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New-Tech Magazine Europe l 61
components suitable for space
applications. Requirements vary
widely depending on many factors
including the component type,
materials, and other details specific
to the flight program. Mini-Circuits
has successfully screened hi-rel
components for a range of space
requirements, and this experience
has enabled us to develop well-
established qualification processes
for these demanding applications.
For more information about qualifying
parts for space applications, please
contact our applications team
3
Qualification Flow
Units from Stock
or New Production
DPA
a)
External visual
inspection
b)
Prohibited materials
analysis of external
surfaces
c)
Internal visual inspection
of sectioned devices
Thermal Shock
-55 to +125˚C
10 Cycles,
10 Minutes
Bake-In
24 hr. stabilization
bake exposure at
+100˚C
Real-Time
Radiographic
Inspection
2 views
Final
Visual/Mechanical
Inspection
10x magnification; 5
units inspected for
dimension
Humidity
+85˚C and +85RH,
1.3VDC ±0.25VDC
test voltage applied
Destructive
Electrical Screening
@ +25˚C, -55˚C,
and +100˚C;
samples soldered
on PCB
Solderability
Units soldered on
test board and
inspected per
IPC-A-610
GROUP A
100% Screening
Leach Resistance
Immersion in
+260˚C solder,
10 sec.
Terminal Strength
Push force of
0.5mm/s applied to
samples soldered to
test board
GROUP B
Sample Screening
12 Units
10 Units
5 Units
3 Units
3 Units
Figure 2: Qualification flow for LTCC low pass filter for a specific space flight program.
3
Qualification Flow
Units from Stock
or New Production
DPA
a)
Extern l visual
inspection
b)
Prohibi d materials
analysis of external
surfaces
c)
Intern l vi ual inspection
f sectioned devices
Thermal Shock
-55 to +125˚C
10 Cycles,
10 Minutes
Bake-In
24 hr. stabilization
bake exposure at
+100˚C
Real-Time
R diographic
Inspection
2 views
Final
Visual/Mechanical
Inspection
10x m gnification; 5
units inspected for
d mension
Humidity
+85˚C and +85RH,
1.3VDC ±0.25VDC
test voltage applied
Destructive
Electrical Screening
@ +2 ˚C, -55˚C,
and +100˚C;
samp es soldered
on PCB
Solderability
Units soldered on
test board and
inspected per
IPC-A-610
GROUP A
100% Screening
Leach Resistance
Immersion in
+260˚C solder,
10 sec.
Terminal Strength
Push force of
0.5mm/s applied to
samp es soldered to
test board
GROUP B
Sample Screening
12 Units
10 Units
5 Units
3 Units
3 Units
Figure 2: Qualification flow for LTCC low pass filter for a specific space flight program.
Qualification Flow
Units from Stock
or New Production
DPA
a)
External visual
inspection
b)
Prohibited materials
analysis of external
surfaces
c)
Internal visual inspection
of sectioned devices
Thermal Shock
-55 to +125˚C
10 Cycles,
10 Minutes
Bake-In
24 hr. stabilizatio
bake exposure at
+100˚C
Real-Time
Radiographic
Inspection
2 views
Final
Visual/Mechanical
Inspection
10x magnification; 5
units inspected for
dimension
Humidity
+85˚C and +85
1.3VDC ±0.25V
test voltage appl
Destructive
Electrical Screen
@ +25˚C, -55˚
and +100˚C;
samples solder
on PCB
Solderability
Units soldered
test board an
inspected per
IPC-A-610
GROUP A
100% Screening
Leach Resistan
Immersion in
+260˚C solder
10 sec.
Terminal Stren
Push force o
0.5mm/s applie
samples soldere
test board
Figure 2: Qualification flow for LTCC low pass filter for a specific space flight pr
Table 1: Screening process summary