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new products
capabilities needed so that beamforming techniques can
be explored at not just the Massive MIMO base station,
but also at the multi-antenna UEs to further enhance the
overall system performance of 5G networks.”
Advantest’s New Massively Parallel Test
Fixture Extends the T6391 System’s
Capabilities to Include Chip-on-Film Testing of
Display Driver ICs
New RND440 Type 3 Unit is the First High-Throughput
Test Solution for ICs that Drive LCD Screens in Smart
Phones and Other Electronic Products
MUNICH, Germany – July 24, 2017 – Leading
semiconductor test equipment supplier Advantest
Corporation (TSE: 6857) has introduced the RND440
Type 3 fixture, an optional enhancement on its T6391
display driver IC (DDI) tester that makes the system
capable of massively parallel testing of chip-on-film
(CoF) packages for the latest generation of smart
phone screens. The unit is designed to handle the
growing number of pins on DDIs, the increasing speeds
of interfaces and the highly integrated functions that
enable high-resolution displays.
Mobile devices have evolved from using traditional chip-
on-glass (CoG) ICs to more advanced CoF devices for
several reasons. For example, today’s smart phones
have begun to incorporate OLED screens with rounded
edges, which require CoF packaging.
Along with CoF packaging, other developments are
driving the need for better test solutions. These include
the increasing number of output lines for DDIs used in
smart phones, tablet computers, notebooks and other
products with LCD screens as well as the growing use
of touch embedded display driver ICs (TDDI).
The new RND440 Type 3 fixture can perform both high-
pin-count, high-speed wafer testing and CoF testing,
also called tape testing. It can test all of the electrical
components within a CoF package, which include an IC
mounted on a base film, several passive elements and
signal-input circuitry for receiving and transmitting data.
The fixture works with substrates as large as 440 mm
and its massively parallel testing capability doubles the
throughput of single-device systems on the market.
“The T6391 system is the only highly parallel package
testing system for DDIs and TDDIs,” said Satoru
Nagumo, executive vice president of the ADS Business
Group at Advantest Corporation. “Our test solution
provides users with a huge productivity advantage and
the lowest available cost of test for DDIs and TDDIs in
either production or engineering environments.”
Advantest’s T6391 system uses the same engineering
environment model and TDL programming language
as other members of the T6300 product series while
providing faster data transfer and calculation. It is the
only platform capable of testing touch-sensor functions
and power-management IC (PMIC) functions integrated
in DDIs. It can accommodate high-resolution DDIs with
up to 3,584 pins, sufficient for testing LCDs used in full
high-definition (HD), WXGA and HD720 displays.
A stand-alone T6391 can handle I/O pin frequencies
up to 1.6 gigabits per second (Gbps) while the addition
of a separate measurement module allows it to test
interfaces up to 6.5 Gbps, which will be used in the
DDIs for ultra-high-definition televisions including the 4K
(2160p) generation.
The RND440 Type 3 fixture has already begun shipping
to customers earlier this calendar year.
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