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new products

New-Tech Magazine l 71

that do not necessarily require

complex out-of-band management

or virtualization, modules based on

the Intel® Core™ i3 processor and

the Mobile Intel® HM170 chipset

are also available.

The feature set in detail

The new conga-TS170 modules

are equipped with the latest 6th

generation 14nm Xeon® v5 and

Intel® Core™ processors. They

feature a TDP of 25-45W, up to

8MB smart cache and super-fast

2133 DDR4 memory up to 32 GB,

implemented as ECC memory for

safety-critical applications in the

Intel® Xeon variants. For energy-

efficient 24/7 operation, the new

modules support disconnected

standby in place of the legacy S3

mode. With disconnected standby,

switching from energy-saving sleep

mode to full performance takes

less than half a second; as a result,

systems can go into sleep mode

more frequently without affecting

usability and responsiveness.

The integrated 9th generation Intel®

HD Graphics 530 supports DirectX

12 for faster Windows 10 based 3D

graphics on up to 3 independent 4K

(3840 x 1260) displays via HDMI

1.4, DVI or DisplayPort 1.2. For

legacy applications, a dual-channel

LVDS output and optional VGA

are available. Thanks to hardware

support for the decoding as well as

the encoding of HEVC, VP8, VP9

and VDENC, it is now possible to

stream HD video energy-efficiently

in both directions.

In addition to PCI Express Gen

3.0 Graphics (PEG), the choice of

available I/O interfaces includes 8x

PCI Express Gen 3.0 lanes, 4x USB

3.0, 8x USB 2.0, LPC and I²C. SSD,

HDD and BluRay mass storage

can be connected via 4x SATA 3.0,

including RAID 0, 1, 5, 10 support.

All major Linux and Microsoft

Windows operating systems are

supported, including Windows 10.

A comprehensive set of add-ons for

easier design-in – such as cooling

solutions, carrier boards and starter

kits – rounds out the offering.

STMicroelectronics

Releases Your Creativity in

Showcase of Solutions

around STM32, Secure

Microcontrollers, and Near

Field Communication

Free hands-on workshops and

technical seminars at Embedded

World in Nuremberg, Germany (Hall

4A-138, Feb 23-25 2016) and on

YouTube

At

Embedded

World

2016

in

Nuremberg,

Germany,

STMicroelectronics will present

a broad range of solutions for

embedded designs across the full

range of applications, including

industrial, medical, consumer, and

automotive. The comprehensive

showcase will include demos,

technical seminars, and hands-on

workshops, hosted by experts who

can help attendees release their

creativity with ST’s latest embedded

technologies, products, and tools.

Videos, produced during the event,

will be available from February

24, 2016 at

www.youtube.com/

stonlinemedia/EW2016

ST invites Embedded World 2016

attendees to participate in on-booth

technical conferences or go into

more depth on products and tools

during practical workshops running

throughout the exhibition. ST will

give away hundreds of valuable and

easy-to-use development boards

and other prizes, including BB-8™

by Sphero, an app-enabled Droid™

powered by the STM32F3 ARM®

Cortex®-M4 microcontroller, during

various activities.

Among the demonstrations planned

for Embedded World attendees are:

The newest members of the

STM32 ARM Cortex-M MCU family,

including new 14-pin STM32L0

devices, smaller derivatives of the

STM32L4, and extensions of the

STM32F4 and STM32F7 series;

A member of the LoRa® Alliance,

ST will demonstrate the LoRa

technology1 on STM32 MCUs

and distribute LoRa combo

packs (STM32L0 Nucleo +

SX1276MB1LAS

shield

from

Semtech) to interested attendees;

Application solutions around the

STM32 including connectivity,

graphics, motor control, ARM

mbed™ OS, Apple HomeKit™, and

more;

The STM32 Open Development

Environment, which provides a

flexible, easy, and affordable way

to develop innovative devices and

applications;

The full NFC portfolio, including

tags, dynamic tags, readers, and

transceivers;

A new security module for securing

connected devices;

Solutions that include wireless

charging, new innovative sensors,

wireless

connectivity,

MEMS

microphones, and micro-power

analog, to complement embedded

designs;

Flightsense™ sensor family for

ranging, user detection, and gesture

control;

Embedded solutions for automotive

applications that include the first

Power Architecture™ MCU with

ISO CAN FD (Flexible Data Rate)