New-Tech Europe Magazine | July 2016 | Digital edition

new products

Five new STM32L43x and STM32L44x MCU product lines comprise variants with versatile combinations of an integrated USB controller, an LCD controller, and cryptography for security- conscious applications. Up to 256KByte of Flash and low-pin- count-package choices make them ideal for cost-sensitive applications. The new devices also offer rich digital peripherals including a True Random-Number Generator (TRNG) and smart analog features such as a 12-bit 5Msample/s ADC, internal voltage reference, and ultra-low-power comparators. All devices deliver the advantages of ST’s innovative low-power technology, which includes FlexPowerControl (FPC) with features such as separate supply- voltage domains for gating power individually to analog peripherals, USB circuits, and I/Os. Batch- Acquisition Mode (BAM) enables energy-efficient data capture and seven reduced-power modes with further sub-modes maximize energy savings in a wide range of operating conditions. ST’s low-power technologies, combined with the performance of the 32-bit ARM Cortex®-M4F core, ensure high efficiency according to EEMBC™ ULPBench™ tests. The STM32L433 is certified at 177 ULPMark™-CP[1] at 3.0V, tested without the aid of a step-down converter. Aided by ST’s innovative ART Accelerator™, outright performance is also high at 273 CoreMark®. The new devices are available

Toshiba Launches

STMicroelectronics Releases Development Ecosystem and Adds New Devices in Low-Power STM32L4 Microcontroller Series STMicroelectronics has introduced the development ecosystem for its latest low-power, high-performance STM32L4 microcontrollers (MCU) and expanded the series with five new product lines comprising a range of package and memory- density options. STMicroelectronics Releases Development Ecosystem and Adds New Devices in Low- Power STM32L4 Microcontroller Series The expanded STM32L4 ecosystem builds on ST’s free and easy-to- use STM32Cube platform. This comprises the STM32CubeMX initialization-code generator and configurator with easy-to-use power estimation for ultra-low-power design, and the STM32CubeL4 package that contains middleware components, Nucleo-32 Board- Support Package (BSP), Hardware Abstraction Layer (HAL), and Low- Layer APIs (LLAPIs). For a quick start to new projects, the slim-form- factor NUCLEO-L432KC board – the first Nucleo-32 board to integrate an MCU in the tiny QFN32 package - includes an STM32L432KCU6 device (UFQFPN32) and provides direct access to ARM® mbed™ online tools. Its Arduino Nano pin layout simplifies function extensions, and the integrated ST-Link debugger/programmer supports mass storage and allows probe-free debugging.

Photorelays for Semiconductor Testers in Industry’s Smallest Package Toshiba Corporation’s (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of photorelays in the industry's smallest[1] package. Shipments start from today. The new product, "TLP3406S", utilizes the industry's smallest package for photorelays, the Toshiba-developed S-VSON4 package. Compared to Toshiba’s previous products in a VSON4 package, the new photorelay has an approximately 22.5%[2] smaller assembly area, which can contribute to the development of smaller test boards and also make it possible to increase the number of photorelays on a board to increase density. Since the new photorelay can drive large currents of up to 1.5A, in spite of its small package, it can be used in device power supplies (DPS) that make up the power supply circuits in various testers. As a further positive, the operating temperature range has been enhanced from 85 degrees Celsius (max.) to 110 degrees Celsius (max.).

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