New-Tech Europe Magazine | July 2019 | Digital Edition

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IoT Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products applications that benefit from multi-pin M12 connectors include complex sensors, cameras, scanners, encoders, I/O boxes, sensor/actuator multi-pin connectors, etc.

Automotive

New Products

Motion

Computers Communication

Motion

Communication

Motion Automotive

ERNI with broad portfolio of M8/M12 connectors Over the last three decades, the M8/M12 connector system has established itself as the preferred solution for use in harsh industrial environments that require a reliable, robust connection solution for fieldbus, sensor and Ethernet connections. With different numbers of pins, male and female connectors, connector configurations and coding as well as shielded versions, the M8/M12 connectors from ERNI cover a wide range of applications. Based on the modular M8/M12 circular connector system according to IEC 61076-2-101 / 2-104 / 2-109, robust connector solutions for industrial automation can be implemented quickly and reliably. The connectors are suitable for almost all Ethernet and fieldbus specifications and are available in various codes. A-coded circular connectors are used, for example, as sensor connectors or device connectors for digital and analogue signal transmission or for power supply. B-coded connector variants are intended for fieldbus interfaces. D- and X-coded products are designed for Ethernet interfaces. ERNI has continuously expanded its portfolio of circular connectors to cover a wide range of applications with maximum flexibility. This means that the customer can choose between different termination techniques (SMT, THR), numbers of pins (3-17), coding (A, B, D and X), installation heights (9 mm and 13 mm), male and female variants and complete cable assembly. Gold-plated contacts, robust protection against dust and water and shielded variants support use in harsh environments. ERNI also offers a wide range of accessories for this purpose, such as locking screws, protective caps or O-ring seals. The two-piece design (connector inserts and locking parts) allows the locking parts to be easily integrated into customer-specific injection-moulded and die-cast enclosures, thus achieving considerable cost savings. As part of its proven M8/M12 series, ERNI now also offers M12 connectors with 12 and 17 pins in the standard design. With these multi-pin M12 variants, the number of required device interfaces can be reduced, for example, if bus, I/O, control, service and safety signals are combined in one connector/cable. Typical

Ams and SmartSens partner on 3D and NIR sensors The collaboration is designed to speed market delivery and broaden the diversified 3D product range for mobile, computing, consumer and automotive application areas AMS, a leading worldwide supplier of high performance sensor solutions, has signed a formal letter of intent to collaborate in the field of Image Sensors with SmartSens Technology, a global supplier of high-performance CMOS image sensors. This collaboration complements ams’ strategic approach to further broaden its portfolio for all three 3D technologies – Active Stereo Vision (ASV), Time-of-Flight (ToF) and Structured Light (SL) – while accelerating time to market for a more differentiated set of new products. To quickly meet an expected increasing demand for 3D sensing solutions in mobile devices, the partnership’s initial focus will be on 3D Near Infrared (NIR) sensors for facial recognition and applications requiring a high Quantum Efficiency (QE) in the NIR range (2D and 3D). To speed up the time to market for customers, the companies will collaborate on the development of a 3D ASV reference design to support the planned future launch of a 1.3MP Stacked BSI Global Shutter Image Sensor with state of the art QE up to 40% at 940nm. This NIR sensor is a perfect addition to ams’ 3D illumination offerings, extending ams’ 3D portfolio and optimizing overall system performance. The reference design will enable high performance depth maps for payment, face recognition and AR/VR applications at a

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