New-Tech Europe Magazine | Jan 2018

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family’s cybersecurity technology helps ensure reliable and secure operation when multiple cameras around the vehicle are connected to a centralized system where data and commands must travel by wires between the sensor and the processor. For advanced imaging capabilities, software and algorithm testing is typically the longest task in the development program. With ON Semiconductor’s family of scalable image sensors, customers can start early development with one sensor to adapt their algorithms to the pixel performance and system features, and then extend to additional resolutions with further testing. This shortens project time-to-market and reduces overall development costs across a family of camera system implementations. “As the number of image sensors on a vehicle increases, having a scalable platform with common core features and pixel architecture becomes even more important for automakers to deliver new safety and self-driving features to market quickly and efficiently,” said Ross Jatou, vice president and general manager of the Automotive Solution Division at ON Semiconductor. “Our deep engagement with customers and the advanced features of our new image sensor family enable them to bridge development efforts across ADAS and autonomous driving programs.” ON Semiconductor will be demonstrating its new family of scalable image sensors, plus a wide range of other leading edge semiconductor-based solutions for automotive and other sectors at The Sands Convention Center/Venetian (Murano 3302) during CES 2018, January 9-12 in Las Vegas. The company’s imaging experts will be available all week to answer questions regarding solutions for automotive image sensor applications.

Fueling the future at CES ® : Infineon enables flexible wireless charging for automotive and consumer applications Efficient and Easy-to-use wireless charging for smartphones, wearables, medical and industrial devices possible with the AURIX™ and XMC™ microcontroller families. Infineon Technologies AG offers flexible chip sets for high performance including software IP for smart and safe wireless charging applications. Working with a systems solution partner, Infineon provides reference designs for both inductive and resonant wireless charging solutions for on-the-go charging, whether in the car, at home or in public places. Automotive in-cabin wireless charging The controller works seamlessly with power devices from Infineon to provide a complete charging solution: Voltage Regulator and Power MOSFET technology enable high efficiency power conversion, while network ICs serve for reliable communication according to highest automotive standards Supports the current 15 W charging standards, including fast charge smartphones, and can support future changes through a software update An enhanced power stage architecture improves Electro Magnetic Interference (EMI) performance 10- 15 dB over existing solutions on the market A newly developed supplemental Foreign Object Detection system provides enhanced detection accuracy to meet critical customer safety requirements “AURIX microcontrollers help the next-generation in- cabin wireless charging systems meet strict automotive safety, security, environmental and regulatory requirements”, said Ralf Koedel, Marketing Director Microcontroller at Infineon. ”Still, they enable industry- leading charging performance and efficiency”. Recharging consumer devices without complicated thermal management The Infineon XMC microcontroller provides a powerful and cost-effective platform. The scalable architecture can support everything from a fast charge smartphone, to a 20 W robot, up to a 60 W drone and beyond. Paired with power products, like MOSFETs and Driver ICs, this

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