New-Tech Europe Magazine | May 2018
New-Tech Europe Magazine | May 2018
20 Customized cybersecurity: encrypting unique codes on chips with maskless lithography 26 From the HDBaseT revolution to the new IoT world - everything you wanted to know and didn't have whom to ask 34 Instrumentation and the Internet of Things - Seven Essentials for Rugged Connectors in Instrumentation Applications. 40 A record year for DigiKey Electronics
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10 LATEST NEWS 20 Customized cybersecurity: encrypting unique codes on chips with maskless lithography 24 “Computation in Memory fits into a new concept of scaling that may bring huge, largely untapped energy-savings” From the HDBaseT revolution to the new IoT world - everything you wanted to know and didn't have whom to ask 26 Instrumentation and the Internet of Things - Seven Essentials for Rugged Connectors in Instrumentation Applications. 40 A record year for DigiKey Electronics 42 New-Tech interview with Eitan Livneh, President & CEO of Orbit Communications Systems 46 Characterization Methods for Flexible Absorber Sheets WE-FAS HIL improves test coverage, lowers R&D costs and streamlines certification processes, leading to better products and lower OPEX. 56 Choosing and Using Advanced Peltier Modules for Thermoelectric Cooling 60 Affordable Solutions for Testing 28 GHz 5G Devices with Your 6 GHz Lab Instrumentation 52 30 Using PoE networks to power IoT smart infrastructure for commercial buildings 34
66 OUT OF THE BOX 68 NEW PRODUCTS 82 INDEX
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New-Tech Magazine Europe l 9
Infineon launches new Development Center for automotive electronics and artificial intelligence in Dresden
Infineon is setting up a new Development Center at its Dresden location. The company is planning to create around 100 additional new jobs in the first phase. The new Development Center is expected to employ a total of around 250 people in the medium term. One focus of it will be to develop new products and solutions for automotive and power electronics, as well as artificial intelligence. It is scheduled to be launched in the course of the 2018 calendar year. In Dresden, the Infineon Group already has one of its largest and most cutting-edge locations for developing wafer technologies and manufacturing processes, as well as a highly automated production plant. 2,200 employees carry out research into and develop technologies for microcontrollers, sensors and power semiconductors and make chips there – including for the automotive industry. System integration is gaining in importance to enable complex interaction between semiconductors in more and more technically sophisticated cars. Modeling complex systems and developing highly integrated products will be one of the new Development Center’s core tasks in addition to chip design. “Microelectronics is responsible for around 90 percent of all innovations in the car. Semiconductors are a prerequisite for electromobility and autonomous driving, trends that are major growth drivers for Infineon,” says Dr. Reinhard Ploss, Chief Executive Officer of Infineon Technologies AG. “Algorithms, artificial
intelligence and the Internet of Things play a key part in the increasing networking of traffic systems. The new Development Center will also address those issues intensively. We will create synergies as a result of the direct links with our development and production location in Dresden. That will help us develop products faster and put them on the market
sooner.” “Over the past years we’ve continuously increased our share of the growing market for automotive electronics,” says Peter Schiefer, Division President Automotive at Infineon. “We’re one of the technology leaders in the field of electromobility and autonomous driving. We’ll expand our leading position further thanks to the new Development Center in Dresden.” “The State Government of Saxony offers us ideal conditions to do business in Dresden,” says Mathias Kamolz, Managing Director of Infineon Technologies Dresden GmbH. “We can also leverage a broad network of suppliers, universities, research establishments and public institutions in Saxony. The new Development Center will help Infineon enhance its development expertise in Dresden and deepen its successful collaboration with local partners.” Automotive is Infineon’s largest business area: Semiconductors for the automotive industry generate 42 percent of the Group’s revenue. Infineon expects that the trend toward electrically driven, connected and increasingly autonomous cars will help boost its growth significantly in the coming years.
CMOS Image Sensor Sales Stay on Record-Breaking Pace
The spread of digital camera applications in vehicles, machine vision, human recognition and security systems, as well as for more powerful camera phones will drive CMOS image sensor sales to an eighth straight record-high level this year with worldwide revenues growing 10% to $13.7 billion, following a 19% surge in 2017, according to IC Insights’ 2018 O-S-D Report—A Market Analysis and Forecast for Optoelectronics, Sensors/Actuators,
and Discretes. The new 375-page report shows nothing stopping CMOS image sensors from continuing to set record-high annual sales and unit shipments through 2022 (Figure 1). CMOS image sensors continue to take marketshare from charge-coupled devices (CCDs) as embedded digital-imaging capabilities expand into a wider range of systems and new end-use applications, says the 2018 O-S-D Report. With
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Latest News the smartphone market maturing, sales growth in
vision in robots and cars, human recognition, hand-gesture interfaces, virtual/augmented reality, and medical systems. In new smartphones, CMOS image sensors are also seeing a new wave of growth with the increase of dual-lens camera systems (using two sensors) for enhanced photography. Cellular camera phones accounted for
CMOS image sensors slowed to 6% in 2016, but strong demand in other imaging applications played a major factor in boosting revenues by 19% to $12.5 billion last year. Sales of CCD and other image sensor technologies fell 2% in 2017 to about $1.6 billion after rising 5% in 2016, according to the new IC Insights report.
62% of CMOS image sensor sales in 2017, but that marketshare is forecast to slip to 45% in 2022. Automotive CMOS image sensors are projected to grow the fastest among major end-use applications through the five-year forecast shown in the new O-S-D Report, rising by a compound annual growth rate (CAGR) of 38.4% to about 15% of total CMOS image sensor sales in 2022 ($2.8 billion) while camera phone-generated revenues are expected to rise by a CAGR of just 2.2% to $8.6 billion that year.
Overall, CMOS image sensors grabbed 89% of total image sensor sales in 2017 compared to 74% in 2012 and 54% in 2007. Unit shipments of CMOS imaging devices represented 81% of total image sensors sold in 2017 compared to 64% in 2012 and 63% in 2007. New CMOS designs keep improving for a variety of light levels (including near darkness at night), high-speed imaging, and greater resolution as well as integrating more functions for specific applications, such as security video cameras, machine
DARPA selects BAE Systems for optical seeker on precision munitions
The U.S. Defense Advanced Research Projects Agency (DARPA), through the U.S. Air Force Research Laboratory, has awarded BAE Systems a $13.1 million contract to demonstrate a new, cost-effective optical seeker for precision-guided munitions. The seeker is designed to improve navigation, as well as automate target
lowers the cost typically associated with precision guidance,” said Mark Meisner, a chief scientist at BAE Systems. “The SECTR program is allowing us to deliver advanced sensing and navigation capabilities for munitions to warfighters faster.” The seeker’s open architecture enables highly accurate,
location and homing, for different types of munitions that are used in GPS-denied and other contested environments. BAE Systems tested the seeker during the first phase of DARPA’s Seeker Cost Transformation (SECTR) program. The SECTR seeker integrates with a wide range of weapon platforms that use munitions and can operate in day or night. It enables autonomous precision guidance via passive electro-optical and infrared sensors in environments where GPS navigation is unavailable or unreliable. “Low-cost, precision munitions are critical to our customers, which is why we’ve developed a flexible seeker that radically
competitive, low-cost munitions to be capable of navigating and locating targets in limited-access and denied environments. It provides these munitions with quick- reaction capabilities while meeting stringent cost, size, weight, and power requirements. The open architecture also enables rapid seeker integration into current and new weapon systems. This phase of the program will conclude in July 2019 with multiple test firings on several precision-guided munition platforms.
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Digi-Key Offers Unlimited Access to Ultra Librarian EDA/ CAD Models
Digi-Key Electronics, a global electronic components distributor, announces unlimited access to Ultra Librarian symbols, footprints, and 3D STEP models from digikey. com. “To better serve our customers we have worked with EMA to remove the download limits of Ultra Librarian EDA and CAD models,” said Randall Restle, VP, Applications Engineering at Digi-Key. “We now
full portfolio of EDA and design tools, visit the Digi-Key website. About Ultra Librarian Ultra Librarian® is a comprehensive electronic component solution for PCB design. www.UltraLibrarian. com allows visitors to search a database of over 40 million components to make part selection and sourcing decisions. Registered
users can download pre-authored and verified components from the world’s largest database of over 14 million CAD neutral library parts. Symbols, footprints, and 3D models from over 400 manufacturers can be exported to over 20 different CAD tools. Library creation software includes templates for over 600 part types and allows easy customization and export to the same 20+ CAD tools. Ultra Librarian is owned by EMA Design Automation. Visit www.UltraLibrarian.com for more information. About Digi-Key Electronics Digi-Key Electronics, headquartered in Thief River Falls, Minn., USA, is an authorized global, full-service distributor of electronic components, offering more than 6.8 million products, with over 1.4 million in stock and available for immediate shipment, from over 750 quality name-brand manufacturers. Digi-Key also offers a wide variety of online resources such as EDA and design tools, datasheets, reference designs, instructional articles and videos, multimedia libraries, and much more. Technical support is available 24/7 via email, phone and webchat. Additional information and access to Digi-Key’s broad product offering can be found by visiting www.digikey.com.
have model coverage for over 1.25 million parts, meaning our customers will be able to download a very high percentage of the models they need for a design, saving a significant amount of time during the design cycle.” Ultra Librarian offers models in over 20 EDA and CAD formats to cover the vast majority of the PCB design tools in use, including Altium, Eagle, KiCad, OrCAD, and PADS. Models are created using the Ultra Librarian Desktop software, which uses a sophisticated combination of templates, pdf extraction, and verification algorithms to quickly capture all important component information required. To ensure the highest accuracy, consistency, and adherence to IPC and other standards, models undergo more than 30 different verification checks, and many of the models are also verified by their respective device manufacturer. “We want to help our customers get their designs done faster and with fewer design spins,” said Manny Marcano, president and CEO of EMA Design Automation. “Providing this improved access through Digi-Key gives our mutual customers an easy way to improve their design process.” For more information about Ultra Librarian, as well as the company’s
TowerJazz and Newsight Imaging Announce Advanced CMOS Image Sensor Chips for LiDAR used in ADAS and Autonomous Vehicles
TowerJazz, the global specialty foundry leader, and Newsight Imaging, announced production of Newsight’s advanced CMOS image sensor (CIS) chips and camera modules, customized for very high volume LiDAR and machine vision markets,
combining sensors, digital algorithms and pixel array on the same chip. Newsight’s CIS chips are used in ADAS (advanced driver assistance systems) and autonomous vehicles as well as in drones and robotics.
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Latest News LiDAR (Light Detection and Ranging), a detection
used in cutting-edge 3D pulsed based LiDARs for automotive applications and is based on Newsight’s eTOF (enhanced time-of-flight), which bridges the gap between short-distance iTOF (indirect time-of-flight) and the long distance automotive requirement, by extending the dynamic range while retaining
system which works on the principle of radar, but uses light from a laser, is considered a must have for autonomous driving due to its high resolution at long distances, and market growth is expected to be exponential once L4/L5 autonomous vehicles become mainstream. IHS
estimates the automotive LiDAR semiconductor market will reach $1.8 billion by 2026, with 37% CAGR (2018-2026). By utilizing TowerJazz’s advanced 180nm technology, featuring a wide range of customizable pixel architectures and technologies, Newsight is well-positioned to address the vast opportunities in the automotive market as well as in the security, defense, medical, industrial, and consumer markets. Newsight’s innovative image sensor chips are ideal for high volume, competitive applications requiring cost effectiveness, low power consumption, high performance, and analog and digital integration. The NSI3000 sensor family, currently in mass production at TowerJazz’s Migdal Haemek, Israel facility, offers extremely high sensitivity pixels, enabling the replacement of expensive CCD (charge-coupled device) sensors in many applications and is designed for programmable high frame rate speeds, allowing better analysis and reaction to events. In addition, Newsight’s innovative NSI5000, currently in development with TowerJazz at its fab in Israel, is an integrated LiDAR solution for long-range applications and includes a top DSP (digital signal processor) controller which enables complex calculations for depth and machine vision. NSI5000 is
high accuracy. “We chose TowerJazz for its advanced pixel technology, specially customized for our CMOS image sensor chips addressing very high volume markets. Together with our technology, we were able to demonstrate a 4X better sensitivity to our customers. TowerJazz’s CIS offering is proven in the industry and we are pleased to manufacture locally in Israel with a leader in the global analog foundry space,” said Eli Assoolin, Chief Executive Officer, Newsight Imaging. “With our high-end pixel offering, tailored to specific product and application needs, we are able to provide advanced technology used for high dynamic range CMOS sensors and solutions for the growing LiDAR and automotive markets. We are very happy to work closely with Newsight Imaging to provide market leading solutions and achieve quick time to market. They have shown to be an extremely fast-moving customer and we have a lot of confidence in their success,” said Dr. Avi Strum, TowerJazz Sr. Vice President and GM, CMOS Image Sensor Business Unit
UltraSoC analytics IP selected by Esperanto Technologies for RISC-V many-core parallel processing in AI and ML applications
UltraSoC announced the company’s embedded analytics IP has been selected by Esperanto Technologies for the development of massively parallel and many-core RISC-V SoCs. Esperanto is now integrating UltraSoC’s embedded analytics and debug technology into Esperanto’s high- performance and energy-efficient ‘AI Supercomputer on a Chip’ that employs thousands of 64-bit RISC-V cores, to serve advanced applications in artificial intelligence (AI) and
machine learning (ML). “Esperanto’s goal is to make RISC-V the architecture of choice for the most demanding AI and machine learning applications,” saidDaveDitzel, Founder and CEOof Esperanto. “UltraSoC’s IP will help our users see complex interactions between processors so they can understand what is going on and how to optimize performance better. Developing and debugging software utilizing thousands of RISC-V
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cores will be easier with the advanced analytics that UltraSoC’s IP will provide.” Rupert Baines, CEO of UltraSoC added: “Esperanto is at the leading edge of technology putting thousands of RISC-V cores on a single chip. The track record of its founding group, and its backing from industry leaders like Western Digital, tells you that they are poised to make a big impact with their next chip design. We’re very proud to have been selected to help Esperanto achieve its vision for computing architectures of the future.” Founded by processor industry veteran Dave Ditzel, Esperanto brings together a team of experienced processor and software engineers including some of the top computer scientists, architects and processor experts in the world. As a founding member of the RISC-V Foundation, Esperanto is committed to delivering the best in processing capabilities, and making full use of RISC-V’s power and performance improvements without the baggage of legacy architectures. UltraSoC has taken a leading role within the RISC-V Foundation and provides the industry’s first – and still only – commercial RISC-V debug solution. Esperanto and its customers will benefit from this experience and expertise, with the ability to gain valuable insights and analysis of the operation of an entire SoC and system, not only during chip development, but also throughout the process of system integration and into the in-life phase of a product’s deployment. Handling applications at the forefront of AI and ML technologies requires the application of thousands of 64-bit RISC-V cores in a single chip; Esperanto’s SoCs will deliver Teraflops of scalable parallel processing performance to
developers using them. The company’s high-performance ET-Maxion™ cores are designed to deliver the best single thread RISC-V performance. The ET-Minion™ cores are designed for energy efficiency and high floating point throughput, including vector acceleration. In support of systems based on these RISC-V CPUs, Esperanto will leverage advanced UltraSoC features such as transaction-level bus and status monitoring and static instrumentation to monitor program and execution flow. Such features are part of a broader UltraSoC product offering that supports all industry standard processor architectures, and is particularly powerful in heterogeneous multicore and many-core designs. More broadly, UltraSoC’s IP supports companies in improving design efficiency and giving designers system-wide analysis capabilities, and ultimately helps to improve and maintain power, performance and reliability of customers’ end products. About Esperanto Technologies Esperanto Technologies develops high-performance, energy- efficient computing solutions based on the open standard RISC-V ISA. Esperanto is headquartered in Mountain View, California with engineering sites in the United States, European Union, and Eastern Europe. Esperanto has brought together a seasoned team of experienced processor and software engineers with the goal of making RISC-V the architecture of choice for compute-intensive applications such as Machine Learning. For more information, please visit https://esperanto.ai.
Atomically thin magnetic device could lead to new memory technologies
Magnetic materials are the backbone of modern digital information technologies, such as hard-disk storage. A University of Washington- led team has now taken this one step further by encoding information using magnets that are just a few layers of atoms in thickness. This breakthrough may revolutionize both cloud
computing technologies and consumer electronics by enabling data storage at a greater density and improved energy efficiency. In a study published online May 3 in the journal Science, the researchers report that they used stacks of ultrathin materials to exert unprecedented control over the flow of electrons based on the direction of their
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Latest News spins — where the electron “spins” are analogous to
the junction,” said co-lead author Xinghan Cai, a UW postdoctoral researcher in physics. “Such a gate is central to realizing this type of small-scale data storage.” With up to four layers of CrI3, the team discovered the potential for “multi-bit” information storage. In two layers of CrI3, the spins between each layer are either aligned in the same direction
tiny, subatomic magnets. The materials that they used include sheets of chromium tri-iodide (CrI3), a material described in 2017 as the first ever 2-D magnetic insulator. Four sheets — each only atoms thick — created the thinnest system yet that can block electrons based on their spins while exerting more than 10 times stronger control than other methods. “Our work reveals the possibility to push information storage based on magnetic technologies to the atomically thin limit,” said co-lead author Tiancheng Song, a UW doctoral student in physics. A depiction of the crystal structure of chromium triiodide (CrI3), with chromium atoms shown in purple and iodine atoms in yellow. The black arrows represent the electron “spins,” which are analogous to tiny bar magnets.Tiancheng Song In related research, published April 23 in Nature Nanotechnology, the team found ways to electrically control the magnetic properties of this atomically thin magnet. “With the explosive growth of information, the challenge is how to increase the density of data storage while reducing operation energy,” said corresponding author Xiaodong Xu, a UW professor of physics and of materials science and engineering, and faculty researcher at the UW Clean Energy Institute. “The combination of both works points to the possibility of engineering atomically thin magnetic memory devices with energy consumption orders of magnitude smaller than what is currently achievable.” The new Science paper also looks at how this material could allow for a new type of memory storage that exploits the electron spins in each individual sheet. The researchers sandwiched two layers of CrI3 between conducting sheets of graphene. They showed that, depending on how the spins are aligned between each of the CrI3 sheets, the electrons can either flow unimpeded between the two graphene sheets or were largely blocked from flowing. These two different configurations could act as the bits — the zeroes and ones of binary code in everyday computing — to encode information. “The functional units of this type of memory are magnetic tunnel junctions, or MTJ, which are magnetic ‘gates’ that can suppress or let through electrical current depending on how the spins align in
or opposite directions, leading to two different rates that the electrons can flow through the magnetic gate. But with three and four layers, there are more combinations for spins between each layer, leading to multiple, distinct rates at which the electrons can flow through the magnetic material from one graphene sheet to the other. “Instead of your computer having just two choices to store a piece of data in, it can have a choice A, B, C, even D and beyond,” said co-author Bevin Huang, a UW doctoral student in physics. “So not only would storage devices using CrI3 junctions be more efficient, but they would intrinsically store more data.” The researchers’ materials and approach represent a significant improvement over existing techniques under similar operating conditions using magnesium oxide, which is thicker, less effective at blocking electrons and lacks the option for multi-bit information storage. “Although our current device requires modest magnetic fields and is only functional at low temperature, infeasible for use in current technologies, the device concept and operational principle are novel and groundbreaking,” said Xu. “We hope that with developed electrical control of magnetism and some ingenuity, these tunnel junctions can operate with reduced or even without the need for a magnetic field at high temperature, which could be a game changer for new memory technology.” Additional co-authors are Nathan Wilson, Kyle Seyler, Lin Zhu and David Cobden at the UW; co-corresponding author Wang Yao and Matisse Wei-Yuan Tu at the University of Hong Kong; co-corresponding author Di Xiao and Xiao-Ou Zhang at Carnegie Mellon University; Takashi Taniguchi and Kenji Watanabe at the National Institute for Materials Science in Tsukuba, Japan; and Michael McGuire at the Oak Ridge National Laboratory in Tennessee. The major funder of the research were the U.S. Department of Energy. Part of work was performed at the Research Training Testbeds at the Clean Energy Institute.
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Intel Unveils Drone Software Solutions that Enable Businesses to Unlock Potential of Aerial Data
What’s New: At AUVSI Xponential 2018, Intel disclosed details of Intel ® Insight Platform, a digital asset management system enabling effective aerial data management and analyses. It also demonstrated Intel ® Mission Control – next-generation flight planning software – and new updates for the Intel ® Falcon™ 8+ system: additional payloads for greater data capture, as well as distance hold and distance guard, both features of obstacle avoidance. “We are pleased to announce a suite of new Intel drone technology
plans for commercial surveying, mapping and inspection missions. Flight planning is automated with advanced preset mapping modes. Multiple layers of airspace information are integrated to support flight safety and compliance. Automatic pre- flight safety and system checks help validate the flight plan before the mission is executed. After the mission is completed, the software provides a quick preview of the collected data so the UAV operator can check and verify for adequate area coverage and overlap
Top Image: The Intel High Resolution Imaging Payload captures 42MP images. It is based on the full-frame Sony RX1R II camera and generates highly -detailed inspection data. Intel offers updates to its Intel Falcon 8+ system during the AUVSI Xponential event from April 30 to May 3 in Denver, Colorado. (Credit: Intel Corporation)
at Xponential. Now companies can come to one supplier, and a name they know and trust, for their hardware and software needs – providing them with more tools to capture critical information about their assets, process and analyze it, and make insightful decisions for their business.” – Anil Nanduri, vice president and general manager, Intel drone team How It Manages Data: First announced and demonstrated at InterDrone in September 2017, the Intel Insight Platform is now deployed to strategic enterprise customers across several verticals. The Intel Insight Platform is a cloud-based digital asset management system that enables customers to store, share and manage the rich data that commercial drone systems collect. With that aerial data, Intel Insight Platform can generate 2D and 3D models, take measurements, enable sharing and collaboration across teams, and run data analytics. Intel worked with Delair* in building capabilities that make Intel Insight Platform ready for enterprise customers. How It Plans Flights: Intel Mission Control Software is the next generation of flight planning, project management and data handling for the Intel Falcon 8+ system. It is designed to increase workflow efficiency and enhance automation of drone flights for commercial missions. Intel Mission Control enables Intel Falcon 8+ drone operators to create 2D and 3D flight
and even inspect the quality of individual images in a 3D format. Intel Mission Control Software is currently in beta testing with customers as Intel continues to improve upon the advanced features and capabilities. What It Carries: Intel announced three new payloads designed for inspection, surveying and mapping applications for the Intel Falcon 8+ system. The Intel High Resolution Imaging Payload captures 42MP images with amazing detail and clarity. It is based on the full-frame Sony* RX1R II camera and generates highly detailed inspection data. This payload also supports RTK through a future software upgrade. The Intel Imaging Payload and Intel Dual Imaging Payload each support obstacle- avoidance capabilities to help enable safer missions and feature the 20MP Sony UMC-R10C camera. The payloads deliver real color, time-stamped and geo-referenced images for mapping, surveying and inspection. The Intel Dual Imaging Payload has two cameras mounted on one gimbal for simultaneous RGB image capture and thermal imaging. It will be available next quarter. The Intel Imaging Payload along with the Intel High Resolution Imaging Payload will both be available later this quarter. What It Sees: Obstacle avoidance increases safety and reliability of complex missions. The Intel ® RealSense™ technology includes depth-sensing modules that compute raw
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image streams into high-resolution 3D depth maps. The obstacle-avoidance feature on the Intel Imaging and Intel Dual Imaging payloads enables the Intel Falcon 8+ drone to detect and avoid potential obstacles or hazards and has the ability to maintain and hold a set distance from an asset during inspection. Within a mission, objects are continually identified in real time and a 3D depth map of the environment is maintained in memory. How It Leads in Safety: To further demonstrate Intel’s leadership
and commitment to safe operations of unmanned aerial systems, the world’s first UL 3030 certification was presented to the Intel Falcon 8+ drone. The UL 3030 certifies the electrical safety protection of batteries, chargers and end products against electric shock and fire. This includes evaluating and testing for enclosure strength, functional safety requirements, motor safety, and protection against injury, performance and autonomous features. The Intel Falcon 8+ drone is the first to earn this certificate.
5GAA, Audi, Ford and Qualcomm Showcase C-V2X Direct Communications Interoperability to Improve Road Safety
(V2V) collision avoidance and improved road safety without any dependency on cellular operator network involvement, credentials or coverage. The organizations also unveiled initial field test results showing a significant range, reliability and performance advantage of C-V2X direct communications,
Superior Performance, Synergies with Telematics Units and Evolutionary Path Towards 5G Offers Greater Potential to Save Lives; World’s First Showcase Across Vehicle Manufacturers Shows Readiness for Industry Deployment as Early as 2020
5G Automotive Association (5GAA), Audi AG, Ford Motor Company and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announced today the world’s first demonstration for Cellular Vehicle-to-Everything (C-V2X) direct communications technology operating across vehicles from different manufacturers. C-V2X is a global solution for V2X communications to support improved automotive safety, automated driving, and traffic efficiency, and is the only V2X technology based on globally recognized 3rd Generation Partnership Project (3GPP) specifications with ongoing evolution designed to offer forward compatibility with 5G, and leveraging upper layer protocols defined by the automotive industry, including Society of Automotive Engineering (SAE) and the European Telecommunications Standards Institute (ETSI) organizations. The demonstration showcased the benefits of using C-V2X real-time direct communications on the globally harmonized 5.9 GHz ITS spectrum for vehicle-to-vehicle
with more than twice the range and improved reliability compared to 802.11p radio technology. Based on C-V2X’s potential to enhance safety and save lives, the 5GAA, Audi, Ford and Qualcomm Technologies encourage the broad automotive ecosystem to accelerate adoption of C-V2X, which is expected to be deployed as early as 2020. Featuring Audi and Ford vehicles which incorporate the C-V2X technology utilizing the C-V2X chipset fromQualcomm Technologies, the showcase exhibited various scenarios of how C-V2X communications is beneficial for road safety. These scenarios included situations with obstructed or no visibility, including Left Turn Assist and Emergency Electronic Brake Light use cases, in which vehicle-to-vehicle (V2V) communications alerted surrounding vehicles when cars were turning left or braking. Additional use cases were featured, including a vulnerable road user (VRU) demonstration showcasing what can be possible with future vehicle-to-pedestrian (V2P) communications.
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Use cases for vehicle-to-infrastructure (V2I) communication were also demonstrated, which showcased how direct communications can work closely with traffic signal controllers to ensure reduction in carbon emissions and optimization of traffic efficiency in cluttered intersections and dense environments. C-V2X is supported by a broad automotive ecosystem, that includes the fast-growing global organization 5GAA, which currently has over 80 members comprised of leading automakers, Tier-1 suppliers, software developers, mobile operators, semiconductor companies, test equipment vendors, telecom suppliers, traffic signal suppliers and road operators. Designed with a focus on security, C-V2X benefits from established security transport layers and application protocols defined by the automotive standards communities, including SAE, ETSI, International Standards Organization (ISO), and Institute of Electrical and Electronics Engineers (IEEE) 1609, and Qualcomm’s decades of investment in cellular technologies. C-V2X solutions are expected to be more cost efficient and economical over competing technologies as this functionality gets integrated into the base cellular modem product that automakers equip in every vehicle. “We are excited to witness this monumental breakthrough in the evolution of C-V2X and the growing momentum behind this life-saving technology,” said Christoph Voigt, Chairman of 5GAA. “After years of development supported by leading carmakers, technology providers and the automotive ecosystem at large, C-V2X is ready to improve road safety with deployment in production vehicles and road infrastructure as soon as 2020, leveraging a state- of-the-art proven radio with decade-long developed automotive software protocols. This unique showcase firstly demonstrates the commitment of our members to ensure that the potential of the C-V2X technology is realized and represents a key step towards the next generation of cellular technology, 5G.” “C-V2X is critical to enhance road safety and also gives us a look into the key role that vehicle-to-vehicle and 5G wireless
technologies play in the future of Audi and the automotive industry in general to support autonomous driving,” said Gerhard Stanzl, Head of Predevelopment Smart Mobility and Machine Learning, Audi Electronics Venture. “This interoperability demonstration marks a major milestone on the road to safer driving and we look forward to working alongside the extensive automotive ecosystem in helping accelerate C-V2X deployment globally.” “With its ability to safely and securely connect vehicles, along with its evolution into 5G, C-V2X is integral to Ford’s vision for transportation and the cities of the future in which all cars and infrastructure collaborate speaking the same language,” said Don Butler, Executive director connected vehicle platform and product, Ford Motor Company. “We are very encouraged by preliminary test results which support our belief that C-V2X has superior V2X communication capabilities. We are also very pleased to see strong ecosystem support of product roadmaps that accelerates time to market for C-V2X.” “At Qualcomm Technologies, we are committed to accelerating automotive innovation and enabling carmakers to deliver safe and connected vehicles, and we strongly believe that C-V2X can offer significant improvements in road safety for people worldwide,” said Nakul Duggal, vice president of product management, Qualcomm Technologies, Inc. “After years spearheading the development of C-V2X we are ready for its rollout in collaboration with leading automakers such as Audi and Ford, and the larger auto industry.” 5GAA, Audi, Ford and Qualcomm Technologies are scheduled to showcase another live C-V2X interoperability demonstration at the upcoming Intelligent Transportation Society of America (ITS-A) World Meeting in Detroit from June 4-7. Initial test results showing significant lifesaving benefits of C-V2X direct communications compared against the 802.11p solution can be found here. For more information on C-V2X please visit here.
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Researchers 3D print electronics and cells directly on skin
In a groundbreaking new study, researchers at the University of Minnesota used a customized, low-cost 3D printer to print electronics on a real hand for the first time. The technology could be used by soldiers on the battlefield to print temporary sensors on their bodies to detect chemical or biological agents or solar cells to charge essential electronics.
from other 3D-printing inks that need to cure at high temperatures (up to 100 degrees Celsius or 212 degrees Fahrenheit) and would burn the hand. To remove the electronics, the person can simply peel off the electronic device with tweezers or wash it off with water.
In addition to electronics, the new 3D-printing technique paves the way for many other applications, including printing cells to help those with skin diseases. McAlpine’s team partnered with University of Minnesota Department of Pediatrics doctor and medical school Dean Jakub Tolar, a world-renowned expert on treating rare skin disease. The team successfully used a bioink to print cells on a mouse skin wound, which could lead to advanced medical treatments for those with skin diseases. “I’m fascinated by the idea of printing electronics or cells directly on the skin,” McAlpine said. “It is such a simple idea and has unlimited potential for important applications in the future.” In addition to McAlpine and Tolar, the University of Minnesota team includes Ph.D. students Zhijie Zhu and Xiaoxiao Fan and postdoctoral researcher Shuang-Zhuang Guo from the Department of Mechanical Engineering in the College of Science and Engineering; and research staff Cindy Eide and Tessa Hirdler from the Department of Pediatrics in the Medical School. This study was funded by grants from the National Institutes of Health and state-funded Regenerative Medicine Minnesota. In addition, the first author of the paper Zhijie Zhu was funded by a University of Minnesota Interdisciplinary Doctoral Fellowship. To read the full research paper entitled “3D Printed Functional and Biological Materials on Moving Freeform Surfaces,” visit the Advanced Materials website.
Researchers also successfully printed biological cells on the skin wound of a mouse. The technique could lead to new medical treatments for wound healing and direct printing of grafts for skin disorders. The research study was published today on the inside back cover of the academic journal Advanced Materials. “We are excited about the potential of this new 3D-printing technology using a portable, lightweight printer costing less than $400,” said Michael McAlpine, the study’s lead author and the University of Minnesota Benjamin Mayhugh Associate Professor of Mechanical Engineering. “We imagine that a soldier could pull this printer out of a backpack and print a chemical sensor or other electronics they need, directly on the skin. It would be like a ‘Swiss Army knife’ of the future with everything they need all in one portable 3D printing tool.” One of the key innovations of the new 3D-printing technique is that this printer can adjust to small movements of the body during printing. Temporary markers are placed on the skin and the skin is scanned. The printer uses computer vision to adjust to movements in real-time. “No matter how hard anyone would try to stay still when using the printer on the skin, a person moves slightly and every hand is different,” McAlpine said. “This printer can track the hand using the markers and adjust in real-time to the movements and contours of the hand, so printing of the electronics keeps its circuit shape.” Another unique feature of this 3D-printing technique is that it uses a specialized ink made of silver flakes that can cure and conduct at room temperature. This is different
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Customized cybersecurity: encrypting unique codes on chips with maskless lithography
Laurent Pain, Isabelle Servin, CEA-Leti
Leti, a French research institute at CEA Tech, and Mapper Lithography BV, the leading provider of maskless direct-write lithography equipment for the semiconductor industry, recently announced a low-cost cybersecurity breakthrough that allows encrypting unique codes directly on individual chips. This technology provides a novel way to secure private information, devices, business exchanges, cloud data, etc., in the massive data exchanges enabled by the Internet of Things (IoT). Several technological solutions, such as software or fuse or physical unclonable function (PUF) strategy, are available, but present their own safety limitations. Indeed, none of these solutions can directly and deeply spread security codes into the hard IP core of the devices, as this direct write solution significantly enhances anti-piracy
efficiency in the final product. The encryption approach offered by maskless lithography opens a new technology era in the field of cyber- security. Mapper Lithography has introduced its first pilot R&D platform, the FLX–1200 platform, which is initially designed to reach throughput of one 300mm wafer per hour (wph) for a wide range of technologies, from mature nodes down to 28nm. The FLX-1200 exposure tool is based on massively parallel electron beam direct-writing (MP EBDW) strategy, using simultaneously 65,000 low- power individually controllable electron beamlets, each writing its own part of the IC design. The wafer is exposed one column of fields at a time and always in the same direction. While the wafer is moved under the column, each beamlet is deflected at a high
frequency perpendicular to the scan direction. The deflection range is around 2µm. Each column of fields is aligned separately, by scanning dedicated alignment targets to calibrate the exact position of the wafer with respect to the beamlets (Figure 1). Mapper’s technology scales by clustering several exposed units connected to a resist process track. That forms a litho cell working at the same performance level with higher throughput capability. Photomask free This lithography solution is based on the direct-write concept, and therefore no photomask is required to directly pattern the chip design onto the wafer. The use of massively parallel electron- beam writing allows reaching high-throughput benefit compared to current single- electron-beam systems (1wph
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