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new products
new SLVS-EC interface: “Based on the different quality
improvements, the existing standard interfaces would
reach its limits transferring the high data volumes
at faster speed. SONY has developed the SLVS-
EC standard with 8 lanes. It answers the increasing
demands in resolution and speed and doubles the
maximum output to 18.4 Gbps compared to the second
generation (9.5 Gbps).”
The IMX420 sensor is equipped with four additional
features: The High Conversion Gain (HCG) allows the
acquisition of images with better quality under low light
conditions. This is achieved by increasing the conversion
gain of the pixels while keeping the noise contribution
of the analog circuit constant. Conversely, the Low
Conversion Gain mode (LCG) is used under bright
illumination conditions, being realized by lowering the
conversion gain of the pixel. Dual triggering allows the
possibility of different exposure times and gains in different
regions of interest, to obtain an individual and effective
image acquisition pipeline by using of two external trigger
signals. The Dual ADC can read each pixel with separate
gains. By combining the two images off-the-sensor a high
dynamic range image can be obtained. The self-trigger
feature, detects a change in a the predefined “sensing
area” and acquires an image automatically when this
change passes a certain threshold.
The IMX420 and IMX428, as the first sensor models
featuring SONY’s 3rd generation CMOS Global Shutter
mode, clearly show how the combination of high resolution
and high frame rates, along with Global Shutter read-out
technology boosts imaging quality and speed into new
spheres. Mass production is scheduled around spring
2018, evaluation samples are now available at FRAMOS.
Industry and product experts at FRAMOS are available to
support customers with the integration of these new sensors
in their applications and projects. In addition, FRAMOS
also provides additional services like development support,
customization, and logistics to customers.
CoolMOS™ P7 in SOT-223 combining
performance and ease of use with a cost-
effective package solution
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY)
is expanding its recently launched CoolMOS™ P7
technology with a SOT-223 package. The device has
been developed as a one-to-one drop-in replacement
for DPAK. It is fully compatible with a typical DPAK
footprint. The combination of the new CoolMOS P7
platform with the SOT-223 package is a perfect fit for
applications such as charger for smartphones, laptop
adapters, TV power supply, and lighting.
The new CoolMOS P7 is designed to address needs
of the low power SMPS market. It offers excellent
performance and ease-of-use, allowing designers to
take advantage of improved form factors. It uses a price
competitive Superjunction technology, which results in a
reduced overall Bill of Materials (BOM) on the customer
side.
The SOT-223 package is a cost-effective DPAK
alternative and well established in price sensitive
markets. The thermal behavior of the CoolMOS P7 in
this package was assessed across several applications.
When the SOT-223 was placed on a DPAK footprint,
the temperature increased by a maximum of 2-3°C
compared to a standard DPAK. With a size of the copper
area of 20 mm² or more, the thermal performance was
equal to DPAK.
Composite 38999 connectors from Aerco
save weight without compromising performance
Aerco, the distributor and stockist of electrical and
electronic components servicing hi-rel markets, is
now stocking TE Connectivity (TE)’s DEUTSCH MIL-
DTL-38999 series next generation ACT composite
connectors which deliver up to 40 percent weight
New-Tech Magazine Europe l 69