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Fig. 1: The R&S RTO oscilloscopes’ outstanding RF

characteristics and their numerous debugging functions for

MIPI interfaces save time during development

(source: Rohde & Schwarz).

Fig. 2: Overview of the MIPI

specifications’ ecosystem

(source: MIPI Alliance).

for display, camera, audio, video,

memory, power management and

interchip communications, for

example, between baseband chips

and those for RF. In addition, it

was adopted as a physical layer

for protocols outside of the MIPI

ecosystem such as Mobile PCIe

(M-PCIe) and SuperSpeed Inter-

Chip (SSIC) USB.

Several higher-level protocols are

specified for each physical layer (Fig.

3). Presently, the variants based on

C-PHY are barely used. The Unified

Protocol (UniPro) specification

makes it possible to use the

similarities for higher-layer protocols

based on M-PHY for interconnecting

components within mobile devices.

The specification is suitable for

a wide range of components

including application processors,

co-processors and modems, as well

as different types of data traffic

including control signals, user data

transfer and packetized streaming.

The Rohde & Schwarz’ R&S RTOs

for example are oscilloscopes which

the user can configure perfectly

for analyzing MIPI interfaces. They

offer different software options for

analyzing MIPI-based protocols and

their respective physical layers (Fig.

4). The following sections describe

how a R&S RTO effectively handles

all T&M requirements of the MIPI

standards. Although both the D-PHY

and M-PHY MIPI standards serve as

examples, the arguments also apply

to the other MIPI options offered by

the R&S RTO.

Detailed analysis of the

physical layer

When analyzing the physical layer, it

is essential to differentiate between

the DUT’s signal integrity and the

signal fidelity of the test equipment.

Critical oscilloscope parameters

include noise, jitter, DC accuracy

and bandwidth limitations at high

amplification factors. The acquisition

of consecutive LP and HS sequences,

which have very different signaling

levels, is particularly challenging.

They require a high signal integrity

in order to determine signal quality

– especially for the HS components.

Fig. 5 shows the respective voltage

levels.

The better the characteristics of

the T&M instrument at hand, the

greater the tolerance range for

the DUT, resulting in cost savings,

lower scrap rates and more efficient

measurements. Thanks to its

excellent features, this is where the

R&S RTO excels – as shown in the

following examples.

Simultaneous acquisition

of 200 mV and 1.2 V

voltages

When characterizing the physical

layer, a full scale of 1.4 V is used

to acquire the LP signal. 8-bit

A/D converters as used in most

oscilloscopes provide a full-scale

resolution of 5.5 mV/bit. While

this is theoretically sufficient for

measurements on the 200 mV signal

New-Tech Magazine Europe l 33