New-Tech Europe | Q3 2026 | Digital Edition

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IoT

IoT Computers Components Computers Electro Optic & Camera Packaging & Production Motion Automotive New Products to accelerate AI-driven workflows for increasingly complex multi-chip systems. NVIDIA is using the platform to automate system design processes for next-generation AI infrastructure, while TSMC is working with Cadence to support advanced packaging design for its 3DFabric® technologies. The platform targets high-performance applications such as AI infrastructure, hyperscale data centers, high-performance computing (HPC), automotive electronics, aerospace and defense, where system complexity and advanced packaging requirements continue to grow. ■ Source: Cadence. SCBM series mixed-density Combo-D connectors for spaceflight and harsh environment applications now available through Powell Electronics

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Cadence Launches AuraStack, Bringing Agentic AI to PCB and

Advanced Packaging Design

Cadence has introduced AuraStack, a new Agentic AI platform designed to automate and orchestrate the complete development process for printed circuit boards (PCBs) and advanced semiconductor packaging. The platform brings together AI-driven design, engineering analysis and multi-physics simulation into a unified workflow, enabling engineering teams to accelerate development while improving design quality. Built on the Cadence Allegro AI Studio, AuraStack coordinates multiple specialized AI agents across PCB layout, advanced packaging, system implementation and signoff, while integrating electrical, thermal and mechanical analysis throughout the design cycle. According to Cadence, this approach enables engineering teams to identify design issues earlier, reduce costly board respins and optimize overall system performance before physical prototypes are built. The company says the platform can reduce time to-market by up to two times while improving engineering productivity by as much as 15x through AI-driven automation, intelligent design exploration and continuous multi-physics optimization. AuraStack extends Cadence’s growing portfolio of Agentic AI solutions, complementing the company’s ChipStack, InnoStack and ViraStack platforms. Together, these technologies are intended to provide AI-assisted orchestration across the entire electronic system development flow, from silicon design through advanced packaging to PCB implementation. Cadence also announced collaborations with major industry partners, including NVIDIA and TSMC,

Positronic’s SCBM connector series, a high performance mixed-density D-sub connector family engineered for demanding spaceflight and harsh-environment applications, can now be sourced through Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial. The SCBM series is part of Positronic’s proven Combo-D product line and enables engineers to combine signal, power, coaxial, high-voltage and fiber optic contacts within a single connector platform. Designed to meet stringent aerospace and defense requirements, the SCBM Series delivers rugged mechanical performance, high current capability, and low-outgassing materials suitable for mission-critical systems. The connector family conforms to applicable material, dimensional, and performance requirements of GSFC S-311-P4, GSFC S-311-P10, and DSCC specification

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