New-Tech Magazine | AUG 2023 | Digital Edition
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Motion Automotive Componenst that supports data rates up to 112 Gbps PAM4 )56 Gbps NRZ( with robust and reliable solder joints that meet industry standards. You can freely access the white paper in the Samtec Technical library to see the specific test methods and simulations used as well as the inspection criteria. The key takeaway is: Next generation grid array interconnects can be used for advanced and future applications. Samtec currently offers AcceleRate® and AcceleRate®HP products with this lead style and has several other products in development. The test data collected in this research as well as deployment in major OEM applications validate the robustness of the solder joints and support that this design meets or exceeds all current expectations and requirements for SMAA technologies. לקבלת מפרטי המוצרים, עיין ב: www.samtec.com Samtec Israel Tel: 03-7526600 Email: israel@samtec.com Computers
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next-generation board-to-board )B2B( surface mount area arrays )SMAAs(. While pin-in-ball SMAAs have been widely used in the industry for decades, they have lacked IPC classification. The demand for B2B SMAAs compatible with IPC-A-610 and IPC J-STD-001 Class 3 acceptance criteria is increasing as these types of interconnects are necessary to advance the state of the art for space-constrained applications in areas such as medical and military/aerospace design. The work in this paper shows that next-generation grid array interconnects meet the solder joint reliability and signal integrity performance required to support these high-reliability high-speed applications. The white paper steps through detailed analysis of the new SMAA connectors, including improved automated x-ray inspection )AXI( as well as reliability testing per IPC-9701 and EIA-364-1000 test methods. The analysis includes both pin-in-ball and non-solder ball versions. The tail of the next-generation pin-in-ball grid array component incorporates a fully plated, rounded, and coined bottom with contoured sides for increased robustness and an attached collapsible solder ball. These components are typically soldered to round land patterns. Samtec also offers non-solder ball versions, which use the same tail style but are soldered with increased solder paste volume in lieu of an attached solder ball. The contoured tail style allows deeper tail penetration and an increased solderable surface area with signal integrity performance
SoMs offer in system architecture design. Secondly, so many SoMs use Samtec high-speed board-to boardconnectors. Here we go again, indeed! UltraSOM! – New Artix UltraScale+SoM Family Embedded computing is global in nature, but there seems to be a lot of SoM design and FPGA design services companies in Germany. Two examples are AVT Ilmenau and senTec Elektronik. Both firms offer unique, application specific R+D and design services for FPGA, MCU and SoC hardware and software. Recently, AVT Ilmenau and senTec Elektronik have joined forces to create a new SoM platform AMD Artix and Kintex UltraScale+FPGA devices – UltraSOM, The Universal FPGA Platform. These modules offer a number of advantages for FPGA and SoC developers UltraSOM comes in two different options. The UltraSOM A variant targets applications using Artix UltraScale+ devices supporting between 96-308k logic cells. Similarly, the UltraSOM K variant targets applications using Kintex UltraScale+ devices supporting between 356-475k logic cells. Key highlights of the UltraSOMs include: System on Module for development and series products World’s only SOM board for 4 types of Artix UltraScale+ and 2 types of Kintex UltraScale+ FPGAs. World’s only SOM board for low cost PCIe 4.0 solutions with AMD FPGAs Mutiple High-Speed Gigabit Transceivers UltraSOM A: 12x XCVRs up to 16 Gbps
Samtec High-Speed Interconnect Enable New Artix and Kintex UltraScale+ SoMs “Here we go again!” Yes, it is another blog on FPGA based system-on-modules )SoMs(. Why, you, dear reader, may wonder? Simply, embedded computing engineers love the versatility, flexibility and scalability that
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