New-Tech Europe | February 2019

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IoT Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products semiconductor technology, introduced its smallest high-resolution image sensor, the ISOCELL Slim 3T2. While being the industry’s most compact image sensor at 1/3.4 inches (approximately 5.1-millimeters diagonally), the 0.8μm-pixel ISOCELL Slim 3T2 delivers 20-megapixel (Mp) resolution for both front and back cameras in today’s sleekest mid-range smartphones. “The ISOCELL Slim 3T2 is our smallest and most versatile 20Mp image sensor that helps mobile device manufacturers bring differentiated consumer value not only in camera performance but also in features including hardware design,” said Jinhyun Kwon, vice president of System LSI sensor marketing at Samsung Electronics. “As the demand for advanced imaging capabilities in mobile devices continue to grow, we will keep pushing the limits in image sensor technologies for richer user experiences.” With 20-million active 0.8μm-sized pixels, the ISOCELL Slim 3T2 not just provides excellent clarity and detail. It also offers high color fidelity by adopting Samsung’s

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performance advantages of the Company’s latest super- junction technology to full- and half-bridge topologies, Zero-Voltage Switching (ZVS) phase-shift converters, and applications and topologies generally that need a robust diode to handle dynamic dV/dt. Leveraging ST’s advanced carrier-lifetime control technology, the MDmesh DM6 MOSFETs have reduced reverse-recovery time (trr) tominimize power dissipation in the diode when turning off after freewheeling. Recovery softness is optimized to enhance reliability. In addition, very low gate charge (Qg) and on-resistance (RDS(ON)), together with a capacitance profile tailored for light loads, allow higher operating frequencies and greater efficiency, with simplified thermal management and reduced EMI. Ideal for equipment such as charging stations for electric vehicles, telecom or data-center power converters, and solar inverters, the new devices enable superior energy ratings with more robust performance and increased power density. Part of the STPOWER™ portfolio, the MDmesh DM6 family comprises 23 part numbers covering current ratings from 15A to 72A, with gate charge (Qg) ranging from 20nC to 117nC and RDS(ON) from 0.240Ω down to 0.036Ω respectively. The choice of popular power package options includes the new low-inductance leadless TO-LL, PowerFLAT 8×8 HV, D2PAK, TO-220, and TO-247 with short leads, long leads, or Kelvin pin for applications requiring precision current sensing. The MDmesh DM6 family is in production now. Please contact your local ST office for pricing and sample requests.

Design & Implementation n Requirements definitions n Initial concept design n Final design (Hardware, Software and mechanical design)

Test & Manufacturing n Verification testes n Validation test support n Test fixture design and manufacturing. Project Management n Project planning n Project control and management

Startup support n Project management n Feasibility testes n Project design Sysmop technologies ltd. | 3 Hatamar st. Yoqne׳am I llit, ISRAEL Phone: + 972-4-9090801 | admin@sysmop.com www.sysmop.com | Facebook: Sysmop Technologies

Samsung Introduces New Ultra-Slim 20Mp ISOCELL Image Sensor for Full-screen Display Smartphones Samsung Electronics, a world leader in advanced

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