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www.microchip.com/powerpromoMicrochip Technology now offers an integrated switching power module designed
specifically for height-constrained telecom, industrial and solid-state drive (SSD)
applications. These products come in an impressive thermally-enhanced package that
incorporates inductors and passive components into a single, molded power converter.
The slim packages simplifies board design, saves space and eliminates concern over
passive components that may introduce unexpected electromagnetic interference (EMI).
Highlights
Variety of module package offerings (small to large, fit to application)
High power density with integrated magnetic and passive components
Performance (efficiency, thermal, transient response)
Reliable (power and thermal stress tested)
Low EMI (CISPR 22 Class B ratings on modules)
KNOWLEDGE IS POWER
Massive power density in the smallest packages