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new products
New-Tech Magazine l 71
that do not necessarily require
complex out-of-band management
or virtualization, modules based on
the Intel® Core™ i3 processor and
the Mobile Intel® HM170 chipset
are also available.
The feature set in detail
The new conga-TS170 modules
are equipped with the latest 6th
generation 14nm Xeon® v5 and
Intel® Core™ processors. They
feature a TDP of 25-45W, up to
8MB smart cache and super-fast
2133 DDR4 memory up to 32 GB,
implemented as ECC memory for
safety-critical applications in the
Intel® Xeon variants. For energy-
efficient 24/7 operation, the new
modules support disconnected
standby in place of the legacy S3
mode. With disconnected standby,
switching from energy-saving sleep
mode to full performance takes
less than half a second; as a result,
systems can go into sleep mode
more frequently without affecting
usability and responsiveness.
The integrated 9th generation Intel®
HD Graphics 530 supports DirectX
12 for faster Windows 10 based 3D
graphics on up to 3 independent 4K
(3840 x 1260) displays via HDMI
1.4, DVI or DisplayPort 1.2. For
legacy applications, a dual-channel
LVDS output and optional VGA
are available. Thanks to hardware
support for the decoding as well as
the encoding of HEVC, VP8, VP9
and VDENC, it is now possible to
stream HD video energy-efficiently
in both directions.
In addition to PCI Express Gen
3.0 Graphics (PEG), the choice of
available I/O interfaces includes 8x
PCI Express Gen 3.0 lanes, 4x USB
3.0, 8x USB 2.0, LPC and I²C. SSD,
HDD and BluRay mass storage
can be connected via 4x SATA 3.0,
including RAID 0, 1, 5, 10 support.
All major Linux and Microsoft
Windows operating systems are
supported, including Windows 10.
A comprehensive set of add-ons for
easier design-in – such as cooling
solutions, carrier boards and starter
kits – rounds out the offering.
STMicroelectronics
Releases Your Creativity in
Showcase of Solutions
around STM32, Secure
Microcontrollers, and Near
Field Communication
Free hands-on workshops and
technical seminars at Embedded
World in Nuremberg, Germany (Hall
4A-138, Feb 23-25 2016) and on
YouTube
At
Embedded
World
2016
in
Nuremberg,
Germany,
STMicroelectronics will present
a broad range of solutions for
embedded designs across the full
range of applications, including
industrial, medical, consumer, and
automotive. The comprehensive
showcase will include demos,
technical seminars, and hands-on
workshops, hosted by experts who
can help attendees release their
creativity with ST’s latest embedded
technologies, products, and tools.
Videos, produced during the event,
will be available from February
24, 2016 at
www.youtube.com/stonlinemedia/EW2016
ST invites Embedded World 2016
attendees to participate in on-booth
technical conferences or go into
more depth on products and tools
during practical workshops running
throughout the exhibition. ST will
give away hundreds of valuable and
easy-to-use development boards
and other prizes, including BB-8™
by Sphero, an app-enabled Droid™
powered by the STM32F3 ARM®
Cortex®-M4 microcontroller, during
various activities.
Among the demonstrations planned
for Embedded World attendees are:
The newest members of the
STM32 ARM Cortex-M MCU family,
including new 14-pin STM32L0
devices, smaller derivatives of the
STM32L4, and extensions of the
STM32F4 and STM32F7 series;
A member of the LoRa® Alliance,
ST will demonstrate the LoRa
technology1 on STM32 MCUs
and distribute LoRa combo
packs (STM32L0 Nucleo +
SX1276MB1LAS
shield
from
Semtech) to interested attendees;
Application solutions around the
STM32 including connectivity,
graphics, motor control, ARM
mbed™ OS, Apple HomeKit™, and
more;
The STM32 Open Development
Environment, which provides a
flexible, easy, and affordable way
to develop innovative devices and
applications;
The full NFC portfolio, including
tags, dynamic tags, readers, and
transceivers;
A new security module for securing
connected devices;
Solutions that include wireless
charging, new innovative sensors,
wireless
connectivity,
MEMS
microphones, and micro-power
analog, to complement embedded
designs;
Flightsense™ sensor family for
ranging, user detection, and gesture
control;
Embedded solutions for automotive
applications that include the first
Power Architecture™ MCU with
ISO CAN FD (Flexible Data Rate)