August_EDFA_Digital

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 3 54 GUEST COLUMNIST DESK REFERENCE UPDATE: ESSENTIAL FA TOOL GETS A MAKEOVER Tejinder Gandhi, Maxim Integrated, San Jose, California tejinder.gandhi@maximintegrated.com W ith the development of new multilevel pack- ages, sophisticated application circuits, and ever-shrinking integrated circuit feature sizes, identifying the root cause of a failure is becoming more challenging. Failure analysis support is needed through- out the product life cycle, from technology development,

preparation, CAD navigation, laser-assisted device alteration (LADA), soft defect location (SDL), lock-in thermography, laser voltage probing (LVP), photon emission, EOTPR/TDR/TDT, and current imaging. 4. Device and Circuit Characterization—scanning electron microscopy (SEM)-based and atomic force

design debug, fabrication, packaging, and reliability qualification to produc- tion failures and customer returns. By 2020, root cause determination will require knowledge of advanced failure analysis tools and newly developed techniques as well as strategic planning to determine which method to use and when. To succeed, an analyst’s skills and knowledge must continue to grow as the defects and features we investigate relentlessly shrink in size. The Electronic Device Failure Analy- sis Society proudly announces the 7th Edition of the Microelectronics Fail- ure Analysis Desk Reference, published by ASM International, available this fall. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of

microscopy (AFM)-based nanoprobing. 5. FIB Technique and Circuit Edit— FIB overview and advanced circuit edit for first silicon debug. 6. Physical Analysis—deprocessing, cross section analysis, scanning electron microscopy, material analysis techniques, transmission electron microscopy (TEM), and scanning probe microscopy. 7. Memory FA—DRAM, semiconductor memory failure signature analysis. 8. Special Applications—automotive FA, 2.5 and 3D packaging failure analysis, microelectromechanical systems (MEMS), optoelectronics, solar, and counterfeit electronics. 9. Fundamental Topics—integrated circuit testing, analog design, reliabil-

The Desk Reference, 6th edition, is now under revision.

failures. Preparedby a teamof experts, this updatedhand- book offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. Topics include: 1. Failure Analysis Process and Management—wafer, package, and board level failure analysis flow. 2. Incoming Inspection Tools—optical, x-ray, and scan- ning acoustic microscopy. 3. Fault Isolation—front and backside sample

ity, quality, and training. Seven new topics have been added and all themes covered in earlier editions are again included in the 7th Edition; many previous articles have been updated. For more information, visit edfas.org. To maintain your edge and ensure your company has the benefit of sound advice from today’s leading failure analysis experts, plan to order the newedition of the Desk Reference this fall.

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