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new products
The AURIX TC3xx family will be highly scalable and offer
Flash memory sizes of up to 16 MByte and more than 6
MByte of integrated RAM. Compared to today’s AURIX
TC2xx microcontrollers with up to three TriCore™ cores,
the TC3xx multicore architecture provides up to six
TriCore cores, each with a full clock frequency of 300
MHz. Four of the six cores feature an additional lockstep
core enabling a new level of ISO 26262 functional safe
computational power on a single integrated device: Up
to 2400 DMIPS performance supporting applications
classified ASIL-D, compared to up to 740 DMIPS with
the previous AURIX architecture.
The performance increase and the reuse of existing
safety concepts allow automotive system suppliers
to reduce development costs by 20 percent and
improve time-to-market. Also, more functions can
now be implemented on a single microcontroller, such
as powertrain and chassis domain control and next
generation radar and fusion algorithms.
Automotive radar systems ranging from blindspot
monitoring to advanced front radar specifically benefit
from the capabilities of the AURIX TC3xx family. TC3xx
microcontrollers will feature a radar processing sub-
system with up to two dedicated Signal Processing
Units running at 300 MHz enabling computation of next-
generation radar algorithms on a single chip. In addition,
radar chips can be seamlessly connected to AURIX via
a high-speed digital radar interface.
AURIX TC3xx does not compromise on security. A new
version of the programmable Hardware Security Module
(HSM) is available across the family: it supports to
better secure on-board communications and to prevent
hardware manipulation, such as motor tuning. New
asymmetric cryptography accelerators are integrated
into the HSM hardware that helps to achieve full EVITA
support. TheAURIX TC3xx facilitates fast software-over-
the-air updates to protect against software hijacking.
As a host controller in gateway and telematics
applications, AURIX TC3xx microcontrollers support
the latest communications interfaces. They feature a
Gigabit Ethernet interface, up to 12 CAN-FD channels
compliant to ISO11898-1 and up to 24 LIN channels. An
additional eMMC interface for external Flash interfacing
enables local data storage supporting software-over-
the-air update concepts.
Availability
The second generation AURIX TC3xx family is
compatible with the previous AURIX TC2xx generation.
Engineering samples of the 300 MHz lead device, the
TC39xx, with 16 Mbyte of embedded Flash will be
available in BGA-516 package and BGA-292. General
sampling is scheduled to start in the first quarter of
2017. Qualification of the first product is planned in the
first quarter of 2019.
Industry First Intelligent Charge Controller
from ON Semiconductor Meets the Exacting
Demands of Next Generation Power Banks
ON Semiconductor (Nasdaq: ON ), driving energy
efficient innovations, has introduced a highly integrated
single chip power bank solution for the development
of next generation Li-Ion powered products. The
LC709501F total Li-Ion battery solution offers broad
power and voltage/current output range of 5 volt (V), 9 V
and 12 V operation, with a maximum charge/discharge
capability of up to 30 watts (W) through simple FET
selection.
The LC709501F determines what type of device
is connected and automatically selects the fastest
available method for charging. Advanced users can
even reprogram the LC709501F to support custom
charge/discharge profiles, as well as USB Type-C and
PD Policy Engine functions. This single-chip solution
includes integrated fuel gauge function, configurable
I/O, LED drivers, I2C interface, and pre-drivers for
external power MOSFETs, providing system flexibility.
A design reference kit is available to realize fast time to
market. The LC709501F supports various output power
levels up to 30 W, by changing external MOSFETs. In
addition, there is an integrated USB 2.0 Full Speed host
controller.
The LC709501F’s USB host controller supports
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