31 / 84
HIGH DENSITY ARRAYS
• (1,27 mm x 1,27 mm) .050" x .050" grid array for maximum grounding and routing flexibility
• Up to 500 single-ended I/Os or 125 differential pairs (using Samtec recommended pin assignments)
• Rugged Edge Rate® contact system less prone to damage when “zippered” to unmate
• 0,80 mm pitch system for up to 50% board space saving
• Right angle and low profile systems
• Ultra high density, ultra-low profile compression arrays