August_EDFA_Digital

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 3 2 PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Felix Beaudoin Editor/GlobalFoundries; felix.beaudoin@ globalfoundries.com Scott D. Henry Publisher Mary Anne Fleming Manager, Technical Journals Kelly Sukol Production Supervisor Joanne Miller Managing Editor ASSOCIATE EDITORS Nicholas Antoniou Nova Measuring Instruments Navid Asadi AUGUST 2019 | VOLUME 21 | ISSUE 3 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS

GUEST EDITORIAL

EXPLORATION OF QUANTUM ELECTRONICS AND MAGNETICS FOR BEYOND CMOS COMPUTING Ian A. Young, Intel Corp. ian.young@intel.com

As the keynote speaker at ISTFA 2019, Dr. Young will elaborate on this topic during his presentation on Tuesday, November 12, at 9 a.m. T he unprecedented success of information technology over the past 50 yearswas based onMoore’s Lawand primarily one underlying technol- ogy—complementary metal-oxide-semiconductor (CMOS) field effect transistors (FETs). However, along with the slowdown in the rate of power supply voltage reductionwith the end of the CMOS FET’s Dennard scaling era, the power density of the CPU and GPU integrated circuit has been increasing and now challenges today’s power delivery and thermal cooling solutions. Present researchon logic technologies nowaims to complement CMOS rather than completely replace it. This approach is also planned as a continuation of Moore’s Law, which still persists despite multiple claims to the contrary. The beyond-CMOS research effort has been underway for 10 years, funded in the U.S. in large part by Semiconductor Research Corp. In Europe and Asia, recent R&D has resulted in breakthroughs in spin-orbit effects and new approaches to problems such as how to use non-volatile devices and their impact on architecture. The expectation in the research community 10 years ago was that

University of Florida Guillaume Bascoul CNES France Michael R. Bruce Consultant David L. Burgess Accelerated Analysis Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Szu Huat Goh GlobalFoundries Singapore Martin Keim Mentor, A Siemens Business Ted Kolasa Northrop Grumman Innovation Systems

Rose M. Ring Lam Research

t h i s f i e l d wou l d produce a compu- ting technology that surpasses CMOS in almost everyway. The reality is that despite many impres s i ve proposals and dem- onstrations, none of them beats CMOS. However, some of these alternative technologies offer valuable features such as low energy

Sam Subramanian NXP Semiconductors Paiboon Tangyunyong Sandia National Labs David P. Vallett PeakSource Analytical LLC Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr.

Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, designbyj.com

PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is pub- lished quarterly by ASM International ® , 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org.Copyright©2019byASMInternational.Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $150 U.S. per year. Authorizationtophotocopy itemsfor internalorpersonaluse, orthe internalorpersonaluseofspecificclients, isgrantedby ASM Internationalfor librariesandotherusersregisteredwith theCopyrightClearanceCenter(CCC)TransactionalReporting Service, provided that the base fee of $19 per article is paid directlytoCCC,222RosewoodDrive,Danvers,MA01923,USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest.

Courtesy of D.E. Nikonov and I.A. Young: JXCDC, 2015.

operation and non-volatility. Thus, the current vision is that beyond-CMOS circuits will replace CMOS in certain types of computing applications. These new circuits would bemonolithically integratedwith CMOS on the same chip or packaged together in a multi-chip module.

(continued on page 24)

edfas.org

edfas.org

Made with FlippingBook flipbook maker