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new products
66 l New-Tech Magazine
Toshiba Launches
Photorelays for
Semiconductor Testers in
Industry’s Smallest Package
Toshiba Corporation’s (TOKYO:
6502) Storage & Electronic
Devices
Solutions
Company
today announced the launch
of photorelays in the industry's
smallest[1] package. Shipments
start from today.
The new product, "TLP3406S",
utilizes the industry's smallest
package for photorelays, the
Toshiba-developed
S-VSON4
package. Compared to Toshiba’s
previous products in a VSON4
package, the new photorelay has
an approximately 22.5%[2] smaller
assembly area, which can contribute
to the development of smaller test
boards and also make it possible to
increase the number of photorelays
on a board to increase density.
Since the new photorelay can drive
large currents of up to 1.5A, in spite
of its small package, it can be used
in device power supplies (DPS) that
make up the power supply circuits
in various testers. As a further
positive, the operating temperature
range has been enhanced from
85 degrees Celsius (max.) to 110
degrees Celsius (max.).
STMicroelectronics
Releases Development
Ecosystem and Adds New
Devices in Low-Power
STM32L4 Microcontroller
Series
STMicroelectronics has introduced
the development ecosystem for its
latest low-power, high-performance
STM32L4 microcontrollers (MCU)
and expanded the series with five
new product lines comprising a
range of package and memory-
density options. STMicroelectronics
Releases Development Ecosystem
and Adds New Devices in Low-
Power STM32L4 Microcontroller
Series
The expanded STM32L4 ecosystem
builds on ST’s free and easy-to-
use STM32Cube platform. This
comprises the STM32CubeMX
initialization-code generator and
configurator with easy-to-use power
estimation for ultra-low-power
design, and the STM32CubeL4
package that contains middleware
components, Nucleo-32 Board-
Support Package (BSP), Hardware
Abstraction Layer (HAL), and Low-
Layer APIs (LLAPIs). For a quick
start to new projects, the slim-form-
factor NUCLEO-L432KC board –
the first Nucleo-32 board to integrate
an MCU in the tiny QFN32 package
- includes an STM32L432KCU6
device (UFQFPN32) and provides
direct access to ARM® mbed™
online tools. Its Arduino Nano
pin layout simplifies function
extensions, and the integrated
ST-Link
debugger/programmer
supports mass storage and allows
probe-free debugging.
Five new STM32L43x and
STM32L44x MCU product lines
comprise variants with versatile
combinations of an integrated
USB controller, an LCD controller,
and cryptography for security-
conscious applications. Up to
256KByte of Flash and low-pin-
count-package choices make them
ideal for cost-sensitive applications.
The new devices also offer rich
digital peripherals including a
True Random-Number Generator
(TRNG) and smart analog features
such as a 12-bit 5Msample/s ADC,
internal voltage reference, and
ultra-low-power comparators.
All devices deliver the advantages
of ST’s innovative low-power
technology,
which
includes
FlexPowerControl
(FPC)
with
features such as separate supply-
voltage domains for gating power
individually to analog peripherals,
USB circuits, and I/Os. Batch-
Acquisition Mode (BAM) enables
energy-efficient data capture and
seven reduced-power modes with
further sub-modes maximize energy
savings in a wide range of operating
conditions.
ST’s
low-power
technologies,
combined with the performance of
the 32-bit ARM Cortex®-M4F core,
ensure high efficiency according
to EEMBC™ ULPBench™ tests.
The STM32L433 is certified at 177
ULPMark™-CP[1] at 3.0V, tested
without the aid of a step-down
converter. Aided by ST’s innovative
ART
Accelerator™,
outright
performance is also high at 273
CoreMark®.
The new devices are available