New-Tech Europe Magazine | Jan 2018

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IoT Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products associated with Commercial Off-The-Shelf (COTS) devices is now available from Microchip Technology Inc. The ATmegaS64M1 is the second 8-bit megaAVR ® MCU from Microchip that uses a development approach called COTS-to- radiation-tolerant. This approach takes a proven automotive- qualified device, the ATmega64M1 in this case, and creates pinout compatible versions in both high-reliability plastic and space-grade ceramic packages. The devices are designed to meet radiation tolerances with the following targeted performances: Fully immune from Single-Event Latchup (SEL) up to 62 MeV.cm²/mg No Single-Event Functional Interrupts (SEFI) which secure memory integrity Accumulated Total Ionizing Dose (TID) between 20 to 50 Krad(Si) Single Event Upset (SEU) characterization for all functional blocks The new device joins the ATmegaS128, a radiation- tolerant MCU that has already been designed into several critical space missions including a Mars exploration plus a megaconstellation of several hundred Low Earth Orbit (LEO) satellites. The ATmega64M1 COTS device, along with its full development toolchain including development kits and code configurator, can be used to begin development of hardware, firmware and software. When the final system is ready for the prototype phase or production, the COTS device can be replaced with a pin-out compatible, radiation-tolerant version in a 32-lead ceramic package (QFP32) with the same functionality as the original device. This leads to significant cost savings while also reducing development time and risk. “Our COTS-to-radiation-tolerant approach results in a no-compromise, space-grade component and not merely an up-screened or enhanced device that’s targeted to the aerospace industry,” said Patrick Sauvage, director of Microchip’s aerospace business unit. “Developing with a COTS device that can be swapped out for a fully functional high-rel plastic or ceramic equivalent with the same pinout reduces development time, costs and risk for our customers.” The ATmegaS64M1 meets the high operating temperature range of -55° C to +125° C. It is the first COTS-to-

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recommendations that are tested and verified and can be directly replicated to maximize RF performance. The BALF-SPI2-01D3 is the latest in ST’s family of integrated baluns. There are now 16 devices, in package sizes down to 0.8mm2 and just 0.56mm high after reflow, for use with ST’s sub-1GHz or Bluetooth® low energy 2.4GHz radios, as well as with various transceivers from other manufacturers. As a critical enabling technology for these highly integrated matching devices, ST’s Integrated Passive Device (IPD) on non-conductive glass-substrate ensures low RF signal losses, with low amplitude and phase imbalances, ultimately resulting in superior RF-subsystem performance and longer operating life for battery-powered devices. With the increasing importance of connected, smart objects to support consumer lifestyles and to enhance business efficiency and innovation of new services in commercial, energy, and industrial sectors, designers can gain a competitive edge in these fast-growing markets by using ST’s integrated baluns to trim product dimensions, maximize performance, and shorten development cycles. The BALF-SPI2-01D3 is in production now, in a 6-bump 2.1mm x 1.55mm chip-scale package, priced from $0.176 for orders of 500 units.

Decrease Time to Market and Cost for the NewSpace Market by Using Radiation- Tolerant Solutions Based on COTS Devices C Developing radiation-hardened systems for space applications has a history of long lead times and high costs to achieve the highest level of reliability for multi-year missions in a harsh environment. Today, NewSpace and other critical aerospace applications require faster development and reduced costs. To meet these needs, a new microcontroller (MCU) that combines specified radiation performance with low-cost development

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