

will be required from a UK future combat air system, we must work harder than ever to answer these questions. Working with technology leaders outside of our own industry will help us find new ways of asking questions and think in a different way about the solutions.” Mike O’Driscoll, Chief Executive Officer of the Williams Group said: “We are pleased to be joining with BAE Systems in this strategic alliance. We look forward to growing this relationship still further and sharing expertise across the talented people at these iconic British companies, in engineering and beyond, to deliver significant benefits to our customers and partners.” The agreement will be overseen by a steering committee comprised of senior representatives from each organisation, chaired by Ian Muldowney, Engineering Director for BAE Systems Air

Rohde & Schwarz and Huawei conduct field trial precision latency measurements for 5G cellular V2X communication

Rohde & Schwarz and Huawei have successfully conducted cellular-

communication (URLLC). Important for advanced vehicle-to-X communication use cases, URLLC will enable automated driving in the future. In a joint project between Huawei and Rohde & Schwarz, a precision end- to-end delay measurement system for over-the-air IP transmissions was applied to

based 5G V2X latency measurements in vehicular environments in field tests in Munich and Shanghai. The initial measurements have shown that it is possible to achieve delays in the millisecond regime in a 5G network, demonstrating a superior latency performance in comparison to LTE.

5G V2X communication for cooperative driving applications in field tests in a moving car. A measurement accuracy below 2 µs for each transmitted IP packet was demonstrated. The transmitted data contained various IP traffic

One of the key use cases of 5G is ultra-reliable low-latency

12 l New-Tech Magazine Europe

Latest News

As latency is one of the key performance indicators of 5G and crucial for safety applications, such measurements could become an important criterion for future certification testing. Andreas Pauly, Executive Vice President Test &Measurement at Rohde & Schwarz, said: “We are delighted to collaborate with Huawei to contribute with our test and measurement expertise to 5G technology development. With a strong global footprint in the telco ecosystem and close cooperation with partners, Rohde & Schwarz is committed to further expanding our innovative test and measurement solutions to new automotive applications.”

streams including video, LIDAR and control data (ITS messages) for a tele-operated vehicle. The precision absolute time standards on both ends were derived from two independent GPS receivers. While the trial in Munich was related to a tele-operated driving project, the tests in Shanghai were related to a platoon V2X testing site, where a number of vehicles traveling together are electronically connected via wireless communication. The delay for transmission of one IP packet from source over-the-air to a (moving) receiver (sink) needs to be measured, spanning all delays introduced by the radio transmitter, propagation delay and radio receiver from/to IP packet level.

Siemens inaugurates new campus in Zug

Siemens AG inaugurated its new campus in Zug on December 5th. The Siemens Zug campus features a new office building with 1,000 work spaces and a newly constructed production building. The investment volume for new buildings, renovations and related measures amounts to CHF 250 million. The campus

Technologies. “We offer a full range of building technologies for fire detection, security and automation solutions to optimize sustainability, total cost of ownership and the user experience in buildings. Smart buildings are based on comprehensive analytics and use of digital building data.” Rebellius called the campus

is the international headquarters of the Siemens Building Technologies (BT) Division, which has 29,000 employees. Last year it posted worldwide sales of 6.6 billion euros. As Siemens reference projects, the buildings feature innovative building technology. “Siemens is one of Switzerland’s largest employers. We employ over 6,000 people here, including about 300 apprentices said Joe Kaeser, Chairman of the Siemens AG Managing Board. “Building Technologies with its headquarters in Zug will benefit more from digitalization than virtually any other industry. Next year, building technology will become a core element of the new operating company Smart Infrastructure (SI). Its global headquarters will then also be in Zug.” Zug has been home to Siemens Building Technologies since 1998, when Siemens took over the industrial activities of Elektrowatt AG. “With our investments in research and development, we are using the opportunities of digitalization to steadily evolve into a smart building company,” explained Matthias Rebellius, CEO of Siemens Building

a reference project that illustrates the opportunities of digitalization in building technology, energy efficiency and future-oriented working. “A smart building is flexible, it learns from previous interactions and it continually adapts to the needs of building users, thus actively contributing to their success.” Construction of the office and production buildings began in May 2016 and was completed in July 2018. The Siemens Zug campus is one of the first new projects to use Building Information Modeling (BIM) for design and construction. The digital twin – a 3D model of the building, enhanced with technical information relevant for later operations – is the foundation for efficient, cost-optimized and forward- looking building management. The campus complex is equipped with building automation, security and fire safety technology from Siemens BT. Particular emphasis was placed on sustainability and energy efficiency of the buildings. The office building meets the highest requirements of the LEED standard, earning it a Platinum certification; the production building

New-Tech Magazine Europe l 13

Latest News

meets the criteria for LEED Gold certification. An integrated building automation system with energy optimization based on the Desigo CC integrated building management platform controls the energy consumption and all the disciplines in the buildings. Energy-efficient heat pumps use water from Lake Zug as a heat source and for direct cooling. The campus buildings do not need fossil fuels to generate energy. The heating, ventilation and air conditioning systems are equipped with heat and cold recovery systems. Even the compressed air systems in production have an energy recovery system for water heating. The buildings have green roofs, and the office building uses approximately 1,500 m3 of rainwater. A photovoltaic system on the roof of the production building will go into operation in the spring of 2019. With its 56 x 56 meter footprint, the seven-story office building can accommodate 1,000 employees. It has 32,000 m2 of gross floor space, including 18,400 m2 of office space and 11,000 m2 in the two-story underground garage with 250 parking spaces. The building has a height of 25 meters. The three-story production building has a height of 16 meters, a footprint of 125 x 50 meters and two production

floors. The second upper floor of the building has 120 office spaces as well as additional space for occupational training and a laboratory. Delivery docks, nitrogen tanks and waste containers are integrated into the building to minimize noise for the neighboring residential area and to make it architecturally attractive. The campus also includes an existing office and production building, scheduled for modernization in 2021. Beginning in late 2022 it will house the approximately 450 employees of BT research and development. The city of Zug is taking over the former Siemens office building. The Siemens Zug campus is the international headquarters of the Siemens Building Technologies (BT) Division. The Siemens Building Technologies Division is not only a leading developer and supplier of products, systems solutions and services in building automation, energy efficiency, fire safety and security, but also a pioneer in building digitalization. In 2018, BT had more than 29,000 employees in more than 400 locations worldwide and posted sales totaling 6.6 billion euros. Building Technologies has been located in Zug since the takeover of the industrial activities of Elektrowatt in 1998. More than 1,700 employees work for BT in Zug.

we will have electric vans, buses and trucks.” The company is investing ten billion euros in the expansion of the Mercedes-Benz Cars electric fleet and another billion euros in the global battery production network within the worldwide production network. “With extensive orders for battery cells until the year 2030, we set Daimler buys battery cells in a total volume of 20 billion euros Daimler is taking the next step towards securing its CASE corporate strategy. The company already plays a leading role in all four areas of connectivity, autonomous, shared & services and electric. The combination of the individual fields plays a decisive role, especially in the transformation to electric mobility. Dr. Dieter Zetsche,

another important milestone for the electrification of our future electric vehicles of the EQ product and technology brand. In this way, together with our partners, we ensure the supply of our global battery production network today and in the future using the latest technologies,” says Wilko Stark, Member of the Divisional Board Mercedes-Benz Cars, Procurement and Supplier Quality since October 2018. The suppliers are already producing battery cells in Asia and Europe and are continuing to expand in Europe and additionally in the USA.

Chairman of the Board of Management of Daimler AG and Head of Mercedes-Benz Cars: “Our electric offensive continues to gain momentum. After investing billions of euros in the development of the electric fleet and the expansion of our global battery network, we are now taking the next step: With the purchase of battery cells for more than 20 billion euros, we are systematically pushing forward with the transformation into the electric future of our company. We plan a total of 130 electrified variants at Mercedes-Benz Cars by 2022. In addition,

14 l New-Tech Magazine Europe

Latest News

Mercedes-Benz Cars battery production network Daimler is investing more than one billion euros in a global battery production network within the worldwide production network of Mercedes-Benz Cars. The company purchases the cells on the world market. This ensures the best possible technology and focuses on the core competence of battery assembly. The global battery production network of Mercedes-Benz Cars will in the future consist of eight factories on three continents. The first factory in Kamenz is already in series production and the second factory there will start series production at the beginning of 2019. Two more factories will be built in Stuttgart-Untertürkheim, one at the company’s Sindelfingen site, and one each at the sites in Beijing (China), Bangkok (Thailand) and Tuscaloosa (USA). The local production of batteries is an important success factor in Mercedes-Benz Cars’ electric offensive and is decisive for meeting the global demand for electric vehicles flexibly and efficiently. As an integral and important element of our electrical strategy. Competences for the technological evaluation of cells as well as research and development activities will be consistently expanded. These include the continuous optimization of the current generation of Li-ion systems, the further development of cells bought on the world market and research of the next generation of so-called post-lithium-ion systems. Mercedes-Benz Cars electric offensive By 2022, the entire Mercedes portfolio is to be electrified, with various electrified alternatives available in every segment, from the smart to the SUVs. In total, there will be well over 130 variants, from the 48-volt electrical system to EQ Boost and plug-in hybrids and more than ten all-electric vehicles powered by batteries or fuel cells. By 2025, sales of battery- electric vehicles are to increase to 15-25 percent of total unit sales – depending on individual customer preferences and the development of the public infrastructure. Daimler commercial vehicles with an extensive electric portfolio Daimler has been gaining experience with electric trucks since 2010 and has had its first all-electric truck in series production on the market and in customers’ hands since last year: the Fuso eCanter light-duty truck. The all-electric eActros for heavy-duty distribution transport has also been proving its worth on Germany’s roads since June 2018. In September, Mercedes-Benz Trucks handed over the first of a total of ten eActros trucks of the so-called innovation fleet to a customer

for use in everyday operations. Series production in the bus segment began in autumn this year and the first Mercedes- Benz eCitaro was recently delivered to Hamburg’s public transport operator – Hamburger Hochbahn AG. Mercedes- Benz Vans electrifies its entire commercial fleet. It starts with the all-electric mid-size van eVito, which has been delivered since November 2018. The eSprinter will follow in the second half of 2019. At the same time, Mercedes-Benz Vans thinks beyond the vehicle and, together with the customers, develops an overall system solution for the respective vehicle fleet. Two examples for the close integration of the customer perspective are the pilot projects with Hermes and Amazon Logistics. Hermes Germany will receive 1,500 Mercedes-Benz electric transporters and the corresponding efficient charging infrastructure. Amazon Logistics takes over 100 eVito in Bochum and Dusseldorf. The vehicles from Daimler Trucks, Daimler Buses and Mercedes-Benz Vans thus provide an electrical solution for all segments in inner-city traffic. Sustainable supply of raw materials Sustainability is one of the basic principles of Daimler’s corporate strategy as well as being a benchmark for corporate success. This also includes the responsible procurement of raw materials. Daimler has therefore developed a systematic approach to respecting human rights: the Human Rights Respect System. With its risk-oriented and systematic approach, the system makes the subject of human rights manageable even along complex supply chains. Daimler attaches particular importance to a sustainable raw-material supply chain for the expected growth in electric vehicles. To this end, Daimler has been defining sustainability requirements for suppliers in its Supplier Sustainability Standards for several years. All new Mercedes-Benz suppliers are subjected to potential analyses before they are commissioned. Approximately 700 quality engineers carry out these audits, if necessary together with human rights experts in the field. A prerequisite for a supply contract with Mercedes-Benz Cars is consent to disclosure of the entire supply chain, right back to the mines. Essential elements of our requirements for suppliers relate to working conditions and compliance with human rights. The direct suppliers undertake to firmly pass on and monitor our sustainability standards within the supply chain. Responsibility for the procurement of raw materials for the production of battery cells lies with the suppliers. However, Daimler does not leave its partners alone with this task and supports them with interdisciplinary teams.

New-Tech Magazine Europe l 15

A smart shoe for athletes and diabetics

Ann Monté, researcher at CMST and Fien Burg, research manager at RSscan

CMST, an imec lab at Ghent University, and Holst Centre, founded by imec and TNO, are working on an intelligent shoe sole with the Belgian company, RSscan. This sole contains around 900 sensors and measures the distribution of pressure on the sole of the foot when you walk or run. Knowing this is of interest to elite athletes and patients going through rehab, as well as for diabetes patients. Unique about this new development are the large number of sensors in the sole, the high rate of frequency at which readings are taken and the fact the electronics used are extremely thin and bendable. RSscan aims to bring the product to market by 2020 at the latest. Preventing injuries in sportspeople The way we walk (or run) is very individual. This can be seen from a

person’s running style, for instance, but you also need to be able to see the sole of the foot from below. If you can, you’ll see that every person’s pressure profile is different. Walking or running incorrectly can lead ultimately to issues such as back and hip problems. And if you are ‘extreme’ in the way you walk, run or jump – the way athletes do – it can even result in seri-ous and long-lasting injuries. Fortunately, these problems can often be solved by wearing the right shoes or having the correct soles. Today, there are systems on the market – sensor plates – of approximately 0.5 by 2 meters. The sole of your foot is measured when you run or walk over these plates. Then, based on these measurements, you can make the right selection from the wide range of the shoes and soles available on the market. The Belgian

company RS Print – a sister company of RSscan – even takes things a step further (no pun intended!): based on the measurements, a 3D printer is able to produce a personalized sole. And Fitstation – a joint initiative between RSscan and HP – us-es the pressure readings and a 3D scan of your foot to produce a shoe customized just for you. Preventing amputations in diabetics Far and away the largest market for sensor plates is the diabetes market. In Belgium alone there are some 600,000 people who have diabetes, of whom around 15%, over time, will develop injuries to the soles of their feet, including in places that are subject to high forces of pressure. In 1 in 15 cases, these injuries can lead to the amputation of the foot and

16 l New-Tech Magazine Europe

sometimes the lower leg as well. “But with early detection and treatment, around 80% of amputations can be avoided.” The peak pressure value and impulse (pressure over time) are im-portant predictive parameters that may provide an indication con-nected to the risk of ulceration. Today, these parameters can be measured using sensor plates that the patient walks across. Howev- er, sensor soles in the shoe should enable far more accurate read-ings to be taken, plus they can also be used in combination with a corrective sole or shoe to check whether the problem has been rem-edied in this way. From sensor plate to sensor sole A sensor plate makes it possible to measure the pressure profile be-tween the plate and the foot (or shoe, if the person is wearing shoes). Typically, these readings will be taken at the doctor or in a store such as a runners’ lab or other location where the sensor plate is available. Sensor soles – which can just be inserted into some-one’s shoe – offer many new possibilities compared with sensor plates. In particular, sensor soles enable readings to be taken inside the shoe rather than underneath it. That way, one can obtain a very clear picture of the exact effect the shoe (and the corrective sole) is having on the foot movement. Also, with a sensor sole, you can track a person’s movement pattern over a longer period of time – days or weeks. The Belgian company RSscan had been playing around with this idea for some time. Then, when the EU InForMed project was launched, RSscan saw it as the ideal opportunity to get to work with research-ers from CMST/imec and Holst Centre on the topic. “In particular, sensor soles enable readings to be taken in-side the shoe rather than underneath it.”

Fig 1: Today, sensor plates are used to help people such as athletes to select the right shoes and soles for them, based on the pressure profile measured while walking or running.

Two potential technologies CMST/imec and Holst Centre each have their own area of expertise that may be of interest for the product that RSscan ultimately brings to market. CMST/imec uses polyimide as the carrier for its ‘flexible electronics’, with laminated copper on both sides. Sensors and inter-connections are then made by patterning the copper. Holst Centre works with thermoplastic polyurethane (TPU) and prints silver struc-tures on it using roll-to-roll techniques. Roll-to-roll printing is cheap-er, while copper etching allows to produce finer structures. Unique: multiple sensors and high measurement frequency The sensor sole is made up of two layers: one with sensors, while the other is a pressure-sensitive layer. When pressure is exerted on the pressure-sensitive layer, resistance is reduced and more current flows through the sensors. This makes it possible to measure differ-ences in pressure. Various sensor shapes have been trialed: square, round and finger-shaped structures. The interconnections have a unique winding structure that enables the sole to bend without losing function. The fact that this actually works can be seen from a test using a support

sole with a ‘deep liner’ at the heel. The sensors kept working while running the tests, despite the fact that the sensor sole was loaded in this curved position. The sensor layer has been designed in such a way that the custom-ized soles can be trimmed without losing the essential connections. Function was maintained in both size 39 and size 46. “The unique and most striking feature of the design is defi- nitely the sensor density: one sensor every 5 mm! The soles produced by most of RSscan’s competitors only have be-tween 10 and 13 sensors.” The high density is important for research purposes, as well as for the broad application of the sole. For certain medical problems, you need a high density of sensors at the heel, whereas for others it’s more on the front part of the sole. The measurement frequency that can be achieved with this sensor design and the supporting electronics is also unique. For example, speeds of 500 to 1000 Hz can be measured. Again, this is very im-portant for research and for doctors investigating specific com-plaints. On the market by 2020 The results from the InForMed

New-Tech Magazine Europe l 17

Fig 2: A prototype of the sensor sole was produced for the InForMed project by CMST/imec, Holst Centre and RSscan. On the left is the prototype based on thermoplastic polyurethane (TPU) and printed silver structures (Holst Centre). On the right is the prototype using polyi-mide as the carrier, with laminated copper on both sides (CMST).

project show that the sensor is now within reach for RSscan. Further development at RSscan will now focus on the electronics module and product design to provide opti-mum user-friendliness. Finding the best technology, i.e. roll-to-roll or copper etching, will be researched further with CMST/imec and Holst Centre. The sensor soles will be extremely use-friendly. First because they are so thin and second because the supporting electronics (data processing and storage, wireless radio) are very compact and hence, unlike with comparable products, they can be clicked on to the shoe. This means readings can be taken without you even noticing. Want to know more? You can find more information about the European ECSEL InForMed project on the project website. (grant nº 2014-2-662155) http://informed- project.eu/index.php You will find more information about RSscan on the company web-site. (http://www.rsscan.com/de/) RSscan was founded by the ath-lete Jempi Wilssens because he wanted to find a solution for the many injuries suffered by his fellow athletes. Read the RSscan story (http://www.rsscan. com/history/).

Find out how Ronaldo uses the RSscan sensor plate here (http://www. rsscan.com/resources/3697-2/). More information about the fitstation platform (https://www.rsscan. com/fitstation/) for 3D-printed personalized shoes and RS Print for 3D-printed personalized soles (http:// www.phits.be/nl/rs-print). Biography Ann Monté Ann Monté received the M.Sc. and Ph.D. degrees in electronics engi- neering from the University of Ghent, Belgium, in 2003 and 2008 respectively. Until today she is affiliated with the Inter-University Microelectronics Centre (imec), in the Cmst group at the University of Ghent. She is involved in research on the design of driver elec-tronics for both displays and lighting as well as

in the design of inte-grated sensor systems. She is author or co-author of 25 papers in international technical journals and conference proceedings. Biography Fien Burg Fien Burg received her master's degree in Rehabilitation Sciences and Physiotherapy in 2007 at KU Leuven, Belgium. In 2009, she obtained an additional certificate in Biomedical and Clinical Engi-neering Techniques, also at KU Leuven. In 2014 she received her doctoral degree in Biomedical Sciences titled 'Biomechanics of the foot-ankle complex before and after total ankle arthroplasty: An in vivo and in vitro analysis'. Since 2014, she is active as Research Manager at rs scan International.

18 l New-Tech Magazine Europe

CABLES CABLES TM HAND FLEX

Hand Flex Cables conform to any shape required.

$ 12 95

DC to18GHz

from ea. (qty.1-9) Get the performance of semi-rigid cable, and the versatility of a flexible assembly. Mini-Circuits Hand Flex cables offer the mechanical and electrical stability of semi-rigid cables, but they’re easily shaped by hand to quickly form any configuration needed for your assembly, system, or test rack. Wherever they’re used, the savings in time and materials really adds up! Hand Flex cables deliver excellent return loss (33 dB typ. at 9 GHz for a 3-inch cable) and low insertion loss (0.2 dB typ. at 9 GHz for a 3-inch cable). Why waste time measuring and bending semi-rigid cables when you can easily install a Hand Flex interconnect? Excellent return loss, low insertion loss, DC-18 GHz.

Hand Flex cables are available in 0.086" and 0.141" diameters, with a tight turn radius of 6 or 8 mm, respectively. Choose from SMA, SMA Right-Angle, SMA Bulkhead, SMP Right-Angle Snap-On and N-Type connectors to support a wide variety of system configurations. Two popular diameters to fit your needs. Standard lengths from 3 to 50" are in stock for same-day shipping. You can even get a Designer’s Kit, so you always have a few on hand. Custom lengths and right-anglemodels are also available by preorder. Check out our website for details, and simplify your high-frequency connections with Hand Flex! Standard lengths in stock, custom models available . o S COMPLIANT RoHS compliant

NEW

N-Type Bulkhead

N-Type

SMA Right Angle SMA Bulkhead

SMP Right Angle Snap-On

SMA

Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com

482 Rev. N

How innovation can shape the payment card market of the future

SEBASTIEN CLAMAGIRAND, NXP BLOG

Where is the payment card industry heading? With more than three billion shipments per annum the payment card market continues to grow globally. Aside to this growth, it is also undergoing significant changes with a strong migration from EMV contact cards to EMV dual interface cards (especially in US, Latin America, Southeast Asia and India). Additionally, magnetic stripe cards are disappearing and only represent a small portion of the overall market today. Card usage is also expanding strongly with over 500 billion transactions in 2017 and consistent year on year growth of 10% since 2010. A changing payment card market has brought big challenges for the industry: In the last three years the price for both contact and dual interface cards has dropped by two thirds. The now standardized, partly commoditized payment smart card has put pressure on the entire ecosystem and leaves ecosystem players looking for ways to

bring innovation and value back to the card. The battle to capture the transaction Considering these challenges and the reality that other form factors like mobile continue to grow in the market, it is legitimate to ask whether the payment card is still a vehicle for innovation, or whether it will be replaced by more convenient ways to pay? When answering this question, one needs to understand that new form factors such as mobile payment are not necessarily cannibalizing, but complementary. Meaning as card and mobile payment become the dominant way to pay, the question is rather: Is there a future for cash? The real battle is not between different form factors, where the transaction is authenticated with a secure element, the real battle is taking place with cash and other insecure ways to pay,

such as QR code. For this reason, several governments have launched initiatives for their own national payment standard, for example RuPay in India, NSICCS in Indonesia or VCCS in Vietnam. The Indian government has the stated aim of demonetization. To reach this goal, it has already triggered the issuance of hundreds of millions of RuPay bank cards and introduced a mobile application to complement this. India has now reached over one billion cards in circulation, coming from under 400M pieces in 2014. Bringing innovation to the payment card Although new form factors have emerged, the payment card can still be an object for innovation. One key opportunity is bringing multiple use cases to a single card and making transaction authentication even more flexible, faster and more secure. The convergence of applications is a

20 l New-Tech Magazine Europe

key concept for the payment market of the future. This means that one card can serve several functions, such as payment, transit, identification or loyalty. The Santander University Card for payment, access and transit or the Bangkok Rabbit card for payment, transit and loyalty are already examples for cards that combine different functionalities. Emerging markets especially, such as South Asia-Pacific, India, China and Latin America have huge potential for convergence. With JCOP 4 P71, NXP is now bringing to market a product with both a new benchmark for transaction speed (under 200ms) as well as multi- application capability through MIFARE ® DESFire ® EV2 implementation. Through combining best-in-class performance and maximum flexibility, NXP now offers the fastest, highly flexible and future product in the market. Another hot topic for transactions is biometric authentication, which allows for the replacement of PIN and simultaneously makes transactions even more secure. Biometric cards can be deployed both in mature EMV markets like Europe for convenience and security, as well as emerging markets like Middle East, Africa and APAC as a financial inclusion tool. Fingerprint on cards – Security by design As the potential of biometric authentication is recognized by the industry, fingerprint on card is moving from concept to the first pilots in the market. This is how it works: consumers authenticate transactions by placing their finger on a fingerprint sensor embedded in the card when paying at the point of sale. Safety is ensured as the consumer’s fingerprint is stored only in the secure chip within the card. The matching of the scanned fingerprint with the stored one is executed within the same secure chip. The bank or merchant never gets access to the consumer’s biometric

since 2011), the need to stay ahead of the fraudsters becomes both more difficult and important. The need to balance security with the simplicity desired by the consumer is a key challenge in addressing this. Biometric has the potential to not only improve the convenience and security at the point-of-sale, but also to add security in the card-not-present online space, for instance through dynamic CVV or tokens for online authentication. Despite its growth and the changing landscape of the payment industry, consumer convenience and security remain at the heart of the transaction. If payment cards continue to innovate and provide a useful service, then they will stay as relevant as they have been for the last 50 years. The big advantage that cards have, is that so far there has been no other form factor which is as robust, lightweight, secure and convenient to replace them.

data, which counters potential privacy concerns. For convenience reasons, consumers themselves can store their fingerprint in the secure chip on the card via an easy to use home enrollment kit, which only takes a few minutes. As an alternative this enrollment can be done at a terminal in the bank branch too. The idea is simple: when using fingerprint authentication on the payment card, users can make secure point of sale payments without wasting time entering PINs or signing the receipt and without any changes in the existing EMV/POS contactless infrastructure. Here NXP introduces SPM60; a biometric secure processing module enabling a “Wave & Go” transaction in under 1 second which adds convenience to the payment process and paves the way for a seamless customer payment experience. The matching of the fingerprint happens in the secure chip within the card, ensuring secure transactions. As a fully integrated one module solution, without the need of battery support, it allows an easy integration in a card body by using standard manufacturing processes. The challenges of an ever- changing industry As payment card fraud continues to grow steeply (by 18% year on year

New-Tech Magazine Europe l 21