New-Tech Magazine | September 2017

HIGH SPEED SOLUTIONS

• SEARAY™ open pin field arrays with up to 500 I/Os and 1.27 mm pitch for maximum grounding and routing flexibility • Integral power/ground plane connectors on 0.50 mm, 0.635 mm and 0.80 mm pitch • Edge Rate® contacts optimized for signal integrity performance • ExaMAX® high-speed backplane system delivers 28 Gbps electrical performance with a migration path to 56 Gbps • High-speed micro coax and twinax cable assemblies for differential and single-ended applications • Flyover QSFP cable assembly flies critical high-speed signals over the PCB for improved and extended signal integrity • FireFly™ cable assembly offers interchangeability of copper and optical using the same micro connector system

Samtec Israel • 21 Bar-Kochva St. • Concord Tower • B’nei Brak, Israel 51260 Tel: +972 3 7526600 • Fax: +972 3 7526690 • E-mail: israel@samtec.com • www.samtec.com