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Motion Automotive FPGA and mixed-signal part numbers alongside their corresponding Defense Logistics Agency )DLA( drawing numbers, please refer to the DLA Cross Reference Guide. Development Tools The RTG4 FPGAs are supported by development kits, mechanical samples and daisy chain packages for board validation and testing. Libero® SoC Design Suite enables RTL entry through programming and includes a rich IP library, complete reference designs and development kits. Availability For additional information or to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Computers Communication

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cycles from −65  C to 150  C junction temperature. The lead-free flip-chip bump interface connections passed MIL-PRF-38535 inspection criteria and exhibited no signs of tin whiskers. The flip-chip bump is inside the FPGA package, so there is no impact on the user’s design, reflow profile, thermal management or board assembly flow when converting to lead-free bump RTG4 FPGAs. Microchip boasts one of the industry’s most comprehensive space product portfolios of radiation-hardened and RT solutions that include QML Class Q RT PolarFire® FPGAs and sub-QML FPGAs that bridge the gap between traditional Qualified Manufacturers List )QML( components and Commercial Off-The-Shelf )COTS( components. For a comprehensive listing of Microchip

Purchasing and Client Services website, www.microchipdirect.com. Microchip Technology Israel Phone- 972-9-744-7705 Mobile- 972-54-775-5762 avidan.perry@microchip.com

Microchip Technology Expands Processing Portfolio to Include Multi-Core 64-Bit Microprocessors PIC64GX MPU is the first of several product lines planned for Microchip’s PIC64 portfolio

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