EoW July 2014

News Corporate

Expo excellence! Representatives from 36 states and 22 countries shared networking activities, panel and roundtable discussions, and on the exhibition floor at Wire Expo staged at the Indiana Convention Center, Indianapolis, USA, at the start of May.

Organised by the Wire Association International, the event hosted more than 1,600 participants, including crossover atten- dance from the co-located AISTech 2014 trade show, which filled the adjacent B-D Halls at the centre. “The Operations Summit and Wire Expo turned out to be a big success as many positive comments were received about having the show in Indianapolis, with the hotels in close proximity to the convention centre, great opening reception

▲ ▲ Dane G Armendariz, right, receives the 2014 Donnellan Memorial Award from Andy Talbot, who will be first vice president of the Wire Association’s executive committee next year

at Lucas Oil Stadium, and many sessions on pertinent production solutions,” saidWAI president Bill Avise, of Leggett & Platt Inc. “Several exhibitors told me that they felt positive about the activity in their booth, along with many members saying that the production oriented sessions were very informative and well attended.” • a keynote presentation by speaker Dr Phillip Cornwell, of Rose-Hulman Institute of Technology, entitled: “The Technical Professional of 2020,” who explained how students are being groomed to prepare them for a future in engineering • visitor flow from the AISTech 2014 show and a ‘Metallurgy of Wire Rod’ joint conference session with WAI • conference sessions revolving around the ‘operational excellence’ theme, including ferrous and non-ferrous equipment forums; a continuous improvement case study; a mobile classroom to General Cable; a machinery roundtable; and safety forum • exhibits frommore than 207 wire and cable makers and suppliers Other popular activities were the production solutions demonstrations on wire breaks, dies, and lubricants; and presentation of WAI’s highest honours – the Mordica Memorial and Donnellan Memorial Awards – to Professor Motoo Asakawa, of Waseda University, Japan, and Dane G Armendariz, of Chemetall, respectively. Conference highlights included:

The following sponsors supported the summit: Platinum level : Wire & Plastic Machinery Corp. Gold level : Leggett & Platt Inc and Southwire Co.

Silver level : Carris Reels, Frigeco USA, Inc, Fort Wayne Wire Die Inc, Gem Gravure Co Inc, Lloyd & Bouvier, The MGS Group, Nexans, Niehoff Endex, Sampsistemi, Sikora International Corp, Steel Technologies LLC, andWindak Group. Bronze level : BASF, Caballé, Chemson, ExxonMobil Chemical, Radyne, and RichardsApex, Sonoco; as well as support from Baum’s Castorine, Commission Brokers, and Leoni.

Wire Association International – USA Website : www.wirenet.org

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July 2014