New-Tech Europe | September 2016

HIGH DENSITY ARRAYS

• (1,27 mm x 1,27 mm) .050" x .050" grid array for maximum grounding and routing flexibility

• Up to 500 single-ended I/Os or 125 differential pairs (using Samtec recommended pin assignments)

• Rugged Edge Rate® contact system less prone to damage when “zippered” to unmate

• 0,80 mm pitch system for up to 50% board space saving

• Right angle and low profile systems

• Ultra high density, ultra-low profile compression arrays

Samtec Israel • 21 Bar-Kochva St. • Concord Tower • B’nei Brak, Israel 51260

Tel: +972 3 7526600 • Fax: +972 3 7526690 • E-mail:

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