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20 l New-Tech Magazine Europe
2016 Embedded World Exhibition in Nuremberg,
Germany was the world's biggest exhibition of its
kind for the international embedded community.
As I traveled through the aisles I saw a variety
of new products that just got launched by the
hundreds of exhibitors, I chose a few to focus on
in this article.
MSC
MSC introduced us for the first time with the SMARC 2.0. The
SMARC 2.0 module MSC SM2S-IMX6 is based on the NXP™
i.MX6 system-on-chip and ranges from quad-core to single-
core performance. The MSC SM2-MB-EP1 platform board
comes in the popular Mini-ITX format and allows access
to most features of the new SMARC 2.0 standard. MSC
Technologies is a member of the SGeT (Standardization Group
for embedded Technologies) and has worked with other
leading embedded companies to create SMARC 2.0 (Smart
Mobility ARChitecture) which is intended to be the best and
most future-proof standard for small form-factor embedded
modules, and equally suited for ARM/RISC CPUs and x86
processors. MSC is the first to launch the new SMARC 2.0 and
more companies are on the way to release similar products.
Congatec
Congatec, a leading technology company for embedded
computer modules, single board computers (SBCs), embedded
design & manufacturing (EDM) services presented at its booth
its new innovations. Later at the press conference Congatec
appointed a design service company named Technagon
as a sales technology partner to strengthen its portfolio of
customer-specific system design & manufacturing services for
point-of-sale (POS) and ticketing systems, vending machines
and systems, digital signage and eMobility applications.
Samtec
At Samtec's booth I got to see some of their innovations
starting from the advanced IC Packaging division, the Z-Ray
®
micro array interposers which are ultra-low profile, high
density, highly customizable solutions for board-to-board, IC-
to-board, and cable-to-board applications. I was introduced
to the FireFly™ Micro Flyover System™, the first interconnect
system that gives a designer the flexibility of using micro
footprint optical and copper interconnects interchangeably
with the same connector system.
NXP
NXP’s Smarter World Tour Started its journey in Europe, Paris
on Jan.07. The Smarter World Tour is a highly visible, 36 ton,
Hila Bazari, New-Tech Europe
New-Tech reports from
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