New-Tech Europe Magazine | Q4 2021

Q4 2021

16 Packaging for microelectronics- Controlling thermal expansion and power dissipation" 18 Medical Vision Systems 20 2022 Electronics And Semiconductor Outlook 22 Enabling Smart

Robotics with Single-Board Computing

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Bulls Eye®

Enables Smaller Evaluation Boards & Shorter Trace Lengths

BULLS EYE ® HIGH-PERFORMANCE TEST The high-density array designs and advanced cabling solutions within Samtec’s Bulls Eye ® product family support test and measurement applications to 70 GHz. • Compression interface to the board provides easy on/off and eliminates soldering costs • High-density, space-saving design • Enables smaller evaluation boards and shorter trace lengths • 20, 40, 50 & 70 GHz configurations

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Samtec Israel 21 Bar-Kochva St. • Concord Tower • B’nei Brak, Israel 51260 Tel: +972 3 7526600 • Fax: +972 3 752669 e-mail: •

King of Coax Connection.

© eiCan


Coaxial Connectors The SMA connector is designed for a frequency range of DC to 18 GHz at 50 Ω impedance. With its threaded-type coupling mechanism, it is perfect for securing your connection in intensive vibration environments.

n Standard interface in accordance with MIL-STD-348 n Precise CNC machining with up to 0.003 mm tolerance n Center contact captivation n Resistant to severe conditions for up to 48 hours

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The key to beating more illnesses is earlier detection, and ADI’s precision sensing technology is powering new, ultra-fast disease testing, bringing us one step closer to a healthier future for all.

Analog Devices. Where what if becomes what is. See What If:

Q4 2021

About New-Tech Magazines Group Read To Lead ‘New-Tech Magazines’ A world leader in publishing high-tech and electronics, producing top quality publications read by tens of thousands professionals from all over the world especially from Europe, innovative electronics, IoT, microwave, homeland security, aerospace, automotive and technological industries. Our specialized target audiences prefer New-Tech Europe because they know that our publications are a reliable source of the latest information in their respective fields. Our multidimensional editorials, news items, interviews and feature articles provide them with a full, well-rounded picture of the markets in which they operate - an essential asset for every technological leader striving to stay ahead, make the right decisions, and generate the next global innovation. Moreover, as an attractive platform for advertisers from around the world, New-Tech Europe has become a hub for bustling international commercial activity. Here, through ads and other promotional materials, Israeli readers obtain crucial information about developers and manufacturers worldwide, finding the tools, instruments, systems and components they need to facilitate their innovative endeavors. Targeting the needs of both the global and european industries and global advertisers, New-Tech Magazines Group constantly expands and upgrades its services. Over the years, the company has been able to formulate a remarkably effective, multi-medium mix of offerings, combining magazine publications with useful online activities, newsletters and special events and exhibitions.

Editor: Tomer Gur-Arie COO & CFO: Liat Gur-Arie Journalist: Amir Bar-Shalom Technical journalist:

Arik Weinstein Graphic Design: Hadas Vidmayer Concept design: Maya Cohen Technical counselor: Arik Weinstein Sales and advertising: Account Manager: Yuval Gur-Arie Account Manager: Sivan Bekerman Project Manager/Events: Shiri Abdi Project Manager/Events: Yaara shahaf Data system: Liat Tsarfati Editorial coordinator: Lihi Levi Operation Manager: Sivan Bekerman Mail: Office: Publisher :


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10 LATEST NEWS 16 Packaging for microelectronics - Controlling thermal expansion and power dissipation" 18 Medical Vision Systems 20 2022 Electronics And Semiconductor Outlook 22 Enabling Smart Robotics with Single-Board Computing 24 The promise of hybrid graphene/metal structures for advanced interconnects 30 Israeli startup EVR Motors unveils extremely small, lightweight, high performance electric motor based on new topology 32 4-Switch Buck-Boost Controller Layout for Low Emissions—Single Hot Loop vs. Dual Hot Loop






www. new- t echeurope . com

New-Tech Magazine Europe l 9

Latest News

Leading Edge AI Chipmaker Hailo Partners with NXP to Launch High-Performance, Scalable, AI Solutions for the Automotive Industry

NXP’s automotive processors, combined with the Hailo- 8™AI processor, offer powerful, scalable, safe, and efficient deep learning processing for automotive ECUs Hailo, the leading edge Artificial Intelligence chipmaker today announced its partnership with NXP® Semiconductors, an

S32G processor combined with up to two Hailo-8™ AI processors delivering up to 52 TOPS, offers the automotive industry a high-performance, real-time application and processing solution for service- oriented gateways, domain and zonal controllers, and safe compute platforms. The second solution, powered by

Main Photo: Hailo team. Photo credit – Hailo

automotive market innovator, to launch a number of joint AI solutions for automotive

the Arm® based NXP Layerscape® platform and combined with up to six Hailo-8™ AI

Electronic Control Units (ECUs). The joint solutions will combine NXP’s safe and efficient automotive processors (S32G and Layerscape) along with the high-performance Hailo-8™ AI processor. The Hailo-8 outperforms other available AI processors for edge computing with up to 26 tera-operations per second (TOPS) at a typical power consumption of 2.5 W. These scalable solutions will enable power-efficient AI acceleration at low size and energy usage, helping usher in a new era of automotive innovation. Vehicles increasingly require high-performance computing power to process a growing number of sensors’ data and provide new data-driven vehicle services. NXP and Hailo’s joint solutions enable scalable AI compute while maintaining top safety standards and keeping the entire power envelope low – solving major pain points for automotive OEMs and Tier-1 suppliers. The solutions address power efficiency, independent scalability in generic and AI compute, and offer an open software ecosystem for applications and software stacks. “NXP’s vehicle processing platforms are designed to meet the needs of next-generation driver demands and support industry innovation,” said Brian Carlson, Global Marketing Director for Vehicle Control and Networking Solutions at NXP. “When combined with Hailo’s high-performance AI chip, we can provide power-efficient, scalable, and safe AI solutions to the automotive industry for a new era of intelligent vehicles.” The first such solution, powered by the Arm® based NXP

processors, delivers a high-performance of up to 156 TOPS, scalable compute platform with state-of-the-art AI performance. “We are excited to partner with a major player like NXP to demonstrate the true potential of AI for automotive and beyond,” said Orr Danon, CEO and Co-Founder of Hailo. “This partnership strengthens our position in the automotive sector, enabling us to further address the rapidly growing need for efficient and reliable technologies that process sensory information more efficiently and at greater speeds – in order to pave the way towards full autonomy. We look forward to continuing to work with NXP to expand our unmatched edge processing solutions to a broad range of demanding applications including industrial & heavy machinery applications, robotics, and more.” The NXP-Hailo joint solutions are already being utilized by multiple customers, including Insurtech company MOTER Technologies, Inc., which is using the Arm-based NXP S32G processor combined with a Hailo-8™ M.2 AI accelerator module for Usage-Based Insurance (UBI) applications for automotive. The miriac® AIP-S32G274A and miriac® AIP-LX2160A NXP-Hailo automotive based application-ready platforms are available from MicroSys, as well as development platforms by NXP: BlueBox 3.0 (Layerscape LX2160A and S32G and GoldBox (S32G). Both are compatible with Hailo-8™ M.2 AI Acceleration Modules.

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Latest News

Siemens joins forces with LG Energy Solution: towards more intelligent, leaner and cleaner battery production

leap in battery manufacturing. We are proud that technology from Siemens enables this momentous transformation”, said Cedrik Neike, Member of the Managing Board of Siemens AG and CEO Digital Industries. “With this cooperation, we underscore Siemens’ positioning as a focused technology company. Joining forces with the world’s leading battery manufacturer allows us to showcase our deep domain knowhow in the battery market.” Through this strategic collaboration,

Siemens joins forces with LG Energy Solution: towards more intelligent, leaner and cleaner battery production ■ Siemens signs a Memorandum of Understanding with LG Energy Solution: Both companies will collaborate in the field of battery manufacturing intelligence ■ Collaboration will minimize carbon footprint in the supply chain, supporting ESG targets The partnerships’ first line of collaboration will be realized at Ultium Cells LLC, located in Tennessee

Photo: from left to right: Myung Hwan Kim, CPO LG Energy Solutions; Young Soo Kwon, CEO and Vice Chairman, LG Energy Solutions; Cedrik Neike, MBM of Siemens AG and CEO Digital Industries; Rainer Brehm, CEO Factory Automation Siemens Digital Industries.

LGES will be able to implement smart battery manufacturing processes at global factories. The partnerships’ first line of collaboration will be realized at Ultium Cells LLC, a joint venture of LG Energy Solution and General Motors, located in Tennessee, which is expected to begin production in 2023. Furthermore, the collaboration will allow LGES to cut back on Carbon footprint in its entire supply chain management, as it aims to boost sustainability in its business operations. As a leading supplier in the field of automation and industrial software, Siemens offers a comprehensive digital enterprise portfolio and domain knowledge in the battery industry. This allows LGES to accelerate its digital transformation strategy. In addition, Siemens AG will contribute to the development of the rapid growing battery industry by solidifying its position as a technology partner for the advancement and efficiency of battery manufacturing technology. The companies will also collaborate on building a digital twin roadmap to ensure stable operations at facilities to offer first-rate quality products at the right time. Together, the companies will also develop training programs within the Institute of Battery Technology (IBT) for academic students set to work for LGES.

■ Siemens solidifies its position as a technology partner for the advancement and efficiency of battery manufacturing technology Siemens and LG Energy Solution (LGES), a leading global battery manufacturer signed a Memorandum of Understanding (MoU) to increase cooperation in the field of battery manufacturing, particularly the digitization of production process. Under the terms of the agreement, which was signed by Cedrik Neike, Member of the Managing Board of Siemens AG and CEO Digital Industries and Young Soo Kwon, CEO of LG Energy Solution and at LGES’s headquarters in Seoul, the two companies plan to take steps to promote the process of battery manufacturing intelligence at LGES production facilities worldwide. “We believe the partnership with Siemens AG will efficiently promote LG Energy Solution’s digitized manufacturing processes, ultimately enabling LGES to provide the finest services to our clients,” said Young Soo Kwon, CEO of LG Energy Solution. “The process of manufacturing intelligence in producing batteries is becoming a critical factor, especially as LGES continues to advance the quality of its products while expanding production base worldwide.” “The future of carbon-neutral mobility requires high- performing batteries. They are at the heart of the electric vehicle market. Siemens and LG ES will work on quantum

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Latest News

Samtec Acquires Ultra Communications, Inc.

Acquisition Strengthens Samtec’s Fiber Optic Product Offering for Mil/Aero, Harsh Environment Applications Samtec, Inc., a global manufacturer of a broad line of electronic interconnect solutions, announces

optical coupling, and testing at the wafer and component level, combined with our advanced interconnect design expertise, will provide robust product and technology solutions for our customers.”

from old, polluting products to greener, leaner, and smarter vehicles. Demand that has contributed to the global market for lightweight automotive materials now being projected to surpass $99 billion by 2025. But to achieve this, new materials are needed, which is one of the markets that Nemo Nanomaterials addresses. Modern vehicles present unique demands for materials and require them to be light and durable while providing electrical conductivity as well as electromagnetic shielding. Most importantly, all materials used must be sustainably managed throughout the product lifecycle. Invariably, this has seen manufacturers making tradeoffs when it comes to material properties and functionality. However, with Nemo Nanomaterials, the industry Samtec has an established customer base in the industrial and mil-aero markets with its optical FireFly™ product line. Ultra Communications’ products, which feature a Surface-Mount-Technology (SMT) reflowable attach process, complement the FireFly family. The acquisition provides aerospace and mil-aero customers with another option to achieve small size, low weight and power (SWaP) in extreme environments. “We are thrilled to be joining the Samtec Team. There are many synergies and new opportunities for us. Together we can bring new products to market faster and provide more value to our customers,” said Charlie Kuznia, President of Ultra Communications. Samtec plans on maintaining operations and staff at the Vista, CA facility.

the acquisition of Ultra Communications, Inc., a manufacturer of high-speed digital and RF fiber optic components, based in Vista, CA. Ultra Communications’ core competencies include circuit design, optoelectronic package design, and manufacturing of fiber optic components. Founded in 2005, the company holds substantial IP and technology, with active programs in the mil-avionic, space/satellite, ground vehicles, radar, and shipboard connectivity arenas. “Ultra Communications offers an exciting opportunity to strengthen and expand our fiber optic product offering for mil/aero and harsh environment applications,” said Brian Vicich, CTO of Samtec. “Their expertise in high-speed mixed- signal circuit design, packaging for high fidelity electrical and Nemo Nanomaterials technology can be applied to vehicles, electronics, textile, construction, telecom, energy, and the aviation and aerospace sectors. The startup is already working with 10 large companies, including multi-billion dollars corporations. The need to produce new, sustainable technologies that improve people’s lives while maintaining the health of the planet requires access to innovative materials designed for safe, sustainable manufacturing and production. Established in 2018, Israeli startup Nemo Nanomaterials is now emerging out of stealth mode to provide game-changing nanomaterials that revolutionize the possibilities of industrial additives across virtually every market sector. Take the automotive industry as an example. It is moving away

Credit: Samtec

Israeli startup Nemo emerges out of stealth to turn the promise of nanomaterials into industrial reality

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Latest News

challenges have become a thing of the past.

billion-dollar conglomerates. The list includes paying customers and co-development partners in various stages of pilots and product validations. Nemo has started manufacturing tons of its products following commercial orders from customers.

Nemo’s proprietary technology and techniques for processing and mixing carbon nanomaterials enhance plastics with features of metals for advanced electronic systems, under the hood parts, fluid supply lines, battery casings, internal and structural components, with reduction of up to 30% of the weight for parts when compared to metals.

“High-end carbon nanomaterials are known to mankind for decades. They recently were made available on a commercial scale. Many

Main photo credit: Eyal Toueg

companies have made lots of promises in regard to making real industrial products out of them, but Nemo is unique in making them a reality. Nemo’s technology enables a revolution in nano- carbons. It solves many wide and acute industry challenges across a myriad of specifications while delivering ready-to-use additives that can be used by the industry utilizing existing machinery and procedures. Nemo Nanomaterials is going to provide materials that are required for the future of manufacturing,” said Jonathan Antebi, Co-founder and VP Business Development at Nemo Nanomaterials. With Nemo Nanomaterials technology, there is zero performance tradeoff in materials while enabling innovative design and functional possibilities across industry sectors. Its additive means customers can more efficiently use raw materials while also delivering the most effective end-of-life recyclability possible. “Refineries, and not petroleum, reshaped the world because they provided new materials that enabled new industrial capabilities. With Nemo Nanomaterials, high-end nanocarbons are just as transformative to reinvent the world of the future, today,” said Alexander Zinigrad, Co-founder and CEO of Nemo Nanomaterials.

Beyond the automotive sector, Nemo Nanomaterials technology can be applied to electronics, textile, construction, telecom, energy, the aviation and aerospace sectors. Nemo’s technological breakthrough is the sole enabler for replacing metals with plastic materials – by achieving desired electrical conductivity and EMI shielding properties while maintaining the original features of the plastic. On EMI shielding and electrical conductivity alone, the company can reach an addressable market that surpasses $10 billion. And that is just one of almost limitless applications and possibilities. , NXP Brings Dolby Atmos® and DTS:X® to the Masses with its New Immersiv3D Audio Solution Nemo founders- From left to right – Alexander Zinigrad CEO and Jonathan Antebi Co-founder and VP Business Development. Photo Credit – Eyal Toueg Nemo Nanomaterials was established in 2018 by Alexander Zinigrad and Jonathan Antebi. The company has successfully raised $7 million in pre-seed and seed funding, the bulk of which has come from the Cyprus-based GEM Capital. The startup is already working with 10 large companies, including multi-

Foxconn Interconnect Technology invests $10 million in Autotalks following strategic collaboration agreement

Foxconn Interconnect Technology (FIT), a subsidiary of Foxconn (Hon Hai Technology Group), the world’s largest electronics manufacturer, and Autotalks, a V2X (Vehicle-to-Everything) communication solutions pioneer, announced that FIT invested $10 million following a strategic collaboration agreement between the two companies. FIT and Autotalks will join forces to accelerate V2X penetration across automotive and micro-mobility segments, leveraging

Autotalks’ automotive V2X technology, and its recently launched ZooZ micro-mobility platform. The joint micro-mobility activity will start this year, and the automotive activity will start early next year., NXP Brings Dolby Atmos® and DTS:X® to the Masses with its New Immersiv3D Audio Solution Autotalks company 2021- Photo- Daniel Danilov FIT and Foxconn Group have made significant achievements in electric vehicle development that included critical

New-Tech Magazine Europe l 13

Latest News technology research and development and joint ventures with leading automakers. The establishment of MIH (Mobility in Harmony) consortium was also a significant milestone that Foxconn group and its members have collectively achieved. Foxconn’s electric vehicles strategy drew massive attention with their recent launch of three EV prototypes, showing Foxconn’s

with the highest performance, security and reliability. This is why we decided to enter into strategic collaboration agreement with Autotalks and invest $10 million in this company.”

“We are glad to enter into strategic collaboration agreement with Foxconn and receive the new investment from the world’s largest electronics manufacturer,” said Hagai Zyss, CEO of Autotalks. “The synergy

credit: Autotalks

commitment to become a global next-generation automaker. “Over the last couple of years, we have been strategically expanding into the automotive segment, with special focus on electric vehicles, connectivity, mobility and safety and technologies,” noted Thomas Fann, Special Assistant to Chairman at FIT. “We see Autotalks as the provider of the world’s most trusted V2X solution,

between the companies is very natural, considering the strategic place V2X has in the future of safety and mobility, and Autotalks’ V2X market leadership. V2X is a critical safety sensor, the only one that can see behind corners, protect micro-mobility users, and can also increase the range of Electrical Vehicles.” For more information, visit FIT’s website:

Israeli Technology to Be Part of the “Green Revolution” In the Field of Micro Electronic Vehicles (EV), Two and Three Wheels, In the Indian and Southeast Asian Markets

Redler of Israel has signed a long- term strategic cooperation agreement with Virtual Forest (VF) of India who have incorporated Redler Technologies’ patents in the areas of motion control and Micro EV Both companies will together invest 5.5 million USD in the initial stage Technologies

Cooperation companies



will include integration of new technology solutions including Redler Technologies flagship products, from development to production, integration, and support together with VF, while adjusting to the new and unique demands of two- and three-wheel EV vehicles. Both companies will together invest 5.5 million USD in the

Credit: Redler Technologies

initial stage. The motion controllers’ market is experiencing steady growth in line with exponential growth of the EV markets in India and Southeast Asia. In 2021, this market saw a turnover of 3.8 million dollars, which is expected to multiply over 30 times to a value of 267 million dollars in 2025. This forecast is based on, amongst other factors, national plans as announced by the Indian government and Mr. Nitin Gadkari, the Minister of Road Transport and Highways, for two- and three-wheel EVs to become 80% of the EV market by 2030. The two- and three-wheel market is a significant portion

Redler Technologies, specializing in solutions with international patents in the areas of electrical power and motion technologies, has entered into a strategic alliance with Virtual Forest (VF) of India. VF develops technologies for micro electric vehicles (Micro-EV) for two- and three-wheel vehicles for the Indian and Southeast Asian markets. In doing so, Israeli technology will, for the first time, be an integral part of the Micro-EV markets in India and Asia. Redler Technologies will supply innovative motion solutions for the accelerating Micro-EV markets as part of the green electricity revolution taking place in India and her region.

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Latest News

of the annual number of new electric vehicles rolled out and is expected to reach annual sales in the billions of dollars worldwide. With 17.4 million new two- and three-wheel sold in 2020, compared to 2.7 million cars (a ratio of 6.5 to 1) and where only 1.6% of all new cars on the roads are green energy [EV’s], the growth potential in this market is very high. VF operates in a growing market while focusing on new innovations in EV in India and the region, addressing two main issues: their geographical area is responsible for one third of the world’s carbon emissions due to the overwhelming reliance on two- and three-wheel vehicles operating on petroleum. And secondly, the high cost of petroleum in relation to the average income as a result of India’s dependence on imported fuel.

Guy Natanson, CEO of Redler Technologies, says “We are excited to be part of the burgeoning revolution in this particularly important market of EV two- and three-wheel vehicles. The choice to partner with VF was ideal for both companies since the synergies between our technologies will enable us to build a better future, advance green technology and zero vehicle carbon emissions which is at the forefront of economic and political agendas in this region and around the world.” Omer Basith, Co-Founder and Partner in VF, adds “We see the importance in our strategic cooperation with Redler Technologies. Together we provide an important message of localizing technology that enables us to take the EV industry in India and the region toward a better future.”

World-First 5G Vehicle OTA RF Test System

and carrier aggregation*5 (8CA) technologies for fast, large-capacity communications. As well as focusing on smartphone testing, it covers a wide application range, including 5G communications function tests and evaluations of antennas and high- frequency parts. To characterize an antenna, it is necessary to measure its radiation patterns to determine how well, and in which direction, it radiates. To

Anritsu Corporation is pleased to announce development of the world’s first 5G OTA*1 RF test system in partnership with Toyota‘s and their investment in MVG*2 OTA test environment using Anritsu ‘s Radio Communication Test Station MT8000A. Realizing autonomous driving requires simultaneous communications with the surrounding environment, including other vehicles, road

Credit: Anritsu Corporation

quickly obtain reliable 3D radiation patterns, antenna performance tests are moving towards Over-The-Air (OTA) test solutions to obtain fast and reliable measurements at the system level. For OTA measurements, the tests are performed through a radio communication tester and are conducted using a near-field measurement method in an anechoic chamber to block external electromagnetic fields and to simulate realistic and complex RF scenarios. Addressing the complexity of measuring highly connected vehicles, MVG offers OTA measurement solutions specifically designed for the complete verification of automotive wireless performance. Thanks to a high precision positioning system (controller and turntable) continuous on-the-fly measurements can be performed. This allows for quick and accurate measurement of directivity, gain and efficiency. “To deliver a full-vehicle OTA test solution that meets the needs of current and future vehicle testing, we needed to integrate a radio communication test system supporting 5G frequencies. We believe that MVG OTA test environment combined with the Anritsu MT8000A is the right combination to meet the test needs of tomorrow’s connected vehicles.” – Per Iversen – MVG Chief Technology Officer

infrastructure, networks, etc. In particular, introduction of 5G supporting large-capacity, low-latency, massive connections are key technology to transferring the large data volumes generated by various sensors, such as vehicle cameras, as well as for 3D high-definition mapping data. Consequently, car manufactures, and Telematics Unit suppliers are pushing forward with development of 5G communications products. The developed 5G communications products are installed in vehicles as the “connected car”. However, before release, the connected vehicle communications performance must be tested and verified in an OTA environment simulating the actual environment as possible. Now, Anritsu and Microwave Vision Group (MVG) have partnered to deliver the MT8000A and OTA system to Toyota as the world’s first 5G vehicle OTA RF test system. Product Outline The all-in-one Radio Communication Test Station MT8000A is a 5G base-station simulator for 5G RF*3 and protocol measurements as well as application tests. It supports high-order 4×4 MIMO*4

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Packaging for microelectronics- Controlling thermal expansion and power dissipation Eran Lipp, PCB

Extended functionality, as well as decreased weight and heat dissipation, are at the core of electronic miniaturization technology. For decades, the microelectronic industry has been engaged in shrinking the transistor dimensions to enable this miniaturization for various applications (automotive, aerospace, medical industries, and others). Today, this miniaturization trend is no longer limited by the size of single transistors. Instead, the system size and reliability are dictated in many cases by the chip packaging and PCB sizes. Therefore, chip packaging technology becomes a key factor enabling smaller, lighter systems with increased functionality. To ensure system reliability and space reduction, the package should comply with several thermal, mechanical, and electrical requirements. Semiconductor chips are the main building blocks of any digital signals processing device. Once assembled

on top of a PCB, the gap between the semiconductor coefficient of thermal expansion (CTE for Silicon- 3 ppm/ C˚) and the PCB (typical CTE of 15-20 ppm/C˚) becomes an obstacle. While the PCB dimensions expand during assembly and reflow processes, the chip remains almost intact. These changes result in mechanical stress, affecting the assembly process and hindering the system's long-term reliability. The most effective way to meet this challenge is by assembling the chips onto the PCB indirectly, using a substrate as an intermediate layer (see figure 1). The encapsulated chip-substrate stack, also known as a chip-scale package (CSP) is then soldered to the main PCB. To mitigate the CTE difference between the main PCB and chip, the substrate circuit should be made out of manufacturing- compatible material that has a CTE value of 5-7 ppm/C.

Another significant challenge in attaching a microchip to a PCB is the need for power dissipation. In high- end digital applications, transistor size comes at a price of increased power consumption. Other systems that use lower-end processors typically include analog devices such as receivers, transmitters, and power management components – all handle high currents. High power results in "hot spots" areas where chip temperature rises during operation. Failure to dissipate this heat causes the temperature to increase and reduces functionality and reliability risk. PCB manufacturing utilizes several solutions for heat dissipation- all rely on the thermal conductivity of copper coins used as heat sinks. However, these solutions are incompatible with microchip assembly, due to the high level of Cu CTE (17 ppm/C). An effective solution, combining high thermal conductivity (typical values above 200

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Image Source: Chip Design Magazine

Figure 1: A PCB substrate used for microchips packaging

manufacturing and system assembly. The need to comply with so many manufacturers’ design rules, requires compromise, limits the system performance, and creates a significant delay in time to market. PCB Technologies sets new standards of holistic engineering, saving our customers the time and energy required for coordinating between various suppliers. Our All-in-One approach enables combining various materials while tailoring the required properties for the customer's PCB needs. We offer our customers the ability to design and manufacture substrates for microchip assembly, chip assembly, and encapsulation to create a system in package. A true one-stop-shop for any design or project.

W/mK) with low CTE (5-7 ppm/C) can be realized by creating a laminate comprised of copper and refractory metals. In such laminates, copper is responsible for thermal conductivity while the refractory metal ensures low CTE. The actual thermal conductivity / CTE is determined by the relative thickness of each metal. The ability to design and manufacture advanced substrates – including low-CTE heat sinks clears the way for advanced systems, where more than one chip can be mounted onto the same substrate. Forming this System in Package (SIP) allows several types of microchips, from several vendors and produced with different semiconductor technologies, to be assembled on one substrate. The substrate can also include analog devices (e.g. resistors) and miniature PCB line/space enabling chip connectivity with a shorter path thus using a smaller PCB footprint. Furthermore, the substrate enables to stack microchips resulting in a 3D package that is in itself a full system. SiP can be used in any application that benefits from miniaturization- for example, any transmitter/ receiver system- including radars for autonomous vehicles, military radar systems, cellphones, etc. The main component in such systems is

a transmitter/receiver chip, usually GaAs-based. The receiver is a high- power chip, requiring heat dissipation. In addition, the system requires a data processing component and antenna switches, typically realized by Si-based chips. Assembling and encapsulating each of these chips separately might result in large PCB footprint consumption. Furthermore, the electrical connection between chips relies on long interconnects – limiting the system speed and wasting power. Packing all these chips on one substrate means that the whole system area can be reduced by a factor of 4-10. Many analog devices that are needed as part of the circuit can also be mounted on the same SiP – resulting in a smaller, faster system. Another good example is navigation systems, which include micro- electromechanical systems (MEMS) chips as well as data processing and analysis chips. Such systems are becoming widespread and are critical for autonomous vehicles, self- propelled drones, cellphones, etc. Designers normally engage with several vendors for the development of a new system based on SiP. One for SiP circuit design, another for manufacturing, a third vendor for chip assembly and encapsulation, and one or two additional vendors for PCB

Eran Lipp, R&D manager

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Medical Vision Systems

David Pike, SAMTEC

In order to provide medical care, it is important to understand what is happening inside a patient’s body. The latest generation of vision systems is allowing doctors to create accurate imaging. This is providing a new understanding of the human body and is enabling a whole new approach to surgery and medical care. One of the key reasons that imaging is so important in successful diagnosis and treatment is that every patient is different. Each patient has a unique anatomy, and each will present symptoms in a different way. Despite the years of experience that doctors build up through the course of their careers, they cannot make assumptions and must be aware of the subtlety required when caring for patients. Creating an accurate image of the patient and their condition is vital to providing the ideal treatment.

For many years, X-ray technology offered the only real alternative to surgery in order to diagnose conditions. Exploratory surgery – the conducting of surgery to understand and diagnose a patient’s illness – increases the risk of secondary infection, and doctors have always looked for new methods that remove the need for invasive procedures. Advanced Vision Systems Modern imaging has come a long way since the early, crude experiments with X-rays. There are several technologies that allow doctors to form an image of the body without invasive procedures, including several that are familiar to the public – ultrasound, magnetic resonance imaging (MRI) and radiography. These are supplemented by other techniques that create visual representations

via the use of cameras and even fibre optics. Imaging is not just used for diagnosis. The use of robots in the medical field is growing quickly. The ability of robots to work quickly and with great precision makes them a powerful tool in the medical field. Healthcare professionals are constantly developing new techniques to provide the best possible care for patients with improved clinical outcomes and reduced hospital stays. The first robots used in the medical world were designed to facilitate minimally invasive treatments by providing improved visualization and precision for surgeons. This is where imagery is so important, as robots do not replace the experience and skill of the surgeon. Rather, they act as an extension of the surgeon’s hands, allowing them to treat patients

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Cover Image: The latest medical vision technology

while keeping damage to healthy tissue to a minimum. This precision reduces both patient discomfort and the time needed for recovery. These robotic hands are guided by the latest 3D cameras as the surgeon operating the robot needs to be able to see and act immediately, without delay. To achieve this, the robot needs to provide great visualization and speed and, in conjunction with the latest high-speed communications, can even allow surgeons to operate from a different location. Imaging and Treatment The line between imaging and treatment is starting to blur. One of the most interesting aspects of this latest generation of medical equipment is the use of optical technology. Fiber has long been used in the telecommunications industry due to its ability to carry large amounts of data over long distances. In the medical environment, fiber is being used in different ways. Its small diameter is ideal for employment in minimally invasive surgery, and its unique properties allow it to be used to provide surgeons with high resolution, real-time visualization. In addition, new sources of energy are being used to deliver treatment to highly localized areas without damaging the surrounding tissue. One of these new techniques is laser therapy, which can be applied with remarkable precision using optical fiber. Medical imaging systems have evolved a long way from the early X-ray machines. Not only is imaging providing new ways to provide diagnoses, but it can also provide crucial assistance in the treatment of a huge range of conditions. Samtec products are at the forefront

Figure 2: Medical robots rely on high-quality vision systems.

Figure 3: Samtec high speed connectors are ideal for medical vision systems of the latest imaging systems, from conventional RF connectors in vision devices to non-magnetic solutions for MRI applications and active optical systems to provide the highest possible data speeds. with the confidence that they need when creating medical products that are suitable for this new generation of imaging systems. For full details of these programs, and to see how Samtec products are supporting the latest innovations in the medical industry, visit the new Medical Applications page on Samtec’s rigorous Extended Life Product and Severe Environment Testing programs provide designers

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Alan Porter, Vice President of Electronics and Semiconductor Industry Strategy, Siemens true; during the depths of the first pandemic peak in mid-2020, sales of new vehicles fell, many dealers closed showrooms and auto plants were shuttered. That said, consumer vehicle retail sales rebounded far faster than anyone forecasted; it turned out that many people preferred driving instead of taking public transportation or airlines.

Growth in both the electronics and semiconductor industries has been accelerated by the global pandemic and greatly challenged by global chip shortages. When the pandemic took hold, remote work became the norm for many, and this has unexpected consequences. The overnight increase in demand for technologies that supported working from home, such as laptops, monitors, cameras, phones, exacerbated the already increasing chip consumption trend. As a result, fabs focused on fulfilling those orders, in addition to the adoption of 5G and Internet of Things (IoT) technologies. At the same time, the automotive industry predicted that the need for new cars would fall drastically due to the pandemic with travel restrictions and lockdowns in many countries. This prediction came

through 2022 as the market demand will be strong for products that are smarter, more functional, constantly connected, higher quality and less expensive. So, the big question for the electronics and semiconductor industries is what can be done to ease the pressing chip shortage? The long-term solution, of course, is to build more fabs, but that will take years, cost billions and represents a brute force approach. Conversely, there is risk that at some point we will return to over capacity. At Siemens, we believe that in 2022 companies can go a long way towards anticipating and solving IC supply chain problems by taking advantage of their existing manufacturing processes and the data inherent within it. By using solutions to extract data from smart manufacturing, it can be analyzed, processed and leveraged throughout

Interestingly, since employees could work from almost anywhere, the demand for recreational vehicles rose dramatically. As in many industries, manufacturers in this space were overwhelmed with orders, causing the further impact on the backlog and IC shortages. All these factors drove and continue to drive that increased demand for automotive ICs from the fabs. There is no doubt that the demand for microchips will remain high

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and semiconductor space, having held executive engineering roles as well as directed strategy, planning, and development at OEM’s including Apple and Huawei. From experience with directing startup teams of 5 employees to divisions of 200+ with a $50M+ budget, Alan is well equipped to assist partners with their digital transformation goals in the fast-paced electronics and semiconductor industry. Alan is also accustomed to the challenges of advancing innovation with a deep technical background in telecommunications, electrical and software engineering, and hands- on expertise in cloud computing. He has driven key technology advancements within the EDA industry during his leadership roles at Mentor, Cadence, and Synopsys. Alan is also active in professional organizations including IEEE, ACM and GSA. Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit software or follow us on LinkedIn, Twitter, Facebook and Instagram. Siemens Digital Industries Software – Where today meets tomorrow.

embody their intellectual property (IP) must consider IP security and be wary of counterfeit components. One of the many reasons the genealogy of the component, IP, or the chip must be traceable. Integrating into an intelligent digital marketplace system is also a must for the workflow in terms of electronic components. The current component shortage environment has genuinely exposed the fragility of supply chains and creates a mandate for digital transformation and intelligent decision making. A strong Design-to-Source Intelligence (DSI) ecosystem with engineering and supply chain professionals worldwide can transform how businesses design, source, market and sell products in the global electronics value chain. When all these approaches are used together, they can not only help semiconductor and electronics manufacturers to be more efficient and boost output with their current manufacturing assets, but, more importantly, they now can be resilient and react proactively when the next unknown crisis emerges. Digital Transformation provides the backbone of the smart factory of today and the future and will continue to be a powerful facilitator of advanced technologies, innovative designs, and tighter collaboration. Digitalization can allow the industry to turn design complexity into competitive advantage while continuously improving quality and reliability. Those who commit to a comprehensive digitalization strategy will be in the best position to lead the industry of tomorrow. AlanD. Porter - VP of Electronics and Semiconductor Industry is a 30-year veteran in the electronics

the product lifecycle to improve productivity and cost reduction through digital transformation. If companies can focus on automation and factories can run remotely, they can maintain production, even in the face of another pandemic or other major disaster or disruption. Automation software within the smart factory can collaborate with the supply chain ecosystem to get more real- time insights and companies can act accordingly and react more effectively when disasters strike. The IoT keeps everybody connected to any machine, system, or database in the factory. When combined with a low or no-code development platform, companies are very quickly able to gain insights into their data without having to learn the intricacies of the underlying technologies. Dashboards can be built and shared, while workflows pushed to mobile devices or phones allow employees to respond to their assigned issues in real-time. Then all the players in the chain have access to what they need to know based on their role in the chain. IC shortages also means companies are urgently looking for alternative suppliers. This means that their understanding of the resiliency of their supply chain must be in place to determine first and second sources and to mitigate the risks associated with switching vendors quickly. If a company is desperate to get the product out the door, it might be tempted to skip these concerns. But being smart about which vendors to trust is critical for companies because of security issues and the risk of relying on potentially untrustworthy sources. Additionally, companies whose IC designs

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Enabling Smart Robotics with Single-Board Computing

New-Tech Magazine group

The Booming and Evolving Robotics Market The robotics market is growing rapidly largely because of the widespread need and demand for automation technologies. Automation allows both organizations and individuals to eliminate time-consuming manual tasks. For businesses, this means boosting employee productivity while reducing costs and increasing compliance. For individuals, robotics allows them to automate mundane household chores like vacuuming so that they can also be more productive and find greater satisfaction in doing the things that they enjoy. As a whole, the global robotics technology market size was valued at some $62.75 billion in 2019. The market is projected to grow to an astounding $189.36 billion by 2027. Many factors are contributing to the widespread adoption of robotics. Industrial robots have not only become larger and can

Nearly 100 years have passed since the word “robot” was used for the first time in a play called R.U.R., short for Rossum’s Universal Robots. R.U.R. was about mechanical men that are built to work on factory assembly lines. Tired of poor treatment at the hands of humans, they eventually revolt. Countless Hollywood movies have adapted this same script, portraying evil robots and artificial beings. Robots are no longer just the workhouses of factory floors. Rather, their roles have expanded to those of personal assistants, autonomous vehicles, delivery vehicles, drones, and pocket-sized electronics. They play an integral role in organizations’ pursuit of digital transformation initiatives, which have only accelerated following the COVID-19 outbreak. As McKinsey noted in a recent report, “the COVID-19 crisis has brought about years of change in the way companies in all sectors and regions do business.”

handle heavier loads, but they also feature more axes and require fewer controllers, as in some cases, more than 30 axes can be synchronized by one controller. Robotics help organizations reduce their operational costs and remain competitive, while advancements in computing power, software, and networking technologies have made assembling, installing, and maintain robotics technology easier and more scalable than ever before. As well, lower production costs and technological innovations have led to significant decreases in prices. Another important factor fueling the rapid growth of the global robotics market is that the technologies intersect with nearly every major industry. For example the global autonomous car market is projected to grow to $3,195 billion in 2030. As of January 2021, there were 1,782,479 drones registered in the U.S. with sales

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