Previous Page  73 / 84 Next Page
Information
Show Menu
Previous Page 73 / 84 Next Page
Page Background

mputers

n

New Products

Motion

Automotive

Motion

IoT

Communication

Computers

Computers

Components

Electro Optic & Camera

Packaging & Production

Automotive

New Products

Motion

Automotive

Motion

IoT

Communication

Computers

C

Components

Electro Optic & Camera

Packaging & Producti

Automotive

New Products

to deliver maximum performance and an optimal

user experience when testing 5G antennas and other

electronic devices at millimeter wave frequencies

extending from 18GHz to 75GHz and beyond,” said

Olivier Pajona, chief scientist and general manager at

Ethertronics, an AVX Group Company.

Ethertronics’ ETH-MMW-1000 Millimeter Measurement

System employs far-field, spherical technology

with myriad measurement capabilities, including

oversampling, gain, directivity, efficiency, beam width,

cross polar discrimination, 3-D radiation pattern,

radiation pattern in any polarization, effective isotropic

radiated power (EIRP), total radiated power (TRP),

effective isotropic sensitivity (EIS), and total isotropic

sensitivity (TIS). Each measurement frequency has a

dedicated path associated with a common amplification

stage, but combinations of several mmWave frequency

bands, including 18–26.5GHz, 26.5–40GHz, 33–50GHz,

40–60GHz, 50–67GHz, and 50–75GHz, are possible.

The number of measurement probes can also be

optimized to hasten measurement time. The system

requires a minimum of two measurement probes to

cover H and V polarizations, but can accommodate up

to 12 probes on the ring positioner.

The mobile Millimeter Measurement System is

compatible with test devices up to 45cm in size and 10kg

in weight. Lead-time for the Millimeter Measurement

System is currently three months.

TE Connectivity extends M12 portfolio

with the L-code PCB/panel-mount power

connectors

TE Connectivity (TE), a world leader in connectivity and

sensors, has extended its portfolio of M12 connectors

to include L-code PCB/panel types that offer a compact

high-power solution for automation devices.

“Our new connectors take up 40 percent less space

than Mini 7/8 connectors traditionally used for high

power connections, allowing for more freedom and

flexibility when designing machines and systems,” says

Ruud van den Brink, TE’s product manager, Industrial

Communication Europe. He points out that M12 L-code

power connectors, an extension of the current M12

IEC standard, have been selected by PROFINET user

organization PROFIBUS & PROFINET International as

the standard for 24-volt power supply systems used in

PROFINET devices.

The new connectors handle currents as high as 16A per

pin – the highest in TE’s M12 family – providing reliable

and efficient power distribution. They are IP67 rated,

which means they are protected from dust and resist

water immersion at depths of up to one meter for 30

minutes.

L-code PCB/panel-mount M12 power connectors are

available through TE’s global distribution network,

which provides customers with short lead-times and

fast responses for technical support.

Toshiba Memory Europe Unveils

Industry’s First UFS Ver. 3.0 Embedded Flash

Memory Devices

Toshiba Memory Europe GmbH (TME) has started

sampling the 128GB[1] version of the industry’s first

Universal Flash Storage (UFS) Ver. 3.0 embedded flash

memory devices. The new line-up utilizes the company’s

cutting-edge 96-layer BiCS FLASH™ 3D flash memory

and is available in three capacities: 128GB, 256GB and

512GB[2]. With high-speed read/write performance

and low power consumption, the new devices are ideal

for applications such as mobile devices, smartphones,

tablets, and augmented/virtual reality systems.

Consumers continue to demand increasingly higher

New-Tech Magazine Europe l 73