New-Tech Europe Magazine | July 2019 | Digital Edition

July 2019

16 Making Inroads into High Speed Vision 22 How To Optimize Solder Stencil Aperture To Increase Connector Options 26 Massive MIMO and Beamforming: The Signal Processing Behind the 5G Buzzwords 32 An Introduction to Embedded Motion Control

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8 l New-Tech Magazine Europe

Contents

14 LATEST NEWS 16 Making Inroads into High Speed Vision 22 How To Optimize Solder Stencil Aperture To Increase Connector Options 26 Massive MIMO and Beamforming: The Signal Processing Behind the 5G Buzzwords 32 An Introduction to Embedded Motion Control

16

36 OUT OF THE BOX 38 NEW PRODUCTS 46 INDEX

22

26

32

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New-Tech Magazine Europe l 9

Latest News

Ficosa, first global manufacturer to receive the European RED certification for C-V2X technology from its CarCom platform

This certification is a recognition of Ficosa’s innovation in the automotive sector and a demonstration of the maturity of solutions such as its CarCom platform. The company was also a pioneer in testing the C-V2X technology in the US intelligent cities largest pilot program. Ficosa, leading global provider

the best technological partners, such like Qualcomm and Dekra, which has been key to make this important achievement.” Ficosa develops solutions for connecting cars with infrastructures and with other vehicles through the available technologies: both with DSRC (802.11p) and cellular technology (C-V2X). CarCom

dedicated to research, development, production andmarketing of vision, safety, communication and efficiency systems for the automotive and mobility sectors, has been the first global manufacturer to receive European RED certification for its CarCom platform with Cellular-V2X technology. This platform integrates Qualcomm’s latest technology and has been certified in collaboration with Dekra Laboratories. In words of Joan Palacín, director of the Advanced Communications Business Unit of Ficosa: “This certification is a recognition of the dedication and all our efforts in developing and accelerating the arrival of the connected car to the market, innovating in solutions that make it possible as we already demonstrated in several pilots in 2018 integrating CarCom On Board Units in more than 500 vehicles. We are happy to count on the full support of What’s New Intel, in collaboration with 10 industry leaders in automotive and autonomous driving technology, today published “Safety First for Automated Driving,” a framework for the design, development, verification and validation of safe automated passenger vehicles (AVs). The paper builds on Intel’s model for safer AV decision-making known as Responsibility-Sensitive Safety (RSS). “Industry collaboration on the safety of automated vehicles is key to realizing a safe and responsible autonomous future. We are proud to have contributed to the groundbreaking

platform allows integrating the two connectivity options in a modular way and there is also a dual mode variant available. In the Mobile World Congress 2019 edition held in Barcelona, the company also tested its C-V2X technology in the 5G Connected Car pilot project. Thanks to this, the different use cases based on C-V2X were put into operation in a real test environment including a 5G base station. “For Ficosa, connectivity and safety are the main concepts for the development of autonomous driving. In this sense, V2X technology is unique because, in addition to being a first level connectivity tool, it is capable of preventing accidents, and this is vital for the future of our industry”, says Joan Palacín. With this RED certification, Ficosa is positioned as one of the main suppliers of automotive components in collaborative systems for smart cities (C-ITS). work to establish a framework for introducing automated vehicles that are safe by design. We look forward to collaboration with additional industry partners on this comprehensive framework as well as on Intel’s RSS model.” –Jack Weast, Intel senior principal engineer and vice president of Automated Vehicle Standards at Mobileye, an Intel company Why It Matters Developing AVs that are verifiably safe by design is critical to enabling higher levels of autonomy on

Intel and Auto Industry Leaders Publish New Automated Driving Safety Framework

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The Role of RSS A shared vision to reduce traffic fatalities through driverless technology has yielded a wide range of approaches throughout the industry. “Safety First for Automated Driving” reconciles the many different approaches into a cohesive whole where only the best and safest approach is

public roads. “Safety First for Automated Driving” brings together vast expertise from leading global automakers, suppliers and technology providers in the industry’s first comprehensive guidance for developing safe- by-design AVs.

How It Works The foundation of the paper is 12 guiding principles and the steps necessary to realize them. Each principle is refined into a series of capabilities that a safe AV must support; safety elements are then derived to implement the capabilities. (Descriptions of the principles begin on page five of the paper.) Intel’s RSS model is highlighted under the Drive Planning Element that supports a capability to “create a collision-free and lawful driving plan.” This element achieves the top- level principle to behave safely as a means to understand, predict and manage the manners of AVs and help ensure they conform to the rules of the road.

taken. RSS was proposed in 2017 as a technology-neutral starting point for the industry to align on what it means for an AV to drive safely. RSS formalizes human notions of common sense driving into a set of mathematical formulas that are transparent and verifiable, providing a “safety envelope” around an AV’s decision-making capabilities. “Safety First for Automated Driving” adds to the momentum behind the global acceptance of RSS, including recent support lent by technology leader Baidu*, automotive supplier Valeo*, standards body China ITS* and others.

Semiconductor Industry Capex Forecast to Slump in 2019 and 2020

Five of the past six semiconductor industry capex downturns have lasted two years before recovering. IC Insights will release its 200+ page Mid-Year Update to the 2019 McClean Report next month. A portion of the Mid-Year Update will examine semiconductor industry capital spending trends with

double-digits rates for one or two years (1985-1986, 1992, 1997-1998, 2001-2002, 2008- 2009, and 2012-2013): , Formula E in Paris: Audi drivers brave April weather In every case between 1983 and 2010 where spending declined, a surge in spending of at least 45% occurred two years later. The second year

an industry-wide forecast through 2023. In addition, the Update will include IC Insights’ capital spending forecast for each of the 32 major spenders for 2019 and 2020. Figure 1 shows the annual capital spending changes from 1983 through IC Insights’ forecast for 2019 and 2020. Over the past 34 years, there have been six periods when semiconductor industry capital spending declined by

increases in spending after the cutbacks were typically stronger than the first year after a downturn since most semiconductor producers acted very conservatively coming out of the slowdown and waited until they had logged 4-6 quarters of good operating results before significantly increasing their capital spending again. This is expected to be the case for 2020 with most semiconductor producers

New-Tech Magazine Europe l 11

Latest News

likely to be very conservative with their spending budgets for next year given the poor semiconductor market expected in 2019. IC Insights believes that Micron’s attitude toward next year’s capital spending outlook will be representative of the industry in general. In its most recent conference call, Micron stated that, “For fiscal 2020, we plan for capex to be meaningfully lower than fiscal 2019.” As shown in Figure 1, the streak of strong ≥45% capital spending growth two years after spending cutbacks ended

in 2015, with capital spending registering a 1% decline. Moreover, only a 4% increase occurred 2016. Although capital spending jumped by 41% in 2017 (four years after the 2012-2013 downturn in spending), IC Insights believes that the relatively muted cyclical behavior of the capex growth rates since 2013, as compared to past cycles, is another indication of a maturing semiconductor industry.

How to get a server rack in your back pocket? Imec, a world-leading research and innovation hub in nanoelectronics

process technology platforms that are being developed by the European research technology organizations and cooperating foundries in the project, and combining it with the application and hardware knowledge from further partners. The TEMPO project will evaluate the current solutions at device,

and digital technologies, presents TEMPO: a unique cross-border collaboration between 19 research and industrial partners, funded by ECSEL Joint Undertaking which supports public-private partnerships in the EU. The

architecture and application level, and build and expand the technology roadmap for European AI hardware platforms. The project will leverage MRAM (imec), FeRAM (Fraunhofer) and RRAM (CEA-Leti) memory to implement both spiking neural network (SNN) and deep neural network (DNN) accelerators for 8 different use cases, ranging from consumer to automotive and medical applications. Emmanuel Sabonnadiere, CEO at CEA-Leti: “It is our aim to sweep technology options, covering emerging memories, and attempt to pair them with contemporary (DNN) and exploratory (SNN) neuromorphic computing paradigms. The process- and design-compatibility of each technology option will be assessed with respect to established integration practices and meet our industrial partner roadmaps and needs to prepare the future market of Edge IA where Europe is well positioned with multiple disruptive technologies.” Prof. Hubert Lakner, Director of the Fraunhofer Institute for Photonic Microsystems (IPMS) and Chairman of the Board of Directors of the Fraunhofer Group Microelectronics: “A key enabler for machine learning and pattern recognition is the capability of the algorithms to browse through large

three-year program aims at developing process technology and hardware platforms leveraging emerging memory technologies for neuromorphic computing for future applications in mobile devices that need complex machine- learning algorithms. It is a one-of-a-kind collaboration effort to enable applications that now need cloud-based server racks, to be executed within battery-powered mobile devices such as cars and smartphones (at the edge of the internet-of-things). Increasingly, edge artificial intelligence and machine- learning algorithms enter our day-to-day products and applications such as smart home assistants with natural- language processing, face-recognition-based security systems or autonomous vehicles. In the coming years, the demand for these increasingly complex computational algorithms will only grow further. At this moment, high- end server parks process the data in the cloud. However, sending data to the cloud costs energy, latency, and is often not preferred for privacy reasons. As such, the ultimate edge artificial intelligence applications require intelligent energy-efficient local processing. TEMPO aims to tackle this challenge by leveraging the

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Latest News

datasets. Which, in terms of hardware, means having rapid access to large memory blocks. Therefore, one of the key focal areas of TEMPO are energy efficient nonvolatile emerging memory technologies and novel ways to design and process memory and processing blocks on chip.” Luc Van den hove, CEO at imec: “We are delighted to enter in such broad European collaboration effort on Edge Artificial Intelligence, gathering the relevant stakeholders in Europe, including CEA-Leti and Fraunhofer, two of our most

renowned colleague research centers in Europe. Thanks to our combined expertise, we can scan more potential routes forward than what would be possible by each of us individually, and as such, position Europe in the driver seat for R&D on AI. Imec looks forward to the progress we can make together in the TEMPO project and hopes this will lead to more similar collaborations in the future. Behind the scenes, we are already defining more public and bilateral agreements with several of the partners involved.”

Wheel Reinvented – REE Emerges from Stealth to Power the Future of Mobility

REE is pioneering the future of electric mobility by reimagining the vehicle, creating the world’s first truly flat and modular skateboard chassis for a more efficient, reliable and scalable electric future. REE unveiled today its revolutionary flat and modular platform which fundamentally changes the way electric

from a high performance car able to do 0-60 mph in less than 3 seconds to an off-road SUV with advanced active suspension technology. The platform can also be used as the base of a robotaxi or even a 10-ton cross country truck. “The concepts of the past are limited and restrict the ability

vehicles are built to power widespread vehicle electrification. By integrating all of the components formerly found under the hood of the car into the wheel, REE offers optimal freedom of design, multiple body configurations on a single platform, reduced vehicle size and weight, and increased energy and operational efficiency. REE’s unique approach strategically places the motor, steering, suspension, drivetrain, sensing, brakes, thermal systems and electronics into the wheel, creating a truly flat platform. This design provides a low center of gravity to maximize efficiency and supports the vehicle’s agility and stability. REE’s innovation drastically reduces a vehicle’s footprint, weight, and improves both energy efficiency and performance – aspects crucial to the electric and autonomous vehicle revolution. , LIVING SPACE SOLUTIONS SHOWCASE AT LG INNOFEST EUROPE REE’s platform provides automakers, mobility providers and delivery companies a tailor-made solution. Based on a novel quad-motor system, and including active height-levelling suspension, steer-by-wire and a smart quad-gear box, REE’s technology provides the basis of any type of vehicle

of the automotive industry to realize the electric and autonomous reality they are striving for. Until now, the industry has operated by making incremental improvements on the traditional design of the automotive vehicle. At REE, we believe that in order to hasten the automotive revolution we need to reinvent the wheel – quite literally,” said Daniel Barel, Co-Founder and CEO of REE. The adaptation of REE’s universal framework will replace multiple platforms for OEMs resulting in substantial savings. The design and validation of each platform traditionally costs manufacturers $20 billion. By enabling them to utilize one platform for all of their vehicles, costs will be slashed, while performance, safety, comfort and energy efficiency will all be drastically improved. REE is already collaborating with leading OEMs as well as Tier-1 and Tier-2 automotive companies including Mitsubishi Corporation, Mushashi, Linamar, Tenneco and NXP among others. About REE: REE is fundamentally reinventing the way in which vehicles

New-Tech Magazine Europe l 13

Latest News

the development of future mobility. REE’s unique approach enables manufacturers to easily redesign and repurpose vehicles to meet radically shifting and developing automotive needs. REE was founded by Daniel Barel and Avishay Sardes who are also the founders of SoftWheel. More information about REE can be found here: www.ree.auto

are built. Through best-in-class technologies and an innovative design, REE’s technology integrates the motors, steering, suspension, drivetrain, sensing, brakes, thermal systems and power management into the wheel creating a completely flat modular chassis. This results in unrivalled efficiency and performance that will power the electrification process and be a crucial step in

Industry digitalization a reality as Ericsson Tallinn 5G production goes wireless

Ericsson and Nordic-based service provider Telia have brought automated guided vehicles, Augmented Reality (AR), and a huge number of sensors to life at Ericsson’s manufacturing facility in Tallinn, Estonia, via a dedicated cellular network. The resulting mobile

Augmented Reality The second solution is Augmented Reality (AR) troubleshooting, which is providing an interactive method for the quality control and testing of electronics components. By using AR glasses or terminals, the troubleshooter gets an overlay with all manuals, instructions

communication is delivering the capacity, customization, and control needed to scale and secure the connected factory, improving manufacturing operations. At 25,000sq m, the Tallinn supply site is one of Ericsson’s largest manufacturing units, incorporating R&D activities and volume production. To increase production efficiency and sustainability, Telia and Ericsson jointly piloted a new dedicated cellular network for Internet of Things (IoT) within the factory. With testing finalized in June, the network now supports three innovative processes to enable more efficient production. Automated Guided Vehicles The first solution to benefit from the dedicated cellular network is Automated Guided Vehicles (AGVs) delivering product components from warehouse to the production lines. The AGVs can now communicate with the control system, provide a live stream of data and video, as well as use the dedicated network to open doors. Transporting components is a labor-intensive, costly and repetitive task where AGVs can save time, reduce the risk of damaging components, and cut waste.

and collective knowledge of other troubleshooters, allowing them to quickly identify potential problems. Field tests have shown a 50 percent reduction in time spent on troubleshooting circuit boards when using AR. Environmental Monitoring The third solution enables the Tallinn factory to monitor the environment using mobile sensors to measure moisture, temperature, noise, light, and carbon dioxide. The goal is to provide employees with a safe and healthy work environment while minimizing the risk of production defects. The dedicated cellular network has the capacity to handle thousands of sensors in a factory, allowing them to be relocated as the layout of the factory evolves. The on-site network taps Ericsson Private Networks and Industry Connect solutions. Robert Pajos, CEO, Telia, Estonia: “The Ericsson factory becomes the first in Estonia to implement these innovative solutions using private networks and industry connect for cellular IoT. Companies have a need to connect everything in their production environment, including sensors, tools, robots, vehicles and the goods they handle or

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Latest News

“Mobile networks meet the requirements to support diverse smart manufacturing use cases, making it possible to securely and efficiently optimize manufacturing processes. They allow massive real-time data collection and analytics and intelligent automation on the factory floor, solving operational challenges and creating a more sustainable, efficient and safer production environment.”

produce. As the demand to connect more things increases, the need for high-quality networks grows with it. 4G and 5G mobile communications is the best option for secure, reliable connectivity with high throughput and low latency. Our cooperation with Ericsson shows our joint capacity to create these network solutions for the future.” Lars Ottoson, Head of Supply Site Tallinn, Ericsson, says:

Automotive and Mobility Industry Leaders Publish First-of- its-Kind Framework for Safe Automated Driving Systems.

DATELINE – Emphasizing safety by design, 11 industry leaders across the automotive and automated driving technology spectrum today published “Safety First for Automated Driving,” (SaFAD), a non-binding

are derived to support the capability and achieve the guiding principles. “Safety First for Automated Driving” combines the expertise from key companies in the automaker, supplier and technology industries to help

organized framework for the development, testing and validation of safe automated passenger vehicles. These 11 leaders — Aptiv, Audi, Baidu, BMW, Continental, Daimler, FCA US LLC, HERE, Infineon, Intel and Volkswagen — comprise the broadest representation across the industry and have published, to date, the largest report on how to build, test and operate a safe automated vehicle. The SaFAD white paper authors’ purpose is to emphasize the importance of safety by design, along with verification and validation, as the industry works toward creating standards for automated driving. For the first time, SaFAD offers automated vehicle (AV) developers and operators a system for clear traceability that proves AVs to be “safer than the average driver” through components such as cameras or steering systems. It is also the first time presenting a summary of widely known safety by design and verification and validation methods of Level 3 and Level 4 automated driving as defined by the SAE (J3016). The foundation of the SaFAD white paper is its 12 Guiding Principles, which are further refined into capabilities of the automated vehicle, from which safe-by-design elements

direct development of safe automated vehicles. Interest and development of automated driving technology has grown at a dramatic rate the past several years, fueled by the goal of reducing fatalities related to vehicle crashes, improvement of traffic flow and the introduction of new mobility concepts. This rapid growth brings a wide range of development methodologies from established companies and the growing roster of new enterprises. With publication of “Safety First for Automated Driving,” authors and experts from each of the participating partners will present the group’s work at industry and technology conferences internationally over the next several months. Note: In the spirit of collaboration, the companies are issuing a common press release. Journalists seeking more details are encouraged to contact one or more of the listed media contacts.

New-Tech Magazine Europe l 15

Making Inroads into High Speed Vision

Jenson Chang, LUCID Vision Labs

Since its introduction in 1980 and standardization in 1983 as IEEE 802.3, Ethernet allows computers to connect to other computers, servers, printers, scanners and other peripherals over single networks. These often use numerous switches that connect computers, printers and other wired devices to each other and are often wired to routers and models to allow Internet access. In office settings, especially, Ethernet is now the most popular and widely used network technology in the world with millions of computers and peripherals linked together with the standard. Like every other networking and interface standard, Ethernet has evolved from supporting data rates over ranging from the now obsolete 10BASE5 (10 Mbits/s), through 1000BASE-T (1 Gbits/s), and 10GBASE-T (10 Gbits/s). Newly introduced data rates over twisted

pair now include 25GBASE-T (25 Gbits/s) and 40GBASE-T (40 Gbits/s), part of the IEEE 802.3bq standard. In 2016, recognizing the need to develop a lower power, more cost- effective version of 10GBASE-T (10 Gbits/s) over twisted pair networks, the IEEE standards board ratified the 802.3bz standard which encompass 2.5GBASE-T and 5GBASE-T. A Balancing Act While 2.5GBASE-T specifies speeds of up to 2.5 Gbits/s and operating at distances to 100m over CAT 5e cable, the 5GBASE-T can operate as fast as 5Gbit/s at distances of 100m over CAT 6 cable. Although 10GBASE-T operates at 10Gbits/s and can be used for camera to computer distances of 55m (using CAT 6 cable) and 100m (using CAT 6A cable), Power over 10GBASE-T is not currently supported although it has been proven to work theoretically. In

addition, 2.5GBASE-T and 5GBASE-T allow system designers to forgo costly re-cabling of existing Ethernet solutions since the vast majority of installed Ethernet cabling is already CAT 5e and CAT 6 . Thus, the use of existing cabling combined with the lower power consumption and Power over Ethernet (PoE) has made 2.5GBASE-T and especially 5GBASE-T an attractive alternative, striking the right balance between speed, distance and costs not just for communication systems, but also for manufacturers of machine vision peripherals such as CMOS-based cameras. When compared with the fastest Camera Link Extended Full or Deca version that runs at a maximum of 6.8 Gbit/s over a maximum distance of 5m the benefits of a 5GBASE-T interface not requiring an expensive PC-based frame grabber or custom cabling also becomes apparent.

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Fast Running 5GBASE-T Cameras Recognizing these benefits, a number of companies have now introduced both line scan and area array-based cameras based on the 5GBASE-T standard. One example of such an area array camera is LUCID’s Atlas ATL314S 5GBASE-T camera featuring the large format 31.4MP IMX342 CMOS sensor from Sony. With an M12 Ethernet connector capable of transferring up to 25.50 w (PoE+, Type 2) and 5Gbit/s of data, the camera can operate at a resolution of 6464 x 4852 with frame transfer rates of 17 fps at distances of 100m over CAT 6 cable. Not Just About Speed There are many reasons why manufacturers of machine vision cameras have embraced the 5GBASE-T standard. Just as Camera Link Extended Full version runs at a maximum of 6.8 Gbits/s over distances of 5m, the USB 3.1 and USB 3.2 interfaces (although they can transfer data at up to 10 Gbits/s and 20 Gbits/s respectively) are limited to camera-to-computer connection distances of 5m (USB 3.1) and 3m (USB 3.2). Similarly, the fastest camera-to-computer interface, CoaXPress (CXP) can transfer data at speeds as high as 12.5 Gbits/s per CXP link, and thus 50 Gbits/s using four links. Cable length is limited to a maximum of 35m at these data rates; however, if using slower data links of 3.125 Gbits/s, cables can be extended to 100m. Like Camera Link, a relatively expensive (+$2500) PCIe frame grabber is required to implement CXP-based systems. Some high-speed line-scan applications (such as web inspection) demand low latency, low-jitter, point- to-point interfaces, therefore CXP systems must be deployed.

Figure 1: 10GBASE-T has a Nyquist frequency of 400 MHz, i.e. most transmitted data is contained below this frequency. Reducing the speed to 5 Gbps (5GBASE-T) reduces the Nyquist frequency to 200 MHz, thus falling within Category 6 cable’s specified bandwidth. Reducing the speed to 2.5 Gbps (2.5GBASE-T) reduces the Nyquist again by half to 100 MHz, within the specified bandwidth of Category 5e cable.

Figure 2: Examining the installed Ethernet outlets by cable type shows that cur- rently CAT 5e and CAT 6 cabling dominates the market while CAT 6a and CAT 7 cabling is only just starting to emerge to support higher data rates. The low-cost CAT 6 cable is one reason why camera vendors have adopted 5GBASE-T, a standard that operates at 5Gbits/s at distances of 100m over CAT 6 cable.

Figure 3: Atlas 5Gige Camera - The Atlas camera with Sony Pregius Sensors over 5GBASE-T PoE. GigE Vision and GenICam compliant camera capable of 600MB/s data transfer rates (5Gps), allowing for high resolution and high frame rate over standard copper ethernet cables up to 100m.

New-Tech Magazine Europe l 17

In other, less demanding machine vision applications, 5GBASE-T is a more cost-effective solution (Table 1 below). For ranges of line-scan and area array cameras, vendors offer support for GigE Vision, an interface standard developed in 2006 by a consortium of mainly camera companies and now administered by the Automated Imaging Association (AIA). Embracing GigE Vision and GenICam GigE Vision provides a framework for transmitting high-speed video and related control data over Ethernet networks, making it easier for developers to build software. As part of the standard, GigE Vision’s GigE Device Discovery Mechanism provides mechanisms to obtain IP addresses and an XML description file that allows access to camera controls

Figure 4: With the need for PCIe frame grabbers, CXP and Camera Link systems can offer very low latency and low jitter camera-to-computer connec- tions. However, frame grabbers limit the number of camera connections (CXP max 8 cameras per card, Camera Link max 2 camera per card), increase costs, and reduce system flexibility. The GigE Vision interface allows for ver- satility when connecting many devices in a system, and has a maximum cable length of 100m.

and image streams that is based on the GeniCam standard developed by the Verband Deutscher Maschinen- und Anlagenbau (VDMA; Frankfurt am Main, Germany). While GenICam exposes features of a camera (such as frame rate) through a unified API and GUI, each

feature is defined in an abstract manner by its name, interface type, unit of measurement and behaviour. The GenApi module of the GenICam standard defines how to write a camera description file that describes the features of a device, how to be interoperable, and uses

Table 1: Interface Comparison

Relative System Cost

Requires Frame Grabber

Features

Cable Required

Interface Max Data

Transfer Speed Max Length Power over Cable

Camera Link

Deterministic, Latency in 4µs Deterministic Latency (approx 4µs)

Shielded twisted pairs, MD-26 connectors RG59 and RG6 75Coax BNC or DIN 1.2/2.3 connectors (camera) Micro-BNC (frame grabber) USB-type-A and USB-C connectors, USB cable USB-type-A and USB-C connectors, USB cable CAT 6a or CAT 6 cable, optical cabling

850 MBytes/s 10m maximum, 7m (Deca)

Yes (PoCL)

Yes

High

100m at 3.125 Gbit/s, 35m (max) at 12.5 Gbit/s

CoaXPress 12.5 Gbit/s Per CXP Link

Yes (PoCXP)

Yes

High

Up to 5 Gbit/s (after overhead 360 MBps)

USB 3.1 Gen 1

5m

Yes (5V, 2.5W)

No

Low Average latency 30 μs

USB 3.2 Up to 20 Gbit/s

3m

Yes (5V, 4.5W)

No

Low Average latency 30 μs Medium Average latency 3μs Low Average latency 3μs

55m (CAT 6) 100m (CAT 6A)

Possible but not implemented Power over Ethernet (802.3bt) Power over Ethernet (802.3bt) 4-pair PoE (51W) 13W (after losses) CAT 3/CAT 5

10GBase-T

10 Gbit/s

No

5GBase-T

5 Gbit/s

100m (CAT 6)

No

CAT 6 cable

2.5Gbase-T 2.5 Gbits/s

100m (CAT 5a)

No

Low Average latency 3μs

CAT 5a cable

100m (CAT 5 cable or better)

1GBase-T

1Gbit/s

No

Low Latency of 1μs to 12μs

CAT5 Cable

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MMICSPLITTER / COMBINERS Ultra- Ultra-Wideband

EP2C+ 1.8 to 12.5 GHz

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EP2K1+ 2 to 26.5 GHz

Our new EP-series ultra-wideband MMIC splitter/combiners are perfect for wide- band systems like defense, instrumentation, and all cellular bands through LTE and WiFi. These models deliver consistent performance across the whole range, so you can reduce component counts on your bill of materials by using one part instead of many! They utilize GaAs IPD technology to achieve industry-leading performance, high power handling capability and efficient heat dissipation in a tiny device size, giving you a new level of capability and the flexibility to use them almost anywhere on your PCB! They’re available off the shelf, so place your order on minicircuits.com today, and have them in hand as soon as tomorrow! Mini-Circuits ® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com THE WIDEST BANDWIDTH IN THE INDUSTRY IN A SINGLE MODEL! $ 5 56 Models from ea.(qty.1000) 2to26.5GHz Single Unit Coverage as Wide as • Series coverage from 0.5 to 26.5 GHz • Power handling up to 2.5W • Insertion loss, 1.1 dB typ. • Isolation, 20 dB typ. • Low phase and amplitude unbalance • DC passing up to 1.2A EP2K-Series, 4x4x1mm EP2W-Series, 5x5x1mm

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Deterministic Ethernet Protocols Popular industrial Ethernet protocols include PROFINET, EtherNet/IP, EtherCAT, SERCOS III, and POWERLINK. Since there are major differences in the technical approaches taken by each of these protocols, supporting every one of them would be a Herculean software effort for all but the largest manufacturers of industrial automation equipment. Each protocol offers real-time and deterministic behavior for devices and each has various supporting companies and manufacturers. However, EtherCAT is the most adopted and offers both superior performance and market acceptance, delivering real-time, deterministic responses required by industrial machine controllers using low-cost network interface cards (NICs) and Ethernet cables. (2) To support this collection of protocols, also referred to as a fieldbus, the OPC Unified Architecture (OPC UA – IEC 62451), an open standard developed by the OPC Foundation, can be used to specify the information exchange for industrial communication on computer-based machines, in-

the GenICam Standard Features Naming Convention (SFNC) providing a common set of camera features, their names, and their behavior. The Importance of Being on Time While GigE Vision and GenICam standards allow for different devices to work with each over Ethernet the issue of deterministic behaviour between devices still needs to be addressed. Business systems and office environments using Ethernet do not require precise or critical timing between devices to function properly, because it is not crucial if all data packets are correctly sent and received, or whether they are sent and received during a known period of time. However, for industrial Ethernet systems such as a machine vision system inspecting parts in a timely fashion, determinism is required. Industrial systems must be highly deterministic because any failure to transmit, receive, or act on processed data at specific times can result in data loss and delays producing an unpredictable industrial system. Determinism is therefore highly important and has been addressed by a number of specialized industrial Ethernet protocols.

between machines, and from machines to and from computers systems. With OPC UA, developers can take advantage of OPC’s data model and services that enable devices to exchange data with an agreed and shared meaning, rather than mapping data as byte streams. At the same time, the EtherCAT TechnologyGroup(ETG,Nuremberg, Germany) and the OPC Foundation’s technologies complement each other with EtherCAT being used as a real-time-Ethernet fieldbus for machine and plant controls and OPC UA as a platform for scalable communication. Making Machine Vision Systems While the collaborations above are useful, they do not specifically address the needs of developers of machine vision systems wishing to leverage Ethernet-based systems on the factory floor. To do so, the VDMA has collaborated with the OPC Foundation to form an OPC Vision Initiative to develop an OPC UA companion specification for machine vision (see “OPC UA Vision,VDMA Specification”, Draft Version November 2018).

Figure 5: The OPC UA’s Companion Specification for Machine Vision (OPC UA Vision) is an open, Ethernet-based standard that allows for non-linear communication and data exchange between components of factory networked systems.

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networking (TSN) companies can use a single Ethernet network for both time-critical, deterministic applications such as image capture and less time-critical IT systems. Since the OPC UA TSN standard can be applied to computer-based nodes on the network, including cameras, PCs, PLCs, and server-based systems, it will be especially useful in developing edge-based and cloud- based network applications. 5GBASE-T: The Sweet Spot 5GBASE-T cameras coupled with standard Cat 6 cables allows cameras to be easily located at up to 100m from the host computer

While the OPC UA describes data, functions, and services of embedded devices, machines and data transport for data modelling, OPC Vision allows industry-specific definitions of products such as cameras to be defined, similar to the GenICam Standard’s Features Naming Convention. As well, the OPC Vision Interface can be integrated with fieldbus standards such as EtherCAT to form a complete system model for real-time deterministic systems that can be integrated with OT production control and IT systems. With the emergence of the OPC Unified Architecture (OPC UA), the OPC Vision Initiative and the IEEE 802.1, standards for time-sensitive

in a variety of flexible network topologies. Eliminating the need for relatively expensive frame grabbers also lowers the overall system cost while still allowing 5Gbits/s image data transfer from the camera, fast enough to address a broad range of vision applications. When established, efforts such as the OPC Unified Architecture (OPC UA) and the OPC Vision Initiative will ease the deployment of 5GBASE-T cameras in industrial fieldbus-based Ethernet networks, simplifying the task of systems integration. These aspects combine to build a balanced interface offering flexibility, bandwidth, low cost, and strong reliability for high speed vision systems.

Read To Lead

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New-Tech Magazine Europe l 21

How To Optimize Solder Stencil Aperture To Increase Connector Options

By David Decker, Samtec

Designers high-density electronics systems can now match 0.15 mm co-planarity connectors with 0.10 mm thick solder stencils through careful aperture design. As electronic systems increase in component density, designers will typically look to match fine 0.10 mm thick solder paste stencils on the pc board to equally fine connectors with a co-planarity not in excess of 0.10 mm. However, a connector co-planarity value of 0.15 mm is not uncommon and it gets increasingly difficult to achieve 0.10 mm as the number of connector pins increases and with formed-pin, right-angle connectors. This has restricted designers’ connector options and either forced the use of multiple connectors when a single connector would have been preferred, or the use of stepped stencils. Both options add cost and complexity to the system of

design and production. However, a study by Samtec Inc. and Phoenix Contact has shown that by optimizing the solder stencil aperture, designers can use the more widely available and less expensive 0.15 mm co-planarity connectors with the finer 0.10 mm stencils, while still meeting IPC-J-STD-001 Class 2 criteria for a 100% yield. This article will discuss the relationship between stencils and connector co- planarity and the trade-offs and restrictions designers face. It will then describe the study, its results and the impact of those results with respect to design optimization for cost, space, performance, and reliability. The stencil and connector co-planarity relationship It’s not too difficult to precisely place a fine brick of solder paste using

precisely machined stencils. However, it gets increasingly difficult to match the connector to that finely stenciled solder as the number of connector pins increases and where connector pins need to be formed and shaped, such as for right-angle connections. The main issue is the co-planarity of the connector pins. Roughly speaking, the term “co- planarity” refers to the maximum distance between the highest and the lowest lead, or pin, when the connector is sitting on a flat surface. It is typically measured using optical gauging equipment (Figure 1, left). Good co-planarity is critical for good solder joints: if a pin or lead is sitting too high, it may not make sufficient contact with the solder paste, resulting in a mechanically weak joint or a completely open electrical connection. Most specifications call for a co- planarity of between 0.10 mm and 0.15 mm.

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Figure 1: Co-planarity measures maximum lead height variation above a flat surface and it is critical to keep that variation to a minimum for SMT device leads to avoid problem joints (lower right). (Image source: Samtec Inc.)

for three connector series. They used a 0.15 mm stencil with 1:1 aperture so the deposited solder was the same size and shape as the copper pad. They then added two variations of 0.10 mm stencils with enlarged apertures. Connectors were then built and selected for the study based on co-planarity values between 0.10 mm and 0.15 mm. The study involved adjusting the aperture size beyond the size of the pad (overprinting) to increase the volume of solder and create a better connection, but not so much that it would cause bridging or leave solder balls on the board surface. To achieve this, the study relied upon the tendency of solder to coalesce on the heated pad once it has reached its liquidus temperature during reflow. Still, the right size aperture must be determined for each connector type (Figure 2). For instance, the optimal aperture to ensure a good solder joint between the sample FTSH connector, with a co- planarity of 0.152 mm, and the 0.10 mm stencil, is 2.84 mm X 0.97 mm.

With the right process and tools, it’s possible to consistentlybuild connectors for most applications with co-planarity of 0.15 mm. However, a co-planarity of 0.10 mm is more difficult to achieve as pin counts increase and especially with advanced shaping and forming of the connector pins to specific angles, such as dual row, right angle. Maintaining this lower co-planarity can increase connector costs. With large boards now comprising in excess of 3000 components and smaller, more integrated electronic devices forcing tighter space constraints (and as a result finer pitch components), designers are more frequently considering the use of 0.10 mm thick stencils. If the stencil is made any thicker, there is a higher risk of solder bridging between leads or pads. However, they are having difficulty finding connectors that meet the 0.10mmx co-planarity specification, with sufficient pin counts and suitable form factors. Designers do have options, however. They can use a stepped stencil

approach, with a thinner stencil for the fine pitch components and a larger stencil for the connector. This solves the problem, but at a higher stencil cost that may not fit applications where there isn’t sufficient space between components on either side of the step. The general rule of thumb requires a distance between stepped apertures of 36X the step thickness. Another option is to use multiple connectors. Fewer pins make it easier for a connector to meet tighter co- planarity specifications. However, more connectors also add cost, as well as layout complexity and reliability issues. In addition, while a connector may meet 0.10 mm co-planarity requirements, a 0.10 mm stencil results in less solder volume, leading to a potentially weaker mechanical joint. How to optimize the stencil aperture To see if these tradeoffs can be minimized, Samtec and Phoenix Contact studied the effects of modifying the apertures of the stencil

New-Tech Magazine Europe l 23