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throughout the week, including lessons on automotive device FA, electrical overstress, andelectrostaticdischarge failure mechanisms. The short courses, organized in col- laboration with ISTFA on Saturday, November 9, offer a great opportunity to deep dive into a key topic. Register now by visiting the ISTFA website. The Expo starting on Tuesday is truly a one-of-a-kind event that showcases the latest tools, techniques, and solutions. With more than 80 vendors, it covers all areas pertinent to the failure analysis field. The Tools of the Trade Tour on Monday evening is the perfect way to see what is new and exciting this year. Sign up quickly, as the limited spaces run out fast. The Expo also serves as a gathering place to reconnect with colleagues and make new contacts, all while walking among the booths and enjoying a coffee or snack. ISTFA is much more than the sum of its technical con- tents. It is a community, a place where we meet friends andmentors. The conference begins onMondaymorning withaplentiful breakfast before starting theEDFASgeneral assembly. Dr. Lee Knauss, FASM, EDFAS president, will discuss the society’s strategic vision, recognize volun- teers, and present awards to individuals who significantly contribute to our industry and society. A new Women in Electronics Failure Analysis (WEFA) group kickoff event will be organized. WEFA is a community for everyone in the field of failure analysis for the electronics industry that aims to support, encourage, and mentor women to advance their careers and take leadership roles. ISTFA attendees are also invited to mix and mingle during the networking event Monday night at Portland’s famous PunchBowl Social, 10minutes fromthe conventioncenter. Oregon is also the location of Intel’s R&D center. For more than 50 years, Intel Corp. has been at the fore- front of semiconductor technological innovation. The ISTFA keynote speaker, Dr. Ian Young, is a senior fellow and director of Exploratory Integrated Circuits in the Technology and Manufacturing Group of Intel Corp. He currently leads a research group exploring future options for a more energy efficient integrated circuit technology beyond CMOS. Young will present an analysis of research in quantumnanoelectronics and nanomagnetics to iden- tify more energy efficient devices for logic beyond CMOS transitors that establish the future of competitive comput- ing technologies for the next decades to come. Results of beyond-CMOSdevicebenchmarkingat the circuit levelwill be reviewed, whichwill establish the future of competitive computing technologies and architectures for decades to come. Read more about Young’s keynote topic on page 2 in this issue.

Please join us this November in Portland and take this unique opportunity to get ahead today while acquiring technical knowledgeabout future technologies to success- fully advance your work, career, and professional growth.

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 3

A bike-share program called Biketown lets visitors tour around the city and its many parks.

ISTFA 2019 TECHNICAL SESSIONS Symposium sessions will be packed with high quality, innovative, and original unpublished pre- sentations in two tracks: Emerging FA Techniques Nanoprobing and Electrical Characterization Sample Preparation and Device Deprocessing Low Power Devices: Case Studies MixedMode&HighPower Devices: CaseStudies FA Processes: Case Studies Detecting and Preventing Counterfeit Microelectronics

Board and System Level FA FIB Circuit Analysis and Edit 3D Device Failure Analysis Packaging & Assembly Scanning Probe Analysis Microscopy Fault Isolation FIB Sample Preparation

Product Yield, Test & Diagnostics Space Application FA and Energy Hardware Attacks, Security, and Reverse Engineering

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