New-Tech Magazine | AUG 2023 | Digital Edition

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Motion Automotive Componenst process cycles, and high reliability. The prodesign FALCON Stratix® 10 Acceleration Card is based on Intel’s high-end Stratix 10 MX/ NX technology and is the ultimate multifunctional accelerator for HPC, data center, virtual networks, and broadcast solutions. Stratix 10 has massive memory bandwidth )up to 512Gbit/s( by the integration of 3D-stacked High Bandwidth Memory 2 )HBM2(. Over 2.000.000 Logic Elements )LEs(, over 3900 Digital Signal Processing )DSP( blocks, and a transceiver speed of up to 57.8 GBit/s )PAM4( allow the user to realize their design with maximum flexibility at maximum speed. In addition, the PCIe card is equipped with an Intel MAX10, which is used as Board Management Controller )BMC(. Besides Stratix 10 technology, the prodesign FALCON supports PCIe® 3.0 x16 and offers incredibly high I/O bandwidth featuring four 100GE QSFP-DD front ports enabling 8x 100Gbit/s or 4x 200Gbit/s. Samtec NovaRay Extreme Density Arrays Additional connectivity is provided via three programmable SO-DIMM sockets for DDR4 memory modules or custom extension boards. Three Samtec NovaRay 112 Gbps PAM4 Extreme Density Arrays also offer additional expansion capabilities. The innovative design of NovaRay combines extreme density and extreme performance, which is critical as system sizes decrease and speeds increase. The fully shielded differential pair design and two reliable points of contact contribute to the industry-leading 4.0 Tbps aggregate data rate. The NovaRay connectors perfectly Computers

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the prodesign FALCON card’s connectivity. Eight transceiver lanes, ten additional I/ Os, and two differential clock pairs per NovaRay provide the possibility to interconnect multiple PCIe cards or add custom extension boards, all while maintaining an unrivaled small footprint. The option of using NovaRay arrays or cable assemblies fully leverages the flexibility of the

New prodesign Acceleration Card Includes Samtec NovaRay® Extreme Density Arrays The recent popularity and interest in ChatGPT underscore the progress AI has made in affecting everyday life. Who has asked ChatGPT to finish a homework assignment or write a blog? )For full disclosure, this blog has been written by a real person. Or has it? ) In any case, the backbone of chatbots like ChatGPT and similar services are high-performance compute platforms enabling neural networks and AI acceleration in data centers. Obviously, GPUs have a leadership position in AI hardware architectures. However, other solutions are reaching the market for specific applications. New FPGA Acceleration Platforms from prodesign Some good examples of new acceleration platforms are the “prodesign HAWK” and “prodesign FALCON” from PRO DESIGN. The new FPGA cards target High Performance Computing )HPC(, They have been developed with a focus on innovation, tip-of-the-spear technology, and the highest quality requirements and functionality. Based on 40 years of experience in the E²MS and FPGA market, PRO DESIGN has extensive knowledge in the area of FPGA design, board development, electronic engineering, high-performance PCB design, construction, production, assembly, and testing. PRO DESIGN’s specialists work closely together and take advantage of interdisciplinary synergies. The results are powerful, cost-efficient high-end solutions characterized by sophisticated concepts, short

prodesign FALCON platform. לקבלת מפרטי המוצרים, עיין ב: www.samtec.com Samtec Israel Tel: 03-7526600 Email: israel@samtec.com

Validating the Performance of Miniature Array Connectors Small, complex, and portable applications )in industries such as military/aerospace and medical) require miniaturized, reliable interconnects. As traditional surface-mount and through-hole interconnects reach their limits in terms of density and the number of signals that can effectively be used, many product designers are implementing high I/O array styles of interconnects. In a new white paper from Samtec, “Improved Solder Joint Integrity for High Density Interconnect Applications,” the authors, Robbie Huffman and David Decker, detail the design characteristics and verification testing used to validate the robustness of the solder joints as well as the signal integrity in these

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