New-TechEurope Magazine | OCT 2019

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Harwin Provides Industry with Smallest & Most Lightweight Mixed-Layout Connectors To Date Featuring cable, vertical & right-angle PCB versions that all support 10A current delivery Harwin continues to extend the scope of its high- reliability (hi-rel) connector portfolio through the introduction of mixed-layout versions of the company’s popular Gecko-SL series. By complementing the data contacts with 2 or 4 power contacts (in power/data configurations of either 1+8+1 or 2+8+2), the Gecko-MT products enable significant space and weight reductions in electronic hardware. This means that they address modern system designs where major constraints can be placed on these parameters. The respective power and data current ratings are 10A and 2.8A max per contact. The initial release comprises female and male cable connectors, plus female vertical and male right-angle PCB connector options. These components are fitted with sturdy, stainless steel screw-lok fixings (in both conventional and reversed formats), to ensure ongoing interconnect integrity in even the most challenging of application environments. They have 20G vibration and 100G shock resilience and their operational temperature range spans from -65°C to 150°C. Low outgassing properties are also exhibited. By encompassing both data and power in a single compact and lightweight solution, Gecko-MT connectors are highly optimised for avionics, defence, space, and motorsport. Among the key target applications are robotics, unmanned aerial vehicles (UAVs), battery management and satellites. They are available from stock and through Harwin’s distribution network. In addition, cable assemblies can be requested for manufacture by Harwin’s in-house operations. “By specifying Gecko-MT, engineers will be able to streamline their designs, improve size and weight profiles and reduce bill-of-materials costs by using a smaller and lower-cost component than comparable Micro-D connectors,” states John Brunt, Product Manager for High-Reliability at Harwin. “By combining together power and signal in one robust mating pair, savings can be made in both weight and space, without any compromise in performance or longevity.”

Samsung Electronics Begins Mass Production of Industry’s First 12GB LPDDR4X-based uMCP Samsung Electronics, a world leader in advanced memory technology, announced that it has begun mass producing the industry’s first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) UFS-based multichip package (uMCP). The announcement was made as part of the company’s annual Samsung Tech Day at its Device Solutions’ America headquarters in San Jose, California., Formula E in Paris: Audi drivers brave April weather “Leveraging our leading-edge 24-gigabit (Gb) LPDDR4X chips, we can offer the highest mobile DRAM capacity of 12GB not only for high-end smartphones but also for mid-range devices,” said Sewon Chun, executive vice president of Memory Marketing at Samsung Electronics. “Samsung will continue to support our smartphone- manufacturing customers with on-time development of next-generation mobile memory solutions, bringing enhanced smartphone experiences to many more users around the globe.” Samsung is introducing its 12GB uMCP solution just seven months after its launch of a 12GB LPDDRX package based on 16Gb DRAM. By combining four of the 24Gb LPDDR4X chips (featuring the latest 1y-nanometer process technology) and ultra-fast eUFS 3.0 NAND storage into a single package, the new mobile memory is able to break through the current 8GB package limit and provide 10+ GB memory to the broader smartphone market.* As the trend toward larger, higher-resolution smartphone displays continues to grow, more users will benefit from Samsung’s uMCP solution when running data-intensive tasks or multitasking. With 1.5X capacity of the previous

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