August_EDFA_Digital

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 3 6 ACKNOWLEDGMENTS ABOUT THE AUTHORS

2. Conf. Proc., 2014. 3. R. Alvis, et al.: “Plasma FIB DualBeam: Delayering for Atomic Force NanoProbing of 14 nm FinFET Devices in an SRAM Array,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2015, p 388-400. 4. J.V. Oboňa, et al.: “Delayering14 nm Node Technology IC with Xe Plasma FIB,” European Microscopy Congress, 2016, p 267-268. 5. Conf. Proc., 2016. 6. V. Viswanathan, S. Sharang, et al.: “Precision Xe Plasma FIBDelayer- ing for Physical Failure Analysis of Sub-20 nm Microprocessor Devices,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2017, p 574-599.

The authors would like to acknowledge funding sup- port fromthe Technological Agency of the Czech Republic *TE 01020233 (AmiSpec) and also Brenda Prenitzer, Ph.D., from Nanospective, Orlando, Fla., for providing 14 nm technology samples for the delayering process. REFERENCES 1. P. Carleson, et al.: “Delayering on Advanced Process Technologies using FIB,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2014, p 430-435.

Sharang Sharang is an applications development engineer at Tescan Brno, Czech Republic, spe- cializing in XePlasma FIBapplications. He has beenworking in the fieldof electron and ionoptics since 2013 and specializes in focused ion beam-based semiconductor applications specifically for physical failure analysis. He has a master’s degree in scientific instrumentation from University of Applied Sciences Jena, Germany, focusing on scanning electron microscopy and micro and nano-analysis techniques. He has contributed to several conference papers, articles, and posters. He represents Tescan Orsay Holding across the globe in semiconductor failure analysis conferences and meetings, contributing with leading edge solutions. He is working on a large area deprocessing technique with

special gas chemistries using FIB-SEM systems. He currently works and lives in Brno, Czech Republic. Paul Anzalone works at Tescan in the U.S. as the technical support manager for sales, applica- tions, and service. He has been working in the field of electron and ion optics since 1995. He has published numerous white papers, articles, and posters. He also co-authored two books. Anzalone works closely with strategic customers in the U.S. on delayering techniques with gas chemistries using FIB-SEM systems to expose trojans in semiconductor devices. He is active in cybersecurity detection and analysis using FIB-SEMdelayering techniques. He currently resides inNewHampshire. Jozef Vincenc Oboňa is a product marketing director at Tescan Orsay

Holding, a.s. His primary focus is on theproper positioningandmarketingof Tescan’s FIB-SEMportfolio in the semiconductor market segment and searching for new product development opportunities. He earned a degree in chemistry at the Slovak University of Technology in Bratislava and a Ph.D. in electrical engineering at the Slovak Academy of Sciences. After seven years of postdoctoral positions at universities in Spain and the Netherlands, he started his career as the R&D application manager at Tescan in 2014.

Whether networking at events or accessing information through EDFA , ISTFA proceedings, or journals, our members have the edge. Now it’s time to introduce EDFAS to others in the industrywhowould like to take advantage of these career- enhancing benefits. Help us help the industry by expanding our membership and offering others the same exceptional access to information and networking that sets EDFAS apart. To reacquaint yourself with and introduce others to the EDFAS member benefits, visit asminternational.org/web/edfas/membership. EDFAS MEMBERSHIP

edfas.org