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LETI AND FRAUNHOFER TEAM UP TO STRENGTHEN
MICROELECTRONICS INNOVATION IN FRANCE AND GERMANY
Two leading European research institutes
today announced their new collaboration
to develop innovative, next-generation
microelectronics technologies to spur
innovation in their countries and
strengthen European strategic and
economic sovereignty.
Leti, a research institute of CEA Tech
in Grenoble, France, and the Berlin-
based Fraunhofer Group for Microelectronics, Europe’s largest
R&D provider of smart systems, will initially focus on extending
CMOS and More-than-Moore technologies to enable next-
generation components for applications in the Internet of
Things, augmented reality, automotive, health, aeronautics and
other sectors, as well as systems to support French and German
industries.
The agreement was signed today by Leti CEO Marie Semaria
and Fraunhofer Group for Microelectronics Chairman Hubert
Lakner during Leti Innovation Days, which are marking Leti’s
50th anniversary.
“The ability to, one, develop key enabling technologies that
overcome the formidable technical challenges that our leading
technology companies will face, and, two, transfer them quickly
to industry, is an essential focus for research institutes and
industrials in France and Germany,” Semaria said. “Building on
our previous, successful collaborations, Leti and the Fraunhofer
Group for Microelectronics will bring our complementary
strengths to the task of keeping
France and Germany’s microelectronics
industries in the forefront – and offer our
innovations across Europe.”
“Micro-/nanoelectronics and smart
systems are key enabling technologies
for the economic success of Europe,
especially in France and Germany. Thus,
Europe can no longer afford to scatter its research competences.
For the benefit of industry, joining forces will become more and
more important, not only for industry but also for RTOs,” Lakner
explained. “The new cooperation agreement will be the starting
point for a strategic research cooperation of the two countries
in order to jointly support the upcoming EC initiative, Important
Project of Common European Interest (IPCEI), on micro- and
nanoelectronics.”
Specific R&D projects that the collaboration will focus on include:
Silicon-based technologies for next-generation CMOS processes
and products, including design, simulation, unit process and
material development as well as production techniques
Extended More than Moore technologies for sensing and
communication applications
Advanced-packaging technologies.
The second phase of the collaboration may be expanded with
additional academic partners and other countries, as needed.
memory experience, we’ve optimized the 3D NAND
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14 l New-Tech Magazine Europe