12 / 84
LatestNews
World-leading nano-electronics
research center imec and
Synopsys, Inc. (NASDAQ: SNPS)
announced an interconnect
resistivity model to support
the screening and selection of
alternative interconnect metals
and liner-barrier materials at the
7nm node and beyond. With the
continued scaling of advanced
process nodes, the impact of
parasitic interconnect resistance on the switching delay of
standard cells rises considerably. The new model developed
through this collaboration enables the evaluation of interconnect
material and process options through simulations in the early
stages of technology development, when wafer data is not
available, and in the process optimization and integration stages
of technology development, where it reduces expensive and
time-consuming wafer-based iterations.
Imec and Synopsys Collaborate on Interconnect Resistivity
Model to Enable Early Screening of Interconnect Technology
Options at Advanced Nodes
automatically be sent to the medical centre If you
apply this sensor to your sports gear, you can be served
more detailed and improved training service for yourself.
For example, the sensor detects the pressure of your hands
on the golf club as well as the position of your hands. Then,
it sends the information to your smartphone to help you
find the perfect grip.
You can attach these sensors to automotive for safety and
convenience. The sensor under-stands your posture, body
type and weight to automatically correct height of car-seat
or pressure of airbag.
If you apply the sensor to a chair, it measures the pressure
on the seat and sends the data to you. You can use this
information to correct your posture or analyze your study
patterns.
The company developed special polyurethane material that
is sensitive to the pressure and has great elasticity, and
inserted the material between the electronic fibers. When
“We have already released to
our partners a number of sets
of model parameters related
to various liner/barrier systems
for Cu metallization or to
alternative metals, such as Ru
and Co, which they will use to
screen metallization options for
next-generation
interconnect
technologies,” stated Dan Mocuta,
director, Logic Device and Integration at imec.
To use the new resistivity model, customers simulate the
fabrication of the interconnect structure in 3D using the Synopsys
process emulation tool Process Explorer, and then simulate the
wire and via resistance in Raphael, the Synopsys gold standard
interconnect field solver. This simulation flow accounts for the
impact of layout rules, multi-patterning flows, and process-
induced 3D features on the resistance of any conductive net
in a multilayer interconnect stack, thereby predicting the
an external force is applied to the sensor, electric poles
inside the fiber detect the deformation to de-termine the
pressure.
This product is very durable in various environments. It
works normally over 240 hours from 40 degrees below zero
to 80 above zero. A sensor remains functional even after
the average 70-kg man sit on the sensor 100,000 times.
Changhwan Kim, Head of the LG Innotek’s R&D Center
said, “We tried to break away from the previous method
and attempt new methods to develop innovative products.”
He also said, “We will continue to develop materials and
components in various fields to provide new experiences
to our customers.”
According to BBC Research & Consulting, a global market
research institute, the global pressure sensor market is
expected to grow from USD 11.5 billion in 2014 to USD
16.3 billion in 2019. The annual average growth rate is
expected to be 7.2% between 2014 and 2019.
12 l New-Tech Magazine Europe