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Services Offered: High current plasma FIB services, sells FIB and replacement parts, and electron and ion sources. Tools and Techniques: Dual Ga LMIS/plasma FIB and single beam plasma FIB instruments. SEMION LLC

reliability assessment, surface analysis, thermal analysis, chemical analysis, and mechanical testing. Tools and Techniques: X-ray radiography, curve tracing, dye and pry tests for BGA joints, and solderability testing, thermal cycling and thermal shock testing, humidity testing and salt spray testing, XPS, AFM, DSC, TGA, TMA, ICP-MS, FTIR, and GC-MS. TYNDALL NATIONAL INSTITUTE Lee Maltings Complex Dyke Parade, Cork T12R5CP Ireland Specialty Products and Services - Electronics Packaging and Reliability Services +353 (0)21 2346093 finbarr.waldron@tyndall.ie info@tyndall.ie +353 (0)21 2346177 tyndall.ie/component-analysis Services Offered: Process and product development, design technology evaluation, electron microscopy, electronics packaging and reliability services, reliability testing, microelectronics and micro systems packaging, component analysis, product contamination analysis, thin film analysis (thickness and structure), failure analy- sis, materials characterization, surface analysis, (S)TEM sample preparation, trace analysis >10 ppm, 3D visualiza- tion, softmaterial cryo imaging (polymers and life science specimens; bio/food/pharma), correlative microscopy, FIB patterning/prototyping, and nanoparticle analysis. Tools and Techniques: Air-to-air thermal shock testing, temperature cycling, temperature/humidity testing, burn-in testing, high and low temperature storage tests, vibration testing, mechanical shock testing, drop/shock testing, salt spray testing, high temperature/vacuum storage, conditioning ovens, SEM/EDX, (S)TEM, DBFIB, electron diffraction (SAED), cryo SEM for soft materials, stereoscopic microscopes, 3D optical imaging system, x-ray imaging system with µCT-scan capability, SAM, PIND test system, perfluorocarbon gross leak test system, semi-automatic helium fine leak test system, chemical and mechanical package decapsulation, microsection- ing (moulding, cutting, grinding and polishing to a 1 µm finish), solder baths, solder wetting balance test sys- tem, Royce mechanical testers equipped with 20 g and 50 g wire bond pull cartridges and 20 Kg component/die shear cartridge, and Instron 5560 tensile and compressive mechanical test system equipped with 10, 50, 500, and 1000 N load cells.

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 3

1055 NE 25th Ave., Suite H Hillsboro, OR 97124-4901 503.332.9668 info@semionco.com semionco.com

Services Offered: High resolution SEM/STEM imaging, FIB cross sectioning and imaging, high resolution TEM imaging, sample preparation, EDS elemental analysis, probe milling, device edit and fabrication, sells Barlow CMOS 100 digital imaging system for analog TEM, Barlow in situ liftout systemfor FIB, BarlowSTEM imaging system, BatGrid carbon TEMgrid, replenishedGa LMI sources, and custom sample holders. Tools and Techniques: FEI Expida 1265 dual beam FIB/ SEM, FEI XL 835 dual beam FIB/SEM, Philips CM 120 TEM, and Philips CM 200 TEM. SUPERIOR TECHNICAL SERVICES INC. 6795 NE Evergreen Pkwy., Suite 202 Hillsboro, OR 97214 Services Offered: Microscope maintenance plans, com- puter and software upgrades, general microscope service needs, and user application and maintenance training; supports full range of FEI instruments: FIB 610/611, FIB 200, FIB 800, DB 820, DB 825i, XL50, XL 830/865, and DB 835/865; application training, expert troubleshooting and component level fault repair, instrumentmoves, computer upgrades, and direct replacement consumables for FEI/ TFS and FIB/SEM. TÜV SÜD Westendstraße 199 80686 München Germany +49 (0)89 5791 0 info@tuev-sued.de tuvsud.com/en ServicesOffered: Testing and inspection services for elec- trical and electronic products and components, coating/ thin filmevaluation, PCB evaluation, product evaluation, 888.458.4035 503.828.0460 service@superior-technical.com superior-technical.com/ion-beam-issues

Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: Elaine Yusa, Business Development Manager 312.304.1555, elaine.yusa@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit.

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