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new products
New-Tech Magazine l 75
can be modularly connected in
series, support a broad spectrum of
cable cross-sections from AWG30
(0.05 mm²) up to a maximum of
AWG12 (3.31 mm²).
All products are directly available
from stock; free-of-charge samples
of the new WR-TBL products can be
sent out on request.
For further information please visit
www.we-online.deERNI Electronics
Introduces Optimized High-
Speed Connectors
Introducing the new ERmet ZDpro
connector family, ERNI Electronic
paves the way to 100G ATCA
systems. The ERmet ZDpro
connectors are an enhancement
of the ERmet ZD family. This high-
speed differential Hard Metric
connector system enables data
rates of >25 Gbit/s and is the first
connector system that meets the
requirements for 100G ATCA
technology. The high data rates and
the improved transmission behavior
are mainly based on the reduced
size of the signal termination,
designed for vias with a diameter
of only 0.30mm. The drilling hole
diameter for the shielding contacts
is specified with 0.46mm. The fact
that the reduction of the vias leads
to an improved crosstalk behavior
was the motivation to the further
miniaturization of the press-fit zone.
The communication technology
showsanongoing trend to increasing
data rates and higher bandwidths.
Theas means there is a strong need
for 100 Gigabit Ethernet (GbE) data
transmission. Typical applications
are the next generation of internet
backbones, data centers or cloud
computing. The new ERmet ZDpro
connectors fulfill the requirements
and challenges of the important
interface between backplane and
daughter cards in these high speed
systems.
The ERmet ZDpro is based on the
mechanical design of the proven
ERmet ZD and ERmet ZDplus
with the same dimensions. ERmet
ZDpro connectors are backwards
mating compatible to ERmet ZD and
ZDplus connectors. This means,
that existing backplane designs do
not need layout changes on the
backplane side, if customers want
to upgrade their daughter cards
in the first step before upgrading
the whole system. Of course the
layout on the daughter cards has
to be modified, if ERmet ZDpro
receptacles are used.
To benefit from the maximum
performance of the new ERmet
ZDpro the usage of backdrilling is
recommended. Decreasing via stub
length and the related “stub effect”
by backdrilling significantly reduces
the reflections and the overall BER
(Bit Error Rate) of the connection.
Availability
The first products of the ERmet
ZDpro family are the 4-pair right
angle female connector and the
related straight male connector
with press-fit termination. Both will
be available starting September
2015. The connectors provide 40
signal pairs. The male connectors
are available with different contact
lengths (3.8mm or 5.3mm). While
the standard variants with 3.8mm
contacts offer an optimized
impedance behavior the male
connectors with 5.3mm contact
lengths provide a 1.5mm higher
wipe length of 2.9mm.
TE Connectivity’s UIC
series connectors, now
available at TTI, provide
robust reliability for railway
and mass transit applications
Toshiba Corporation’s (TOKYO:
6502) Semiconductor & Storage
Products
Company
today
announced the launch of a new
generation of highly efficient
transistor arrays, the TBD62064A
series and TBD62308A series, with
a DMOS FET[1] type sink- output[2]
driver. The new series succeed the
TD62064A series and TD62308A
series of bipolar transistor arrays
that found wide use in applications
including motors, relays and LED
drives, and are the industry’s first[3]
DMOS FET transistor arrays with a
1.5A sink-output driver.
TBD62064APG
Mass production of TBD62064A
series products is scheduled to
start in February 2016. Sample
shipments of TBD62308A series
products start today, with mass
production slated for March 2016.
The new products are equipped
with 4 channels of 50V/1.5A rated
output, suitable for driving constant
voltage unipolar stepping motors.
Toshiba adopted DMOS FET output